FIFO, 4KX9, 40ns, Asynchronous, CMOS, CQCC32,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | TEMIC |
| Reach Compliance Code | unknown |
| Maximum access time | 40 ns |
| Maximum clock frequency (fCLK) | 20 MHz |
| JESD-30 code | S-XQCC-N32 |
| JESD-609 code | e0 |
| memory density | 36864 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Number of terminals | 32 |
| word count | 4096 words |
| character code | 4000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 4KX9 |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC32,.42SQ,40 |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum standby current | 0.002 A |
| Maximum slew rate | 0.135 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
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