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MX29F001BQC-55

Description
Flash, 128KX8, 55ns, PQCC32, PLASTIC, MS-016, LCC-32
Categorystorage    storage   
File Size908KB,43 Pages
ManufacturerMacronix
Websitehttp://www.macronix.com/en-us/Pages/default.aspx
Download Datasheet Parametric Compare View All

MX29F001BQC-55 Overview

Flash, 128KX8, 55ns, PQCC32, PLASTIC, MS-016, LCC-32

MX29F001BQC-55 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeLCC
package instructionPLASTIC, MS-016, LCC-32
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time55 ns
startup blockBOTTOM
command user interfaceYES
Data pollingYES
JESD-30 codeR-PQCC-J32
JESD-609 codee0
length14.0462 mm
memory density1048576 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size1,2,2,1,1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX8
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC32,.5X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height3.55 mm
Department size8K,4K,8K,32K,64K
Maximum standby current0.000005 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width11.5062 mm
Base Number Matches1
MX29F001T/B
1M-BIT [128K x 8] CMOS FLASH MEMORY
FEATURES
5.0V
±
10% for read, erase and write operation
131072x8 only organization
Fast access time: 55/70/90/120ns
Low power consumption
- 30mA maximum active current(5MHz)
- 1u
A
typical standby current
• Command register architecture
- Byte Programming (7us typical)
- Sector Erase (8K-Byte x 1, 4K-Byte x 2, 8K Byte
x 2, 32K-Byte x 1, and 64K-Byte x 1)
• Auto Erase (chip & sector) and Auto Program
- Automatically erase any combination of sectors
with Erase Suspend capability.
- Automatically programs and verifies data at
specified address
• Erase Suspend/Erase Resume
– Suspends an erase operation to read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation.
• Status Reply
- Data polling & Toggle bit for detection of program
and erase cycle completion.
• Chip protect/unprotect for 5V only system or 5V/12V
system
• 100,000 minimum erase/program cycles
• Latch-up protected to 100mA from -1 to VCC+1V
• Boot Code Sector Architecture
- T = Top Boot Sector
- B = Bottom Boot Sector
• Low VCC write inhibit is equal to or less than 3.2V
• Package type:
- 32-pin PLCC
- 32-pin TSOP
- 32-pin PDIP
• Boot Code Sector Architecture
- T=Top Boot Sector
- B=Bottom Boot Sector
• 20 years data retention
GENERAL DESCRIPTION
The MX29F001T/B is a 1-mega bit Flash memory
organized as 128K bytes of 8 bits only MXIC's
Flash memories offer the most cost-effective and
reliable read/write non-volatile random access
memory. The MX29F001T/B is packaged in 32-pin
PLCC, TSOP, PDIP. It is designed to be repro-
grammed and erased in-system or in-standard
EPROM programmers.
The standard MX29F001T/B offers access time as
fast as 55ns, allowing operation of high-speed
microprocessors without wait states. To eliminate
bus contention, the MX29F001T/B has separate
chip enable (CE) and output enable (OE) controls.
MXIC's Flash memories augment EPROM function-
ality with in-circuit electrical erasure and
programming. The MX29F001T/B uses a command
register to manage this functionality. The command
register allows for 100% TTL level control inputs
and fixed power supply levels during erase and
programming, while maintaining maximum EPROM
compatibility.
MXIC Flash technology reliably stores memory con-
tents even after 100,000 erase and program cycles.
The MXIC cell is designed to optimize the erase and
programming mechanisms. In addition, the combi-
nation of advanced tunnel oxide processing and low
internal electric fields for erase and programming
operations produces reliable cycling.
The
MX29F001T/B uses a 5.0V
±
10% VCC supply to
perform the High Reliability Erase and auto
Program/Erase algorithms.
The highest degree of latch-up protection is
achieved with MXIC's proprietary non-epi process.
Latch-up protection is proved for stresses up to 100
milliamps on address and data pin from -1V to VCC
+ 1V.
P/N: PM0515
REV. 2.5, NOV. 20, 2002
1

MX29F001BQC-55 Related Products

MX29F001BQC-55 MX29F001BPC-70 MX29F001BTC-70 MX29F001BQC-70 MX29F001BTC-55 MX29F001BPC-55
Description Flash, 128KX8, 55ns, PQCC32, PLASTIC, MS-016, LCC-32 Flash, 128KX8, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Flash, 128KX8, 70ns, PDSO32, 8 X 20 MM, PLASTIC, MO-142, TSOP1-32 Flash, 128KX8, 70ns, PQCC32, PLASTIC, MS-016, LCC-32 Flash, 128KX8, 55ns, PDSO32, 8 X 20 MM, PLASTIC, MO-142, TSOP1-32 Flash, 128KX8, 55ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code LCC DIP TSOP1 LCC TSOP1 DIP
package instruction PLASTIC, MS-016, LCC-32 0.600 INCH, PLASTIC, DIP-32 8 X 20 MM, PLASTIC, MO-142, TSOP1-32 PLASTIC, MS-016, LCC-32 TSOP1, TSSOP32,.8,20 DIP, DIP32,.6
Contacts 32 32 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 55 ns 70 ns 70 ns 70 ns 55 ns 55 ns
startup block BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
command user interface YES YES YES YES YES YES
Data polling YES YES YES YES YES YES
JESD-30 code R-PQCC-J32 R-PDIP-T32 R-PDSO-G32 R-PQCC-J32 R-PDSO-G32 R-PDIP-T32
JESD-609 code e0 e0 e0 e0 e0 e0
length 14.0462 mm 41.91 mm 18.4 mm 14.0462 mm 18.4 mm 41.91 mm
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of departments/size 1,2,2,1,1 1,2,2,1,1 1,2,2,1,1 1,2,2,1,1 1,2,2,1,1 1,2,2,1,1
Number of terminals 32 32 32 32 32 32
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ DIP TSOP1 QCCJ TSOP1 DIP
Encapsulate equivalent code LDCC32,.5X.6 DIP32,.6 TSSOP32,.8,20 LDCC32,.5X.6 TSSOP32,.8,20 DIP32,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE SMALL OUTLINE, THIN PROFILE CHIP CARRIER SMALL OUTLINE, THIN PROFILE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Programming voltage 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.55 mm 4.9022 mm 1.2 mm 3.55 mm 1.2 mm 4.9022 mm
Department size 8K,4K,8K,32K,64K 8K,4K,8K,32K,64K 8K,4K,8K,32K,64K 8K,4K,8K,32K,64K 8K,4K,8K,32K,64K 8K,4K,8K,32K,64K
Maximum standby current 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A
Maximum slew rate 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA
Maximum supply voltage (Vsup) 5.25 V 5.5 V 5.5 V 5.5 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.75 V 4.5 V 4.5 V 4.5 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO YES YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND THROUGH-HOLE GULL WING J BEND GULL WING THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 0.5 mm 1.27 mm 0.5 mm 2.54 mm
Terminal location QUAD DUAL DUAL QUAD DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
switch bit YES YES YES YES YES YES
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 11.5062 mm 15.24 mm 8 mm 11.5062 mm 8 mm 15.24 mm
Base Number Matches 1 1 1 1 - -
Maker - Macronix Macronix - Macronix Macronix

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