FEATURES
APPLICATIONS
High Pulse Currents
-
High voltage
Power Semiconductor Circuits
–
SCR Commutation
–
Ballasts Controls
–
Switching Power Supplies
-55°C to +105°C
+10% at 1 kHz, 25°C
+5% optional
WVDC
630
1000
1600
2000
VAC
400
630
650
700
DC: For T>+85°C , The voltage must be decreased by 1.5% per °C
AC: For T> +75°C, The voltage must be decreased by 1.75% per °C
Frequency
C<0.1uF 0.1uF<C<1uF
C>1uF
(kHz)
1
0.04%
0.04%
0.05%
10
0.05%
0.06%
-
100
0.16%
-
-
Capacitance
Insulation Resistance
<0.33μF
100000 MΩ
>0.33μF
30000 MΩxμF
<1 nano-Henry per mm of lead spacing
<0.5% after 2 years at 40°C
2000 Hours, +85C with 125% of rated voltage
Capacitance Change
<1% of initially measured value
<0.001 at 10kHz and 25°C for C<1uF
Dissipation Factor
<0.001 at 1kHz and 25°C for C>1uF
Insulation Resistance
>50% of maximum specified value
1 Fit
Capacitance Change
<10% of initially measured value
Dissipation Factor
<200% of initially specified value
Insulation Resistance
>50% of maximum specified value
Operating Temperature Range
Capacitance Tolerance
AC voltage (50/60 Hz)
Dissipation Factor (MAX)
25°C
Insulation Resistance
@25°C (<70% RH)for 1 minute at
100VDC applied
Self Inductance
Capacitance Drift Factor
Load Life
Reliability
(0.5xRated Voltage,
40°C)
1 FIT=1 failure/1 billion
component hours
Damp Heat test
Self Inductance
Capacitance Drift Factor
Capacitance Temperature
Coefficient
Dielectric Strength
Dielectric
Construction
Coating
Leads
56 days at40°C with 90 to 95%RH, +40°C and no voltage applied
Capacitance Change
<5% of initially measured value
Dissipation Factor
<0.005 at 1kHz and 25°C
Insulation Resistance
>50% of maximum specified value
<1 nano-Henry per mm of lead spacing
<0.5% after 2 years at 40°C
-200 ppm/°C, +100ppm/°C
Terminal to Terminal
160% of rated VDC applied for 2 Seconds and 25°C
Polypropylene
Metallized film
Flame Retardant plastic box (UL 94V-1) with epoxy resin fill (UL94V0)
Lead free tinned copper leads
Feb-17
TI Technology Forum
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