TELECOM, CELLULAR, BASEBAND CIRCUIT, PDSO20, PLASTIC, SOP-20
| Parameter Name | Attribute value |
| Maker | Texas Instruments |
| Parts packaging code | SOIC |
| package instruction | SOP, |
| Contacts | 20 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDSO-G20 |
| length | 12.8 mm |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Certification status | Not Qualified |
| Maximum seat height | 2.65 mm |
| Nominal supply voltage | 3 V |
| surface mount | YES |
| Telecom integrated circuit types | BASEBAND CIRCUIT |
| Temperature level | INDUSTRIAL |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| width | 7.5 mm |
| TLV320AC57DW | TLV320AC56N | TLV320AC56DW | TLV320AC56PT | TLV320AC57N | TLV320AC57PT | |
|---|---|---|---|---|---|---|
| Description | TELECOM, CELLULAR, BASEBAND CIRCUIT, PDSO20, PLASTIC, SOP-20 | TELECOM, CELLULAR, BASEBAND CIRCUIT, PDIP20, PLASTIC, DIP-20 | TELECOM, CELLULAR, BASEBAND CIRCUIT, PDSO20, PLASTIC, SOP-20 | TELECOM, CELLULAR, BASEBAND CIRCUIT, PQFP48, PLASTIC, QFP-48 | TELECOM, CELLULAR, BASEBAND CIRCUIT, PDIP20, PLASTIC, DIP-20 | TELECOM, CELLULAR, BASEBAND CIRCUIT, PQFP48, PLASTIC, QFP-48 |
| Parts packaging code | SOIC | DIP | SOIC | QFP | DIP | QFP |
| package instruction | SOP, | DIP, | SOP, | LFQFP, | PLASTIC, DIP-20 | PLASTIC, QFP-48 |
| Contacts | 20 | 20 | 20 | 48 | 20 | 48 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | S-PQFP-G48 | R-PDIP-T20 | S-PQFP-G48 |
| length | 12.8 mm | 24.325 mm | 12.8 mm | 7 mm | 24.325 mm | 7 mm |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 20 | 48 | 20 | 48 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | DIP | SOP | LFQFP | DIP | LFQFP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| Package form | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | FLATPACK, LOW PROFILE, FINE PITCH | IN-LINE | FLATPACK, LOW PROFILE, FINE PITCH |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.65 mm | 5.08 mm | 2.65 mm | 1.6 mm | 5.08 mm | 1.6 mm |
| Nominal supply voltage | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| surface mount | YES | NO | YES | YES | NO | YES |
| Telecom integrated circuit types | BASEBAND CIRCUIT | BASEBAND CIRCUIT | BASEBAND CIRCUIT | BASEBAND CIRCUIT | BASEBAND CIRCUIT | BASEBAND CIRCUIT |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 0.5 mm | 2.54 mm | 0.5 mm |
| Terminal location | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD |
| width | 7.5 mm | 7.62 mm | 7.5 mm | 7 mm | 7.62 mm | 7 mm |
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