1210J-010 datasheet, PDF - EEWORLD Datasheet

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1210J-010: DescriptionANALOG ACCELEROMETER; File Size942KB，6 Pages; ManufacturerETC

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1210J-010 Overview

ANALOG ACCELEROMETER

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SILICON DESIGNS, INC

SENSOR:

Capacitive Micromachined

Nitrogen Damped

Hermetically Sealed

±4V Differential Output or

0.5V to 4.5V Single Ended Output

Fully Calibrated

Responds to DC & AC Acceleration

-55 to +125

C Operation

+5 VDC, 7 mA Power (typical)

Non-Standard g Ranges Available

Integrated Sensor & Amplifier

LCC or J-Lead Surface

Mount Package

Serialized for Traceability

RoHS Compliant

Model 1210

ANALOG ACCELEROMETER

ORDERING INFORMATION

Full Scale

Acceleration

±5 g

±10 g

±25 g

±50 g

±100 g

±200 g

±400 g

Hermetic Packages

20 pin LCC

20 pin JLCC

1210L-005

1210J-005

1210L-010

1210J-010

1210L-025

1210J-025

1210L-050

1210J-050

1210L-100

1210J-100

1210L-200

1210J-200

1210L-400

1210J-400

DESCRIPTION

The Model 1210 is a low-cost, integrated accelerometer for use in zero to medium frequency instrumentation

applications. Each miniature, hermetically sealed package combines a micro-machined capacitive sense element

and a custom integrated circuit that includes a sense amplifier and differential output stage. It is relatively insensitive

to temperature changes and gradients. Each device is marked with a serial number on its bottom surface for

traceability.

An optional calibration test sheet (1210-TST) is also available which lists the measured bias, scale factor,

linearity, operating current and frequency response

OPERATION

The Model 1210 produces two analog output voltages which vary with acceleration as shown in the figure below. The

outputs can be used either in differential or single ended mode referenced to +2.5 volts. Two reference voltages, +5.0

and +2.5 volts (nominal), are required; the output scale factor is ratiometric to the +5 volt reference voltage, and both

outputs at zero acceleration are equal to the +2.5 volt reference. The sensitive axis is perpendicular to the bottom

of the package, with positive acceleration defined as a force pushing on the bottom of the package.

APPLICATIONS

COMMERCIAL

Automotive

Air Bags

Active Suspension

Adaptive Brakes

Security Systems

Shipping Recorders

Appliances

INDUSTRIAL

Vibration Monitoring

Vibration Analysis

Machine Control

Modal Analysis

Robotics

Crash Testing

Instrumentation

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Silicon Designs, Inc.

1445 NW Mall Street, Issaquah, WA 98027-5344

Phone: 425-391-8329

Fax: 425-391-0446

web site:

www.silicondesigns.com

[page 1]

Apr 07

Model

1210

Analog Accelerometer

SOLDERING RECOMMENDATIONS (continued):

Reflow of Sn62 or Sn63 type solder using a hotplate is the preferred method for assembling the model 1210 surface mount

accelerometer to your Printed circuit board. Hand soldering using a fine tipped soldering iron is possible but difficult without

a steady hand and some form of visual magnification due to the small size of the connections. When using the hand solder

iron method, it’s best to purchase the J-Leaded version (1210J) for easier visual inspection of the finished solder joints.

Pre-Tinning of Accelerometer Leads is Recommended:

To prevent gold migration embrittlement of the solder joints,

it is best to pre-tin the accelerometer leads. We recommend tinning one lead at a time, to prevent excessive heating of

the accelerometer, using a fine-tipped solder iron and solder wire. The solder bath method of pre-tinning is not

recommended due to the high degree of heat the interior of the device gets subjected to which may cause permanent shifts

in the bias and/or scale factor.

Hotplate Attach Method using Solder Paste or Solder Wire:

Apply solder to the circuit board’s pads using Sn62 or Sn63

solder paste or pre-tin the pads using solder and a fine tipped soldering iron. If pre-tinning with an iron, apply flux to the

tinned pads prior to placing the components. Place the accelerometer in its proper position onto the pasted or tinned pads

then place the entire assembly onto a hotplate that has been pre-heated to 250EC. Leave on hotplate only long enough

for the solder to flow on all pads

(DO NOT OVERHEAT!)

Solder Iron Attach Method using Solder Paste:

Apply solder paste to the circuit board’s pads where the accelerometer

will be attached. Place the accelerometer in its proper position onto the pasted pads. Press gently on the top of the

accelerometer with an appropriate tool to keep it from moving and heat one of the corner pads, then an opposite corner

pad with the soldering iron. Make sure the accelerometer is positioned so all 20 of its connections are centered on the

board’s pads. Once the two opposite corner pads are soldered, the part is secure to the board and you can work your way

around soldering the remaining 18 connections. Allow the accelerometer to cool in between soldering each pin to prevent

overheating.

Solder Iron Attach Method using Solder Wire:

Solder pre-tin two opposite corner pads on the circuit board where the

accelerometer will be attached. Place the accelerometer in its proper position onto the board. Press gently on the top of

the accelerometer and heat one of the corner pads that was tinned and the part will drop down through the solder and seat

on the board. Do the same at the opposite corner pad that was tinned. Make sure the accelerometer is positioned so all

20 of its connections are centered on the board’s pads. Once the two opposite corner pads are soldered, the part is secure

to the board and you can work your way around soldering the remaining 18 connections. Allow the accelerometer to cool

in between soldering each pin to prevent overheating.

LCC & JLCC Solder Contact Plating Information:

The plating composition and thickness for the solder pads and

castellations on the “L” suffix (LCC) package are 60 to 225 micro-inches thick of gold (Au) over 80 to 350 micro-inches thick

of nickel (Ni) over a minimum of 5 micro-inches thick of moly-manganese or tungsten refractory material. The leads for

the “J” suffix (JLCC) package are made of an Iron-Nickel sealing alloy and have the same gold over nickel plating

thicknesses as for the LCC pads.

Recommended Solder Pad Pattern:

The recommended solder pad size and shape for both the LCC and J-LCC

packages is shown in the diagram and table below. These dimensions are recommendations only and may or may not

be optimum for your particular soldering process.

DIM

inch

.230

.430

.100

.033

.050

.013

.120

5.84

10.92

2.54

0.84

1.27

0.33

3.05

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Silicon Designs, Inc.

1445 NW Mall Street, Issaquah, WA 98027-5344

Phone: 425-391-8329

Fax: 425-391-0446

web site:

www.silicondesigns.com

[page 5]

Apr 07

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