Reference Dimensions:
PulseGuard
®
Suppressors
2.24 +/- 0.18
(0.088" +/- 0.007")
1.04
(0.041") REF
0.36 (0.014")
1.66 +/- 0.06
(0.066" +/- 0.003”)
Surface Mount Polymeric ESD Suppressors
0.15 +/- 0.08
(0.006" +/- 0.003”)
1.91
(0.075")
1.09
(0.043")
3.00 +/- 0.20
(0.118" +/- 0.008")
0.69 +/- 0.10
(0.027" +/- 0.004)
PGB1 Series Lead-Free
0.84 +/- 0.05
(0.033" +/- 0.002”)
0.91
(0.036")
TYP
0.15 +/- 0.08
(0.006 +/- 0.003")
TYP
0.81
(0.032")
TYP
0.43 +/- 0.18
(0.017" +/- 0.007”)
Description
Wave Solder
1.02 (0.040")
Reflow Solder
0.51 (0.020")
3.05
(0.120")
1.27 (0.050")
Reflow Solder
Wave Solder
1.02 (0.040")
1.27
0.76 (0.030")
(0.050")
1.02 (0.040")
1.02
3.30
(0.040")
(0.130")
2.29
(0.090")
0.64
(0.025")
2.54
(0.100")
0.64
(0.025")
2.29
(0.090")
0.51
(0.020")
1.27 (0.050")
2.03
(0.080")
PulseGuard ESD Suppressors help protect sensitive
electronic equipment against electrostatic discharge (ESD).
They supplement the on-chip protection of integrated
1.27
(0.050")
circuitry and are best suited for low-voltage, high-speed
1.27
applications where low capacitance is important. Data ports
(0.050")
utilizing such high-speed protocols as USB 2.0, IEEE1394,
HDMI and DVI can benefit from this new technology.
PulseGuard suppressors use polymer composite materials
to suppress fast-rising ESD transients (as specified in IEC
61000-4-2), while adding virtually no capacitance to the
circuit.
Features
0.76 (0.030")
0.76 (0.030")
Equivalent Circuits
0402 and 0603 Devices
Equivalent Circuit
SOT23 Device
Circuit
Equivalent
3
1
2
• RoHS compliant and
lead-free
• Ultra-low capacitance
• Low leakage current
• Fast response time
• Bi-directional
• Withstands multiple
ESD strikes
• Compatible with
pick-and-place processes
• Available in 1000, 3000,
5000 and 10000 piece
reels (EIA-RS481)
1
2
Applications
• HDTV Hardware
• Laptop/Desktop
Computers
• Network Hardware
• Computer Peripherals
• Digital Cameras
• External Storage
• Set-Top Boxes
Product Characteristics
Part Number
PGB1010402
PGB1010603
PGB102ST23
Lines Protected
1
1
2
Component Package
0402
0603
SOT23
Electrical Characteristics
Specification
ESD Capability:
IEC 61000-4-2 Contact Discharge
IEC 61000-4-2 Air Discharge
Peak Voltage (typical)
Clamping Voltage (typical)
Rated Voltage (maximum)
Capacitance (typical)
Response Time
Leakage Current (typical)
ESD Pulse Withstand
PGB1010402
8kV
15kV
1000V
250V
12VDC
0.04 pF
<1nS
<1nA (12 VDC)
100 pulses min
PGB1010603
8kV
15kV
500V
150V
24VDC
0.06 pF
<1nS
<1nA (6 VDC)
1000 pulses min
PGB102ST23
8kV
15kV
500V
150V
24VDC
0.12 pF
<1nS
<1nA (6 VDC)
1000 pulses min
Some shifting in characteristics may
occur when tested over multiple
pulses at a very rapid rate
Measured at 250 MHz
Measured per IEC 61000-4-2
8kV Contact Discharge
1
Measured per IEC 61000-4-2
8kV Contact Discharge
1
, at 25 nsec.
Notes
Notes:
1
Testing performed on Littelfuse Test Set up as described in typical test setup section.
PGB1 Series
Specifications are subject to change without notice.
1
Electronics Designers Guide
www.littelfuse.com
©2007 Littelfuse
Vo
Capa
PGB1010603
PGB1010402
PulseGuard
®
Suppressors
200
10,000
0
-25
0
25
400
PGB102ST23
PGB1040805
PGB1010402
0.01
100
Surface Mount Polymeric ESD Suppressors
1,000
50
75
100
125
150
175
Frequency (MHz)
Time (ns)
Part Numbering System
Dimensions
0402 Device
Dimensions: mm (inch)
0.15 +/- 0.08
(0.006" +/- 0.003")
0.310 +/- 0.08
(0.012" +/- 0.003")
0.99 +/- 0.05
(0.039" +/- 0.002")
PGB1 01 0603 MR
70
** Note: 1,000 fF = 1 pF
Capacitance (fF)
LEAD-FREE
PULSEGUARD
®
1200
60
ESD SUPPRESSORS
LINES PROTECTED:
1000
01 = 1 line
50
02
800
= 2 lines
04 = 4 lines
QUANTITY &
PACKAGING CODE:
MR = 1000 pieces
WR = 3000 pieces
NR = 5000 pieces
KR = 10,000 pieces
DEVICE SIZE CODE:
0402 = 0402 (1005)
0603 = 0603 (1608)
ST23 = SOT23
PGB1010603
0.5
1.0
0.25
(0.010")
0.24 +/- 0.09
(0.009" +/- 0.004")
0.51 +/- 0.05
(0.020" +/- 0.002")
Reflow Solder
B102ST23
B1040805
B1010603
B1010402
Voltage (V)
600
40
400
PGB102ST23
PGB1040805
1.5
2.0
200
Typical Device Capacitance
10,000
0
-25
1.00
0
25
50
Frequency (GHz)
PGB1010402
Recommended for
reflow soldering only
1.55
(0.061")
75
100
125
150
175
1200
0.56
(0.022")
0.38
(0.015")
.58
(0.023")
Time (ns)
Voltage (V)
Capacitance (pF)
0603 Device
800
0.10
PGB102ST23
PGB1010603
PGB1010402
1000
Reference Dimensions:
Dimensions: mm (inch)
00 fF = 1 pF
600
1.04
(0.041") REF
1.66 +/- 0.06
(0.066" +/- 0.003”)
400
0.36 (0.014")
PGB1010603
0.15 +/- 0.08
PGB102ST23
(0.006" +/- 0.003”)
200
0.01
100
1,000
10,000
0
0.43 +/- 0.18
(0.017" +/- 0.007”)
-25
0
25
Reflow Solder
0.51 (0.020")
3.05
(0.120")
0.84
PGB1010402
+/- 0.05
(0.033" +/- 0.002”)
50
75
100
125
150
175
Frequency (MHz)
2.0
Time (ns)
Wave Solder
.5
Typical Device Capacitance
0.76 (0.030")
Typical ESD Response
3.30
(0.130")
Typical ESD Response
1.00
1200
1000
1.27 (0.050")
1.27 (0.050")
0.76 (0.030")
Capacitance (pF)
Voltage (V)
Voltage (V)
1200
1000
04000015NR
Note: For wave solder, increase the spacing
in both the horizontal and vertical dimensions by
0.254 (.010") where denoted by an asterisk (*)
0.76 (0.030")
Reference Dimensions:
800
0.10
800
600
400
1,000
0
25
50
75
PGB1010603
PGB102ST23
PGB1010402
600
SOT23 Device
Dimensions: mm (inch)
400
Equivalent Circuit
PGB102ST23
04000015NR
2.24 +/- 0.18
(0.088" +/- 0.007")
PGB1010603
PGB1010402
200
10,000
175
0
-25
1
3.00 +/- 0.20
(0.118" +/- 0.008")
2
1.91
0.01
200
100
0
-25
0
25
50
75 100
(0.075")
0.91
(0.036")
TYP
125
150
175
1.09
(0.043")
Frequency (MHz)
100
125
150
Typical Device Capacitance
Typical ESD Response
0.69 +/- 0.10
(0.027" +/- 0.004)
0.81
(0.032")
TYP
Time (ns)
10,000
Time (ns)
Typical ESD Response
0.15 +/- 0.08
(0.006 +/- 0.003")
TYP
Reflow Solder
1.02 (0.040")
1.27
(0.050")
2.29
(0.090")
0.64
(0.025")
0.51
(0.020")
2.03
(0.080")
1.02 (0.040")
1.02 (0.040")
Wave Solder
1.02 (0.040")
1.27
(0.050")
2.54
(0.100")
0.64
(0.025")
2.29
(0.090")
1.27
(0.050")
1200
1000
Voltage (V)
800
600
400
04000015NR
2
04000015NR
PGB1 Series
200
Specifications are subject to change without notice.
10,000
0
-25
0
25
50
75
100
125
150
www.littelfuse.com
©2007 Littelfuse
Electronics Designers Guide
175
PulseGuard
®
Suppressors
Surface Mount Polymeric ESD Suppressors
Physical Specifications
Materials
Solderability
Soldering
Parameters
Body: Glass Epoxy
Terminations: Copper/Nickel/Tin
MIL-STD-202, Method 208
Environmental Specifications
Operating Temperature
-65°C to +125°C
0402 series:
40°C, 95% RH, 1000 hours
0603, ST23:
85°C, 85% RH, 1000 hours
MIL-STD-202, Method 107,
-65°C to 125°C, 30 min. cycle,
10 cycles
MIL-STD-202, Method 201,
(10 to 55 to 10 Hz, 1 min.
cycle, 2 hrs each in X-Y-Z)
MIL-STD-202, Method 215
Moisture Resistance
Wave solder - 260°C, 10 seconds maximum
Reflow solder - 260°C, 30 seconds maximum
Thermal Shock
Design Consideration
Because of the fast rise-time of the ESD transient, proper
placement of PulseGuard suppressors are a key design
consideration to achieving optimal ESD suppression. The
devices should be placed on the circuit board as close to the
source of the ESD transient as possible. Install PulseGuard
suppressors (connected from signal/data line to ground)
directly behind the connector so that they are the first board-
level circuit component encountered by the ESD transient.
Vibration
Chemical Resistance
Solder Leach Resistance and
Terminal Adhesion
IPC/EIA J-STD-002
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
Pb – Free assembly
150°C
200°C
60 – 180 seconds
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260°C
10 – 30 seconds
6°C/second max
8 minutes max
Based on IPC/JEDEC J-STD-020
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
PGB1 Series
Specifications are subject to change without notice.
3
Electronics Designers Guide
www.littelfuse.com
©2007 Littelfuse
PulseGuard
®
Suppressors
Surface Mount Polymeric ESD Suppressors
Packaging
Part Number
PGB1010402
PGB1010603
PGB102ST23
PGB1010603
Quantity &
Packaging Code
KR
MR
WR
NR
Quantity
10000
1000
3000
5000
Packaging Option
Tape & Reel (7” reel)
Tape & Reel (7” reel)
Tape & Reel (7” reel)
Tape & Reel (7” reel)
Packaging Specification
EIA RS-481-1 (IEC 286, part 3)
EIA RS-481-1 (IEC 286, part 3)
EIA RS-481-1 (IEC 286, part 3)
EIA RS-481-1 (IEC 286, part 3)
Tape and Reel Specifications
T
t
D
d
+
+
D
s
+
+
Description
C
t
- Cover tape thickness
T
w
P
h
0402 Series
(mm)
0.05
1.50
4.00
0.41
1.12
2.00
0.62
0.61
8.00
0603 Series SOT23 Series
(mm)
(mm)
0.05
1.50
4.00
0.58
1.85
4.00
1.02
0.65
8.00
0.06
1.50
4.00
1.02
3.23
4.00
2.46
1.77
8.00
P
d
+
+
+
+
D
d
- Drive hole diameter
D
s
- Drive hole spacing
P
d
- Pocket depth
P
h
- Pocket height
P
s
- Pocket spacing
P
w
- Pocket width
T
t
- Carrier tape thickness
T
w
- Carrier tape width
C
t
P
s
P
w
Typical Test Setup
FARADAY CAGE
COMPUTER
AGILENT INFINIIUM
1.5 GHz 8 GS/s
30dB PASTERNAK ATTENUATOR
PE7025-30
TEKTRONIX LOW CAP PROBE
6158 (20x TIP)
QUADTECH 1865
RESISTANCE METER
RESISTANCE
TEST FIXTURE
ESD TEST FIXTURE
TEST BOARD W/ DUT
ESD PULSE GENERATOR
PGB1 Series
Specifications are subject to change without notice.
4
Electronics Designers Guide
www.littelfuse.com
©2007 Littelfuse
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