TLV320AC56N datasheet, PDF - EEWORLD Datasheet

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TLV320AC56N: DescriptionTELECOM, CELLULAR, BASEBAND CIRCUIT, PDIP20, PLASTIC, DIP-20; CategoryWireless rf/communication Telecom circuit; File Size341KB，23 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TLV320AC56N Overview

TELECOM, CELLULAR, BASEBAND CIRCUIT, PDIP20, PLASTIC, DIP-20

TLV320AC56N Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP,
Contacts	20
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T20
length	24.325 mm
Number of functions	1
Number of terminals	20
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	5.08 mm
Nominal supply voltage	3 V
surface mount	NO
Telecom integrated circuit types	BASEBAND CIRCUIT
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

TLV320AC56N Related Products

	TLV320AC56N	TLV320AC56DW	TLV320AC56PT	TLV320AC57N	TLV320AC57PT	TLV320AC57DW
Description	TELECOM, CELLULAR, BASEBAND CIRCUIT, PDIP20, PLASTIC, DIP-20	TELECOM, CELLULAR, BASEBAND CIRCUIT, PDSO20, PLASTIC, SOP-20	TELECOM, CELLULAR, BASEBAND CIRCUIT, PQFP48, PLASTIC, QFP-48	TELECOM, CELLULAR, BASEBAND CIRCUIT, PDIP20, PLASTIC, DIP-20	TELECOM, CELLULAR, BASEBAND CIRCUIT, PQFP48, PLASTIC, QFP-48	TELECOM, CELLULAR, BASEBAND CIRCUIT, PDSO20, PLASTIC, SOP-20
Parts packaging code	DIP	SOIC	QFP	DIP	QFP	SOIC
package instruction	DIP,	SOP,	LFQFP,	PLASTIC, DIP-20	PLASTIC, QFP-48	SOP,
Contacts	20	20	48	20	48	20
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T20	R-PDSO-G20	S-PQFP-G48	R-PDIP-T20	S-PQFP-G48	R-PDSO-G20
length	24.325 mm	12.8 mm	7 mm	24.325 mm	7 mm	12.8 mm
Number of functions	1	1	1	1	1	1
Number of terminals	20	20	48	20	48	20
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	LFQFP	DIP	LFQFP	SOP
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	FLATPACK, LOW PROFILE, FINE PITCH	IN-LINE	FLATPACK, LOW PROFILE, FINE PITCH	SMALL OUTLINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	2.65 mm	1.6 mm	5.08 mm	1.6 mm	2.65 mm
Nominal supply voltage	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	NO	YES	YES	NO	YES	YES
Telecom integrated circuit types	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	2.54 mm	1.27 mm	0.5 mm	2.54 mm	0.5 mm	1.27 mm
Terminal location	DUAL	DUAL	QUAD	DUAL	QUAD	DUAL
width	7.62 mm	7.5 mm	7 mm	7.62 mm	7 mm	7.5 mm

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