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DPS128C32BV3-20C

Description
SRAM Module, 128KX32, 20ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.300 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
Categorystorage    storage   
File Size760KB,7 Pages
ManufacturerB&B Electronics Manufacturing Company
Download Datasheet Parametric View All

DPS128C32BV3-20C Overview

SRAM Module, 128KX32, 20ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.300 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66

DPS128C32BV3-20C Parametric

Parameter NameAttribute value
Parts packaging codePGA
package instructionPGA,
Contacts66
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time20 ns
Other featuresCONFIGURABLE AS 512K X 8
Spare memory width16
JESD-30 codeS-CPGA-P66
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of ports1
Number of terminals66
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX32
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height7.62 mm
Minimum standby current2 V
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Base Number Matches1
4 Megabit High Speed CMOS SRAM
DPS128C32BV3
DESCRIPTION:
The DPS128C32BV3 ‘’VERSA-STACK’’ module is a
revolutionary new high speed memory subsystem using
Dense-Pac Microsystems’ ceramic Stackable Leadless Chip
Carriers (SLCC) mounted on a co-fired ceramic substrate.
It offers 4 Megabits of SRAM in a package envelope of
1.090 x 1.090 x 0.300 inches.
The DPS128C32BV3 contains four individual 128K x 8
SRAMs, packaged in their own hermetically sealed SLCCs
making the module suitable for commercial, industrial and
military applications.
By using SLCCs, the ‘’Versa-Stack’’ family of modules offers
a higher board density of memory than available with
conventional through-hole, surface mount, module, or
hybrid techniques.
FEATURES:
Organizations Available:
128K x 32, 256K x 16, or
512K x 8
Access Times:
20, 25, 30, 35, 45ns
Fully Static Operation
- No clock or refresh required
Single +5V Power Supply,
±10%
Tolerance
TTL Compatible
Common Data Inputs
and Outputs
Low Data Retention Voltage:
2.0V min.
66-Pin PGA ‘’VERSA-STACK’’
Package
*
Commercial only.
FUNCTIONAL BLOCK DIAGRAM
PIN-OUT DIAGRAM
PIN NAMES
A0 - A16
I/O0 - I/O31
CE0 - CE3
WE0 - WE3
OE
V
DD
V
SS
N.C.
Address Inputs
Data Input/Output
Chip Enables
Write Enables
Output Enable
Power (+5V)
Ground
No Connect
30A044-28
REV. F
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the right
to change products or specifications herein without prior notice.
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