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KMPC8250AZUPIBB

Description
RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA480, TBGA-480
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size434KB,60 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

KMPC8250AZUPIBB Overview

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA480, TBGA-480

KMPC8250AZUPIBB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionLBGA, BGA480,29X29,50
Reach Compliance Codeunknown
Other featuresREQUIRES 3.3V SUPPLY FOR I/O
Address bus width32
bit size32
boundary scanYES
External data bus width64
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B480
JESD-609 codee0
length37.5 mm
Number of terminals480
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA480,29X29,50
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.7/2.1,3.3 V
Certification statusNot Qualified
Maximum seat height1.65 mm
speed300 MHz
Maximum supply voltage2.1 V
Minimum supply voltage1.9 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width37.5 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Base Number Matches1
Advance Information
MPC8250EC/D
Rev. 0.8 11/2002
MPC8250
Hardware Specifications
This document contains detailed information on power considerations, DC/AC electrical
characteristics, and AC timing specifications for the MPC8250 PowerQUICC II™
communications processor.
The following topics are addressed:
Topic
Section 1.1, “Features”
Section 1.2, “Electrical and Thermal Characteristics”
Section 1.2.1, “DC Electrical Characteristics”
Section 1.2.2, “Thermal Characteristics”
Section 1.2.3, “Power Considerations”
Section 1.2.4, “AC Electrical Characteristics”
Section 1.3, “Clock Configuration Modes”
Section 1.3.1, “Local Bus Mode”
Section 1.3.2, “PCI Mode”
Section 1.4, “Pinout”
Section 1.5, “Package Description”
Section 1.6, “Ordering Information”
Page
2
5
5
10
10
11
17
17
21
27
53
56
The MPC8250 is available in two packages—the standard ZU package (480 TBGA) and an
alternate VR package (516 PBGA)—as described in Section 1.4, “Pinout,” and Section 1.5,
“Package Description.” For more information on VR packages, contact your Motorola sales
office. Note that throughout this document references to the MPC8250 are inclusive of its VR
version unless otherwise specified.
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE

KMPC8250AZUPIBB Related Products

KMPC8250AZUPIBB KXPC8250AZUPHBA KMPC8250ACZUMHBB KMPC8250ACVRIHBB
Description RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA480, TBGA-480 RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA480, TBGA-480 RISC Microprocessor, 32-Bit, 266MHz, CMOS, PBGA480, TBGA-480 RISC Microprocessor, 32-Bit, 200MHz, CMOS, PBGA516, PLASTIC, BGA-516
Is it Rohs certified? incompatible incompatible incompatible incompatible
package instruction LBGA, BGA480,29X29,50 LBGA, BGA480,29X29,50 LBGA, BGA480,29X29,50 BGA, BGA516,26X26,40
Reach Compliance Code unknown unknown unknown unknown
Other features REQUIRES 3.3V SUPPLY FOR I/O REQUIRES 3.3V SUPPLY FOR I/O REQUIRES 3.3V SUPPLY FOR I/O REQUIRES 3.3V SUPPLY FOR I/O
Address bus width 32 32 32 32
bit size 32 32 32 32
boundary scan YES YES YES YES
External data bus width 64 64 64 64
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache YES YES YES YES
JESD-30 code S-PBGA-B480 S-PBGA-B480 S-PBGA-B480 S-PBGA-B516
JESD-609 code e0 e0 e0 e0
length 37.5 mm 37.5 mm 37.5 mm 27 mm
Number of terminals 480 480 480 516
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA LBGA BGA
Encapsulate equivalent code BGA480,29X29,50 BGA480,29X29,50 BGA480,29X29,50 BGA516,26X26,40
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 1.7/2.1,3.3 V 1.7/2.1,3.3 V 1.7/2.1,3.3 V 1.7/2.1,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.65 mm 1.65 mm 1.65 mm 2.55 mm
speed 300 MHz 300 MHz 266 MHz 200 MHz
Maximum supply voltage 2.1 V 2.1 V 2.1 V 2.1 V
Minimum supply voltage 1.9 V 1.9 V 1.9 V 1.7 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 37.5 mm 37.5 mm 37.5 mm 27 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Maker - Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
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