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USB-A-D-F-W-TH1

Description
Telecom and Datacom Connector
CategoryThe connector    The connector   
File Size702KB,1 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Download Datasheet Parametric Compare View All

USB-A-D-F-W-TH1 Overview

Telecom and Datacom Connector

USB-A-D-F-W-TH1 Parametric

Parameter NameAttribute value
MakerSAMTEC
Reach Compliance Codecompliant
Connector typeUSB CONNECTOR
Base Number Matches1
F-212-1
USBR–A–S–F–O–TH
USB–AM–S–F–W–TH
USB–A–D–S–B–TH
USB–A–S–F–B–VU
USB-A, USBR-A, USB-AM SERIES
STANDARD & RUGGED USB 2.0
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?USB-A or
www.samtec.com?USBR-A
Insulator Material:
High Temperature
Thermoplastic
Contact Material:
Phosphor Bronze
Shell Material:
Copper Alloy
Plating:
Gold on Contacts,
Nickel on Shell, Tin on Tails
Operating Temp Range:
-50°C to +85°C
Current Rating:
1 A per contact
Voltage Rating:
30 VAC
Contact Resistance:
30 mΩ max
Cycles:
1500 (maximum number of
cycles tested)
Packaging:
Packaged and shipped in Bulk
Packaging Trays; Trays suitable
for automation are available
upon request.
RoHS Compliant:
Yes
Lead–Free Solderable:
–SM1=Yes
–TH, –VU & –VT=Yes
(Wave Solder only)
TID Numbers:
USB-A-D-X-X-TH (61001199)
USB-A-S-X-X-TH (61001180)
USB-A-S-X-X-SM2 (61001152)
USB-A-S-X-X-VT (61001153)
TYPE
A
SHELL
TYPE
PLATING
COLOR
TERMINATION
–S
USB
= Standard Connector
= Single
–F
= Gold Flash on Mating Area,
Tin on Tails
–B
= Black
–TH
= Through-hole
–D
= Double
(–TH option
only)
USBR
= Increased
Retention Connector
(Complies with Class 1,
DIV II minimum withdrawal
requirement of 15N.)
(16,40) .646
(6,90)
.272
–S
= 30µ" (0,76 µm)
Gold on Mating Area,
Tin on Tails
(12,50) .492
(5,12)
.202
01
–W
= White
–SM1
= Offset Surface Mount
–O
= Orange
(USBR
only)
(7,08)
.279
(2,84)
.112
–SM2
= Surface Mount
(5,72)
.225
–VU
= Upright, Through-Hole
01
(5,00)
.197
–SM2
(1,20)
.047 DIA
(19,20) .756
(2,00)
.079
01
(2,50)
.098
(10,40)
.409
–VT
= Vertical, Through-Hole
(USB only)
–TH
04
(12,50) .492
(5,81)
.229
01
(5,12)
.202
(14,50)
.571
(13,62)
.536
(5,12)
.202
(2,90)
.114
01
04
(14,22)
.560
(13,21)
.520
(0,10)
.004
(15,49)
.610
(11,26)
.443
(3,07)
.121
(7,10)
.280
–SM1
–VU
(11,58)
.456
(2,00)
.079
(7,00)
.276
(3,72)
.146
(2,50)
.098
(2,00)
.079
(10,72) .422
(3,00)
.118
–D (Requires –TH)
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?USB-AM
Insulator Material:
High Temperature
Thermoplastic
Contact Material:
Phosphor Bronze
Shell Material:
Copper Alloy
Plating:
Gold on Contacts,
Nickel on Shell, Tin on Tails
Operating Temp Range:
-50°C to +85°C
Current Rating:
1 A per contact
Voltage Rating:
30 VAC
Contact Resistance:
30 mΩ max
Cycles:
1500 (maximum
number of cycles tested)
Packaging:
Packaged and shipped in Bulk
Packaging Trays; Trays suitable
for automation are available
upon request.
RoHS Compliant:
Yes
Lead–Free Solderable:
–SM1=Yes
–TH=Yes (Wave Solder only)
TID Number:
USB-AM-S-X-X-SM (61001154)
USB
TYPE
SHELL
TYPE
PLATING
COLOR
TERMINATION
–AM
= A Type
(Plug)
(18,70) .736
(4,50)
.177
(14,60) .575
(17,60) .693
–S
= Single
–F
= Gold Flash on
Mating Area,
Tin on Tails
–B
= Black
–TH
= Through-hole
–W
= White
(18,80) .740
(4,52)
.178
(14,70) .579
(17,70) .697
–SM1
= Surface Mount
(2,62)
.103
(3,10)
.122
(2,00)
.079
01
(2,62) (2,87)
.103 .113
(2,00)
.079
–S
= 30µ" (0,76 µm)
Gold on Mating Area,
Tin on Tails
(1,00)
.039 DIA
(12,00)
.472
(2,00)
.079
01
(12,00)
.472
(4,55) (7,00)
.179 .276
(1,00)
.039 DIA
(12,00)
.472
(2,00)
.079
(4,60) .181
(12,50)
.492
(7,00)
.276
(2,00) .079
–SM1
(1,00) .039
–TH
(1,45) .057
WWW.SAMTEC.COM

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