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IDT7188L70DB

Description
Standard SRAM, 16KX4, 70ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22
Categorystorage    storage   
File Size87KB,8 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

IDT7188L70DB Overview

Standard SRAM, 16KX4, 70ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22

IDT7188L70DB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeDIP
package instructionDIP, DIP22,.3
Contacts22
Reach Compliance Codenot_compliant
ECCN code3A001.A.2.C
Base Number Matches1
CMOS Static RAM
64K (16K x 4-Bit)
IDT7188S
IDT7188L
x
Features
High-speed (equal access and cycle times)
– Military: 25/35/45/55/70/85ns (max.)
Low power consumption
Battery backup operation — 2V data retention
(L version only)
Available in high-density industry standard 22-pin, 300 mil
ceramic DIP
Produced with advanced CMOS technology
Inputs/outputs TTL-compatible
Military product compliant to MIL-STD-883, Class B
innovative circuit design techniques, provides a cost effective approach
for memory intensive applications.
Access times as fast as 25ns are available. The IDT7188 offers a
reduced power standby mode, I
SB1
, which is activated when
CS
goes
HIGH. This capability significantly decreases power while enhancing
system reliability. The low-power version (L) version also offers a battery
backup data retention capability where the circuit typically consumes only
30µW operating from a 2V battery.
All inputs and outputs are TTL-compatible and operate from a single
5V supply. The IDT7188 is packaged in a 22-pin, 300 mil ceramic DIP
providing excellent board-level packing densities.
Military grade product is manufactured in compliance with the latest
revision of MIL-STD-883, Class B, making it ideally suited to military
temperature applications demanding the highest level of performance
and reliability.
x
x
x
x
x
x
Description
The IDT7188 is a 65,536-bit high-speed static RAM organized as
16K x 4. It is fabricated using IDT’s high-performance, high-reliability
technology — CMOS. This state-of-the-art technology, combined with
Functional Block Diagram
A
0
V
CC
GND
65,536-BIT
MEMORY ARRAY
DECODER
A
13
I/O
0
I/O
1
I/O
2
I/O
3
COLUMN I/O
INPUT
DATA
CONTROL
,
CS
WE
2989 drw 01
FEBRUARY 2001
1
©2000 Integrated Device Technology, Inc.
DSC-2989/09

IDT7188L70DB Related Products

IDT7188L70DB IDT7188S25DB IDT7188S85DB IDT7188L85DB IDT7188S35DB IDT7188L25DB IDT7188L45DB
Description Standard SRAM, 16KX4, 70ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 25ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 85ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 85ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 35ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 25ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 45ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code DIP DIP DIP DIP DIP DIP DIP
package instruction DIP, DIP22,.3 0.300 INCH, CERAMIC, DIP-22 DIP, DIP22,.3 DIP, DIP22,.3 0.300 INCH, CERAMIC, DIP-22 0.300 INCH, CERAMIC, DIP-22 0.300 INCH, CERAMIC, DIP-22
Contacts 22 22 22 22 22 22 22
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Maker - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Maximum access time - 25 ns - 85 ns 35 ns 25 ns 45 ns
I/O type - COMMON - COMMON COMMON COMMON COMMON
JESD-30 code - R-GDIP-T22 - R-GDIP-T22 R-GDIP-T22 R-GDIP-T22 R-GDIP-T22
JESD-609 code - e0 - e0 e0 e0 e0
length - 27.051 mm - 27.051 mm 27.051 mm 27.051 mm 27.051 mm
memory density - 65536 bit - 65536 bit 65536 bit 65536 bit 65536 bit
Memory IC Type - STANDARD SRAM - STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width - 4 - 4 4 4 4
Number of functions - 1 - 1 1 1 1
Number of ports - 1 - 1 1 1 1
Number of terminals - 22 - 22 22 22 22
word count - 16384 words - 16384 words 16384 words 16384 words 16384 words
character code - 16000 - 16000 16000 16000 16000
Operating mode - ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature - 125 °C - 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature - -55 °C - -55 °C -55 °C -55 °C -55 °C
organize - 16KX4 - 16KX4 16KX4 16KX4 16KX4
Output characteristics - 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE
Exportable - NO - NO NO NO NO
Package body material - CERAMIC, GLASS-SEALED - CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code - DIP - DIP DIP DIP DIP
Encapsulate equivalent code - DIP22,.3 - DIP22,.3 DIP22,.3 DIP22,.3 DIP22,.3
Package shape - RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - IN-LINE - IN-LINE IN-LINE IN-LINE IN-LINE
Parallel/Serial - PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) - 225 - 225 225 225 225
power supply - 5 V - 5 V 5 V 5 V 5 V
Certification status - Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
Filter level - MIL-STD-883 Class B - MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B
Maximum seat height - 5.08 mm - 5.08 mm 5.08 mm 5.08 mm 5.08 mm
Maximum standby current - 0.02 A - 0.0006 A 0.02 A 0.0006 A 0.0006 A
Minimum standby current - 4.5 V - 2 V 4.5 V 2 V 2 V
Maximum slew rate - 0.155 mA - 0.105 mA 0.14 mA 0.12 mA 0.11 mA
Maximum supply voltage (Vsup) - 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) - 4.5 V - 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) - 5 V - 5 V 5 V 5 V 5 V
surface mount - NO - NO NO NO NO
technology - CMOS - CMOS CMOS CMOS CMOS
Temperature level - MILITARY - MILITARY MILITARY MILITARY MILITARY
Terminal surface - Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form - THROUGH-HOLE - THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch - 2.54 mm - 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location - DUAL - DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature - 20 - 20 20 20 20
width - 7.62 mm - 7.62 mm 7.62 mm 7.62 mm 7.62 mm

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