UPD789324GB-XXX-8ET datasheet, PDF - EEWORLD Datasheet

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UPD789324GB-XXX-8ET: DescriptionMicrocontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP52, 10 X 10 MM, PLASTIC, LQFP-52; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，226 Pages; ManufacturerNEC Electronics

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UPD789324GB-XXX-8ET Overview

Microcontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP52, 10 X 10 MM, PLASTIC, LQFP-52

UPD789324GB-XXX-8ET Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	10 X 10 MM, PLASTIC, LQFP-52
Reach Compliance Code	compliant
Has ADC	NO
Address bus width
bit size	8
maximum clock frequency	5 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-PQFP-G52
JESD-609 code	e0
length	10 mm
Number of I/O lines	21
Number of terminals	52
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
ROM programmability	MROM
Maximum seat height	1.6 mm
speed	5 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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User’s Manual

µ

PD789327 Subseries

8-Bit Single-Chip Microcontrollers

µ

PD789322

µ

PD789324

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PD789326

µ

PD789327

µ

PD78F9328

Document No. U15043EJ3V1UD00 (3rd edition)

Date Published October 2005 N CP(K)

©

Printed in Japan

NOTES FOR CMOS DEVICES

1

VOLTAGE APPLICATION WAVEFORM AT INPUT PIN

Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the

CMOS device stays in the area between V

IL

(MAX) and V

IH

(MIN) due to noise, etc., the device may

malfunction. Take care to prevent chattering noise from entering the device when the input level is

fixed, and also in the transition period when the input level passes through the area between V

IL

(MAX)

and V

IH

(MIN).

2

HANDLING OF UNUSED INPUT PINS

Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is

possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS

devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed

high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to V

DD

or

GND via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins

must be judged separately for each device and according to related specifications governing the device.

3

PRECAUTION AGAINST ESD

A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and

ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as

much as possible, and quickly dissipate it when it has occurred.

Environmental control must be

adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that

easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static

container, static shielding bag or conductive material. All test and measurement tools including work

benches and floors should be grounded.

The operator should be grounded using a wrist strap.

Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for

PW boards with mounted semiconductor devices.

4

STATUS BEFORE INITIALIZATION

Power-on does not necessarily define the initial status of a MOS device. Immediately after the power

source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does

not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the

reset signal is received. A reset operation must be executed immediately after power-on for devices

with reset functions.

5

POWER ON/OFF SEQUENCE

In the case of a device that uses different power supplies for the internal operation and external

interface, as a rule, switch on the external power supply after switching on the internal power supply.

When switching the power supply off, as a rule, switch off the external power supply and then the

internal power supply. Use of the reverse power on/off sequences may result in the application of an

overvoltage to the internal elements of the device, causing malfunction and degradation of internal

elements due to the passage of an abnormal current.

The correct power on/off sequence must be judged separately for each device and according to related

specifications governing the device.

6

INPUT OF SIGNAL DURING POWER OFF STATE

Do not input signals or an I/O pull-up power supply while the device is not powered. The current

injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and

the abnormal current that passes in the device at this time may cause degradation of internal elements.

Input of signals during the power off state must be judged separately for each device and according to

related specifications governing the device.

User’s Manual U15043EJ3V1UD

3

EEPROM and FIP are trademarks of NEC Electronics Corporation.

Windows and Windows NT are either registered trademarks or trademarks of Microsoft Corporation in the

United States and/or other countries.

PC/AT is a trademark of International Business Machines Corporation.

HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company.

SPARCstation is a trademark of SPARC International, Inc.

Solaris and SunOS are trademarks of Sun Microsystems, Inc.

These commodities, technology or software, must be exported in accordance

with the export administration regulations of the exporting country.

Diversion contrary to the law of that country is prohibited.

•

The information in this document is current as of August, 2005. The information is subject to

change without notice. For actual design-in, refer to the latest publications of NEC Electronics data

sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not

all products and/or types are available in every country. Please check with an NEC Electronics sales

representative for availability and additional information.

•

No part of this document may be copied or reproduced in any form or by any means without the prior

written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may

appear in this document.

•

NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual

property rights of third parties by or arising from the use of NEC Electronics products listed in this document

or any other liability arising from the use of such products. No license, express, implied or otherwise, is

granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.

Descriptions of circuits, software and other related information in this document are provided for illustrative

•

purposes in semiconductor product operation and application examples. The incorporation of these

circuits, software and information in the design of a customer's equipment shall be done under the full

responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by

customers or third parties arising from the use of these circuits, software and information.

•

While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,

customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To

minimize risks of damage to property or injury (including death) to persons arising from defects in NEC

Electronics products, customers must incorporate sufficient safety measures in their design, such as

redundancy, fire-containment and anti-failure features.

•

NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and

"Specific".

The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-

designated "quality assurance program" for a specific application. The recommended applications of an NEC

Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of

each NEC Electronics product before using it in a particular application.

"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio

and visual equipment, home electronic appliances, machine tools, personal electronic equipment

and industrial robots.

"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support).

"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems and medical equipment for life support, etc.

The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC

Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications

not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to

determine NEC Electronics' willingness to support a given application.

(Note)

(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its

majority-owned subsidiaries.

(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as

defined above).

M8E 02. 11-1

4

User’s Manual U15043EJ3V1UD

UPD789324GB-XXX-8ET Related Products

	UPD789324GB-XXX-8ET	UPD789326GB-XXX-8ET-A	UPD789324GB-XXX-8ET-A	UPD789322GB-XXX-8ET-A	UPD789322GB-XXX-8ET	UPD789327GB-XXX-8ET-A
Description	Microcontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP52, 10 X 10 MM, PLASTIC, LQFP-52	Microcontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP52, 10 X 10 MM, PLASTIC, LQFP-52	Microcontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP52, 10 X 10 MM, PLASTIC, LQFP-52	Microcontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP52, 10 X 10 MM, PLASTIC, LQFP-52	Microcontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP52, 10 X 10 MM, PLASTIC, LQFP-52	Microcontroller, 8-Bit, MROM, 5MHz, CMOS, PQFP52, 10 X 10 MM, PLASTIC, LQFP-52
Is it Rohs certified?	incompatible	conform to	conform to	conform to	incompatible	conform to
package instruction	10 X 10 MM, PLASTIC, LQFP-52	10 X 10 MM, PLASTIC, LQFP-52	10 X 10 MM, PLASTIC, LQFP-52	10 X 10 MM, PLASTIC, LQFP-52	10 X 10 MM, PLASTIC, LQFP-52	LQFP,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
Has ADC	NO	NO	NO	NO	NO	NO
bit size	8	8	8	8	8	8
maximum clock frequency	5 MHz	5 MHz	5 MHz	5 MHz	5 MHz	5 MHz
DAC channel	NO	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO	NO	NO
JESD-30 code	S-PQFP-G52	S-PQFP-G52	S-PQFP-G52	S-PQFP-G52	S-PQFP-G52	S-PQFP-G52
JESD-609 code	e0	e6/e4	e6/e4	e6/e4	e0	e6
length	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm
Number of I/O lines	21	21	21	21	21	21
Number of terminals	52	52	52	52	52	52
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	260	260	260	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM programmability	MROM	MROM	MROM	MROM	MROM	MROM
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
speed	5 MHz	5 MHz	5 MHz	5 MHz	5 MHz	5 MHz
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN LEAD	TIN BISMUTH/NICKEL PALLADIUM GOLD	TIN BISMUTH/NICKEL PALLADIUM GOLD	TIN BISMUTH/NICKEL PALLADIUM GOLD	TIN LEAD	TIN BISMUTH
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	10	10	10	NOT SPECIFIED	NOT SPECIFIED
width	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER

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