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CD40107BD/3W

Description
NAND Gate, CMOS, CDIP14
Categorylogic    logic   
File Size234KB,3 Pages
ManufacturerRCA
Download Datasheet Parametric Compare View All

CD40107BD/3W Overview

NAND Gate, CMOS, CDIP14

CD40107BD/3W Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP14,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T14
JESD-609 codee0
Logic integrated circuit typeNAND GATE
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Output characteristicsOPEN-DRAIN
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5/15 V
Certification statusNot Qualified
Schmitt triggerNO
Filter levelMIL-STD-883 Class B (Modified)
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

CD40107BD/3W Related Products

CD40107BD/3W CD40107BEX CD40107BEX98 CD40107BE98 CD40107BD/3 CD40107BFX CD40107BF/3W CD40107BF/3
Description NAND Gate, CMOS, CDIP14 NAND Gate, CMOS, PDIP8, NAND Gate, CMOS, PDIP8, NAND Gate, CMOS, PDIP8, NAND Gate, CMOS, CDIP14 NAND Gate, CMOS, CDIP14, NAND Gate, CMOS, CDIP14 NAND Gate, CMOS, CDIP14
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP14,.3 DIP, DIP8,.3 DIP, DIP8,.3 DIP, DIP8,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 code R-XDIP-T14 R-PDIP-T8 R-PDIP-T8 R-PDIP-T8 R-XDIP-T14 R-XDIP-T14 R-XDIP-T14 R-XDIP-T14
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
Number of terminals 14 8 8 8 14 14 14 14
Maximum operating temperature 125 °C 85 °C 85 °C 85 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -40 °C -40 °C -40 °C -55 °C -55 °C -55 °C -55 °C
Output characteristics OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN
Package body material CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DIP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP14,.3 DIP8,.3 DIP8,.3 DIP8,.3 DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
power supply 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V
Schmitt trigger NO NO NO NO NO NO NO NO
surface mount NO NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Certification status Not Qualified - - Not Qualified Not Qualified - Not Qualified Not Qualified
Base Number Matches 1 1 1 1 1 - - -
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