MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MPX2100/D
100 kPa
On-Chip Temperature
Compensated & Calibrated
Silicon Pressure Sensors
MPX2100
MPX2101
SERIES
Motorola Preferred Device
The MPX2100 and MPX2101 series device is a silicon piezoresistive pressure sensors
providing a highly accurate and linear voltage output — directly proportional to the
applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain
gauge and a thin–film resistor network integrated on–chip. The chip is laser trimmed for
precise span and offset calibration and temperature compensation.
Features
•
Temperature Compensated Over 0°C to + 85°C
•
Unique Silicon Shear Stress Strain Gauge
•
Easy to Use Chip Carrier Package Options
•
Available in Absolute, Differential and Gauge Configurations
•
Ratiometric to Supply Voltage
• ±
0.25% Linearity (MPX2100D)
Application Examples
•
Pump/Motor Controllers
•
Robotics
•
Level Indicators
•
Medical Diagnostics
•
Pressure Switching
•
Barometers
•
Altimeters
Figure 1 illustrates a block diagram of the internal circuitry on the stand–alone
pressure sensor chip.
VS
3
THIN FILM
TEMPERATURE
COMPENSATION
AND
CALIBRATION
CIRCUITRY
0 to 100 kPa (0 to 14.5 psi)
40 mV FULL SCALE SPAN
(TYPICAL)
BASIC CHIP
CARRIER ELEMENT
CASE 344–15, STYLE 1
DIFFERENTIAL
PORT OPTION
CASE 344C–01, STYLE 1
NOTE: Pin 1 is the notched pin.
X–ducer
SENSING
ELEMENT
2
4
Vout+
PIN NUMBER
Vout–
1
2
Gnd
+Vout
3
4
VS
–Vout
1
GND
Figure 1. Temperature Compensated Pressure Sensor Schematic
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X–ducer is directly proportional to the differential
pressure applied.
The absolute sensor has a built–in reference vacuum. The output voltage will decrease
as vacuum, relative to ambient, is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor increases with increasing
pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly,
output voltage increases as increasing vacuum is applied to the vacuum (P2) side
relative to the pressure (P1) side.
Preferred
devices are Motorola recommended choices for future use and best overall value.
Senseon and X–ducer are trademarks of Motorola, Inc.
REV 6
Motorola Sensor Device Data
©
Motorola, Inc. 1997
1
MPX2100 MPX2101 SERIES
MAXIMUM RATINGS
Rating
Overpressure(8) (P1 > P2)
Burst Pressure(8) (P1 > P2)
Storage Temperature
Operating Temperature
Symbol
Pmax
Pburst
Tstg
TA
Value
400
1000
– 40 to +125
– 40 to +125
Unit
kPa
kPa
°C
°C
OPERATING CHARACTERISTICS
(VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Pressure Range(1)
Supply Voltage(2)
Supply Current
Full Scale Span(3)
Offset(4)
MPX2100A, MPX2100D, MPX2101D
MPX2101A
MPX2100D, MPX2101D
MPX2100A
MPX2101A
Symbol
POP
VS
Io
VFSS
Voff
Min
0
—
—
38.5
37.5
–1.0
– 2.0
– 3.0
—
– 0.25
– 1.0
– 0.5
– 2.0
—
—
–1.0
–1.0
1000
1400
—
—
—
Typ
—
10
6.0
40
40
—
—
—
0.4
—
—
—
—
±
0.1
±
0.5
—
—
—
—
1.0
20
±
0.5
Max
100
16
—
41.5
42.5
1.0
2.0
3.0
—
0.25
1.0
0.5
2.0
—
—
1.0
1.0
2500
3000
—
—
—
Unit
kPa
Vdc
mAdc
mV
mV
Sensitivity
Linearity(5)
MPX2100D
MPX2100A
MPX2101D
MPX2101A
∆V/∆P
—
—
mV/kPa
%VFSS
Pressure Hysteresis(5) (0 to 100 kPa)
Temperature Hysteresis(5) (– 40°C to +125°C)
Temperature Effect on Full Scale Span(5)
Temperature Effect on Offset(5)
Input Impedance
Output Impedance
Response Time(6) (10% to 90%)
Warm–Up
Offset Stability(9)
—
—
TCVFSS
TCVoff
Zin
Zout
tR
—
—
%VFSS
%VFSS
%VFSS
mV
Ω
Ω
ms
ms
%VFSS
MECHANICAL CHARACTERISTICS
Characteristic
Weight (Basic Element Case 344–15)
Common Mode Line Pressure(7)
Symbol
—
—
Min
—
—
Typ
2.0
—
Max
—
690
Unit
Grams
kPA
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self–heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
•
Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
•
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
•
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
•
TcSpan:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
•
TcOffset:
to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Common mode pressures beyond specified may result in leakage at the case–to–lead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
2
Motorola Sensor Device Data
MPX2100 MPX2101 SERIES
LINEARITY
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola’s
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
LEAST SQUARES FIT
RELATIVE VOLTAGE OUTPUT
EXAGGERATED
PERFORMANCE
CURVE
LEAST
SQUARE
DEVIATION
STRAIGHT LINE
DEVIATION
END POINT
STRAIGHT LINE FIT
OFFSET
0
50
PRESSURE (% FULLSCALE)
100
Figure 2. Linearity Specification Comparison
ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION
Figure 3 shows the output characteristics of the MPX2100
series at 25°C. The output is directly proportional to the
differential pressure and is essentially a straight line.
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating Characteris-
tics.
40
35
OUTPUT (mVdc)
30
25
20
15
10
5
0
–5
VS = 10 Vdc
TA = 25°C
P1 > P2
MAX
TYP
SPAN
RANGE
(TYP)
MIN
kPa
PSI
0
25
3.62
50
7.25
75
10.87
100
14.5
OFFSET
(TYP)
Figure 3. Output versus Pressure Differential
SILICONE GEL
DIE COAT
WIRE BOND
WIRE BOND
LEAD FRAME
DIFFERENTIAL/GAUGE ELEMENT
P2
DIE
BOND
LEAD FRAME
Figure 4. Cross–Sectional Diagrams (Not to Scale)
Figure 4 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344–15). A silicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the silicon
diaphragm.
The MPX2100 series pressure sensor operating charac-
teristics and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor perfor-
mance and long term reliability. Contact the factory for in-
formation regarding media compatibility in your application.
Motorola Sensor Device Data
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ABSOLUTE ELEMENT
P2
DIFFERENTIAL/GAUGE
STAINLESS STEEL
DIE
METAL COVER
P1
EPOXY
CASE
SILICONE GEL ABSOLUTE
DIE COAT
DIE
P1
STAINLESS STEEL
METAL COVER
EPOXY
CASE
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
DIE
BOND
3
MPX2100 MPX2101 SERIES
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which isolates the die. The differential or gauge sensor is
designed to operate with positive differential pressure
Part Number
MPX2100A
MPX2100DP
MPX2100AP
MPX2100GVP
MPX2100AS
MPX2100GVS
MPX2100ASX
MPX2100GVSX
MPX2100GSX
MPX2101GSX
MPX2100GP
MPX2100D
MPX2101A
MPX2101DP
MPX2101AP
MPX2101GVP
MPX2101GP
applied, P1 > P2. The absolute sensor is designed for
vacuum applied to P1 side.
The Pressure (P1) side may be identified by using the
table below:
Case Type
344–15C
344C–01
344B–01
344D–01
344E–01
344A–01
344F–01
344G–01
Pressure (P1) Side Identifier
Stainless Steel Cap
Side with Part Marking
Side with Port Attached
Stainless Steel Cap
Side with Port Attached
Stainless Steel Cap
Side with Port Attached
Stainless Steel Cap
ORDERING INFORMATION
MPX2100 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in
the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose
pressure connections.
MPX Series
Device Type
D i T
Basic Element
Options
O i
Absolute, Differential
Case Type
C
T
Case 344–15
Order Number
MPX2100A
MPX2100D
MPX2101A
MPX2100DP
MPX2101DP
MPX2100AP
MPX2100GP
MPX2101AP
MPX2101GP
MPX2100GVP
MPX2101GVP
MPX2100AS
MPX2100GS
MPX2100GVS
MPX2100ASX
MPX2100GSX
MPX2101GSX
MPX2100GVSX
Device Marking
MPX2100A
MPX2100D
MPX2101A
MPX2100DP
MPX2101DP
MPX2100AP
MPX2100GP
MPX2101AP
MPX2101GP
MPX2100GVP
MPX2101GVP
MPX2100A
MPX2100D
MPX2100D
MPX2100A
MPX2100D
MPX2101D
MPX2100D
Ported Elements
Differential
Absolute, Gauge
Case 344C–01
Case 344B–01
Gauge Vacuum
Absolute, Gauge Stove Pipe
Gauge Vacuum Stove Pipe
Absolute, Gauge Axial
Case 344D–01
Case 344E–01
Case 344A–01
Case 344F–01
Gauge Vacuum Axial
Case 344G–01
4
Motorola Sensor Device Data
MPX2100 MPX2101 SERIES
PACKAGE DIMENSIONS
NOTES:
C
R
M
B
–A–
N
PIN 1
1
2
3
4
POSITIVE
PRESSURE (P1)
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
INCHES
MIN
MAX
0.595
0.630
0.514
0.534
0.200
0.220
0.016
0.020
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
30
_
NOM
0.475
0.495
0.430
0.450
MILLIMETERS
MIN
MAX
15.11
16.00
13.06
13.56
5.08
5.59
0.41
0.51
1.22
1.63
2.54 BSC
0.36
0.40
17.65
18.42
30
_
NOM
12.07
12.57
10.92
11.43
L
–T–
J
SEATING
PLANE
POSITIVE
PRESSURE
(P1)
G
F
4 PL
D
0.136 (0.005)
M
T A
M
DIM
A
B
C
D
F
G
J
L
M
N
R
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
– OUTPUT
CASE 344–15
ISSUE W
PORT #2
VACUUM
PRESSURE
(P2)
C
POSITIVE
PRESSURE
(P1)
PIN 1
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
F
G
J
K
N
R
S
V
INCHES
MIN
MAX
0.690
0.720
0.245
0.255
0.780
0.820
0.016
0.020
0.048
0.064
0.100 BSC
0.014
0.016
0.345
0.375
0.300
0.310
0.178
0.186
0.220
0.240
0.182
0.194
GROUND
+ OUTPUT
+ SUPPLY
– OUTPUT
MILLIMETERS
MIN
MAX
17.53
18.28
6.22
6.48
19.81
20.82
0.41
0.51
1.22
1.63
2.54 BSC
0.36
0.41
8.76
9.53
7.62
7.87
4.52
4.72
5.59
6.10
4.62
4.93
–B–
V
1 2
3 4
K
J
R
SEATING
PLANE
S
G
F
D
4 PL
0.13 (0.005)
M
N
–T–
T B
M
STYLE 1:
PIN 1.
2.
3.
4.
CASE 344A–01
ISSUE B
Motorola Sensor Device Data
5
京公网安备 11010802033920号
EEWORLD
