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MPC8247ZQPIE

Description
Micro Peripheral IC, CMOS, PBGA516,
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size892KB,52 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MPC8247ZQPIE Overview

Micro Peripheral IC, CMOS, PBGA516,

MPC8247ZQPIE Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionBGA, BGA516,26X26,40
Reach Compliance Codeunknown
JESD-30 codeS-PBGA-B516
Number of terminals516
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA516,26X26,40
Package shapeSQUARE
Package formGRID ARRAY
power supply1.5,3.3 V
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Base Number Matches1
Advance Information
MPC8272EC
Rev. 0.1 9/2003
MPC8272 Family
Hardware Specifications
This hardware specification contains detailed information on power considerations, DC/AC
electrical characteristics, and AC timing specifications for the MPC8272 family of
devices—the MPC8272, the MPC8248, the MPC8271, and the MPC8247. The CPU on these
devices is a 32-bit PowerPC
TM
core that incorporates memory management units (MMUs)
and instruction and data caches and that implements the PowerPC instruction set. These
devices are .13µm (HiP7) members of the PowerQUICC II™ family of integrated
communications processors. They include a modified communications processor module
(CPM) and an integrated security engine (SEC) for encryption (the MPC8272 and the
MPC8248 only).
All four devices are collectively referred to throughout this hardware specification as ‘the
MPC8272’ unless otherwise noted. The following topics are addressed:
Topic
Section 1, “Features”
Section 2, “Electrical and Thermal Characteristics”
Section 2.1, “DC Electrical Characteristics”
Section 2.2, “Thermal Characteristics”
Section 2.3, “AC Electrical Characteristics”
Section 3, “Clock Configuration Modes”
Section 4, “Pinout”
Section 5, “Package”
Section 6, “Ordering Information”
Section 7, “Document Revision History”
Page
2
6
6
10
11
18
34
45
48
48
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE

MPC8247ZQPIE Related Products

MPC8247ZQPIE MPC8271VRMIB MPC8271VRPIE MPC8271VRTIE MPC8247ZQMIB MPC8248ZQPIE
Description Micro Peripheral IC, CMOS, PBGA516, Micro Peripheral IC, CMOS, PBGA516, Micro Peripheral IC, CMOS, PBGA516, Micro Peripheral IC, CMOS, PBGA516, Micro Peripheral IC, CMOS, PBGA516, Micro Peripheral IC, CMOS, PBGA516,
Is it Rohs certified? incompatible conform to conform to conform to incompatible incompatible
package instruction BGA, BGA516,26X26,40 BGA, BGA516,26X26,40 BGA, BGA516,26X26,40 BGA, BGA516,26X26,40 BGA, BGA516,26X26,40 BGA, BGA516,26X26,40
Reach Compliance Code unknown unknown unknown unknown unknown unknown
JESD-30 code S-PBGA-B516 S-PBGA-B516 S-PBGA-B516 S-PBGA-B516 S-PBGA-B516 S-PBGA-B516
Number of terminals 516 516 516 516 516 516
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA516,26X26,40 BGA516,26X26,40 BGA516,26X26,40 BGA516,26X26,40 BGA516,26X26,40 BGA516,26X26,40
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
power supply 1.5,3.3 V 1.5,3.3 V 1.5,3.3 V 1.5,3.3 V 1.5,3.3 V 1.5,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form BALL BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Base Number Matches 1 1 1 1 1 -
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