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DM74LS26J

Description
IC,LOGIC GATE,QUAD 2-INPUT NAND,LS-TTL,DIP,14PIN,CERAMIC
Categorylogic    logic   
File Size142KB,2 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

DM74LS26J Overview

IC,LOGIC GATE,QUAD 2-INPUT NAND,LS-TTL,DIP,14PIN,CERAMIC

DM74LS26J Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP14,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T14
JESD-609 codee0
Logic integrated circuit typeNAND GATE
MaximumI(ol)0.008 A
Number of terminals14
Maximum operating temperature70 °C
Minimum operating temperature
Output characteristicsOPEN-COLLECTOR
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Maximum supply current (ICC)4.4 mA
Prop。Delay @ Nom-Sup32 ns
Certification statusNot Qualified
Schmitt triggerNO
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

DM74LS26J Related Products

DM74LS26J DM74LS26J/A+ DM74LS26N/B+ DM74LS26N/A+
Description IC,LOGIC GATE,QUAD 2-INPUT NAND,LS-TTL,DIP,14PIN,CERAMIC IC,LOGIC GATE,QUAD 2-INPUT NAND,LS-TTL,DIP,14PIN,CERAMIC IC,LOGIC GATE,QUAD 2-INPUT NAND,LS-TTL,DIP,14PIN,PLASTIC IC,LOGIC GATE,QUAD 2-INPUT NAND,LS-TTL,DIP,14PIN,PLASTIC
Is it Rohs certified? incompatible incompatible incompatible incompatible
package instruction DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown unknown unknown
JESD-30 code R-XDIP-T14 R-XDIP-T14 R-PDIP-T14 R-PDIP-T14
JESD-609 code e0 e0 e0 e0
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE
MaximumI(ol) 0.008 A 0.008 A 0.008 A 0.008 A
Number of terminals 14 14 14 14
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Output characteristics OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR
Package body material CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP
Encapsulate equivalent code DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V
Maximum supply current (ICC) 4.4 mA 4.4 mA 4.4 mA 4.4 mA
Prop。Delay @ Nom-Sup 32 ns 32 ns 32 ns 32 ns
Schmitt trigger NO NO NO NO
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO NO NO NO
technology TTL TTL TTL TTL
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
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