Above ratings are based on the thermal resistances using a multi-layer circuit board (EIA/JESD51). For mounting on a mono-layer board, power derating shall be
needed. Please inquire of us about conditions.
*2)Total power consumption of all elements should not exceed the package power rating.
●
抵抗ネットワーク Resistor Networks
端子数
Number
of Pins
抵抗温度係数
T.C.R.
(×10
−6
/K)
T :±10
E :±25
C:±50
H:±100
T :±10
E :±25
C:±50
H:±100
T :±10
E :±25
C:±50
H:±100
抵抗温度係数
T.C.R.
(×10
−6
/K)
E :±25
C:±50
H:±100
E :±25
C:±50
H:±100
T :±10
E :±25
C:±50
H:±100
抵抗値範囲および絶対許容差
Resistance Range
(Ω)
E24 and Absolute Tolerance
B:±0.1% C:±0.25% D:±0.5% F :±1% G:±2%, J :±5%
510∼100k
100∼510k
51∼1M
51∼1M
30∼1M
10∼1M
510∼100k
510∼100k
100∼100k
51∼200k
51∼200k
30∼200k 10∼200k
1k∼30k
100∼100k
510∼30k
51∼200k
51∼200k
30∼200k 10∼200k
抵抗値範囲および絶対許容差
Resistance Range
(Ω)
E24 and Resistance Tolerance
B:±0.1% C:±0.25% D:±0.5% F :±1% G:±2%, J :±5%
―
―
―
―
R1=
.
150∼10k
100∼40k
―
―
―
1k∼40k
100∼150k
1k∼150k
51∼200k
51∼50k
R1 : R2=1 : 1∼1 : 4
R1 : R2=1 : 1∼1 : 2
パッケージ内トータル抵抗値最大50kΩ
Max. total resistance in a package 50kΩ
R1 : R2=1 : 1∼1 : 10
パッケージ内トータル抵抗値最大200kΩ
Max. total resistance in a package 200kΩ
相対抵抗値許容差
(オプション)
最小0.05%
相対T.C.R.
(オプション)
最小5×10
−6
/K
Relative Resistance Tolerance (Optional)
Minimum 0.05%
Relative T.C.R. (Optional)
Minimum 5×10
−6
/K
回路記号
Circuit Code
8, 14, 16
RIA
20, 24
RBA
RBB
8, 14, 16,
20, 24
回路記号
Circuit Code
端子数
Number
of Pins
16, 20
RDA
RTX
3
RTY
3
100∼150k
51∼200k
30∼200k
●
抵抗コンデンサネットワーク Resistor/Capacitor Networks
回路記号
Circuit Code
ACA
ACB
ACC
TFA, LFA
抵抗値範囲
Resistance Range
(Ω)
E12
抵抗値許容差
Resistance
Tolerance
静電容量範囲 Capacitance Range(pF)E12
TSSOP, QSOP
SOIC-N, W
T16, Q16
T20, Q20
T24, Q24
N08,N16,W16,W20
22∼120
22∼100
22∼150
22∼220
22∼220
22∼180
22∼120
22∼220
22∼220
静電容量許容差
Capacitance
Tolerance
22∼150
M:±20%
M:±20%
回路、パッケージによっては更に高い抵抗値、静電容量も可½です。 Depending on the circuit and package, much higher resistances and capacitances are possible.
カスタム品
(回路)
についてはお問い合わせ下さい。 Please inquire of us about your custom devices and circuits.
I followed the steps in the technical manual to add the SPI driver module to SEED-DVS8168 of Hezhongda. When executing insmod omap2_mcspi.ko, the error insmod: error inserting 'omap2_mcspi.ko': -1 Dev...
The on-site temperature and humidity are collected through PLC, and the water valve is adjusted according to the temperature PID and humidity PID to maintain the temperature and humidity of the worksh...
Hello, could you please recommend some classic e-books on PIC microcontrollers? I hope the e-books are mainly practical, and it would be best if you can tell me the download address, thank you...
Sailing is gaining more and more attention. How to use modern technology to assist training and improve competition results is particularly important. Considering the real-time data collection in t...[Details]
Microcontrollers (MCUs), which are widely used in automotive electronics, are rapidly facing time and cost pressures. The main advantage of using MCUs has always been to create high-level system in...[Details]
I. Introduction
In the field of power conversion, isolated converters (forward, flyback, and double-ended) with low output DC voltage all use MOSFET as the rectifier device. Since these devi...[Details]
With the continuous improvement of the requirements of intelligent building security systems and the continuous improvement of people's safety awareness, indoor anti-theft has gradually attracted peop...[Details]
With the rapid development of urban economy, elevators are increasingly used as a vertical transportation tool. However, elevator fault detection and maintenance, especially the role of elevator remot...[Details]
1. Principle of displacement angle sensor
The angle sensor is used to detect angles. It has a hole in its body that fits the LEGO axle. When connected to the RCX, the angle sensor counts once ...[Details]
1. Overview
The Virtual CAN Interface (VCI) function library is an application program interface specifically provided for the use of ZLGCAN devices on PCs. The functions in the library ar...[Details]
1. Project Introduction
Shandong Dezhou Xingtai Paper Co., Ltd. is a newly built high-end paperboard production enterprise with domestic leading level established by Shandong Zhaodongfang Pape...[Details]
LED is the abbreviation of light emitting diode, which is an electric light source made of semiconductor technology. The core part of LED is a chip composed of P-type semiconductor and N-type semi...[Details]
Problems such as the depletion of natural resources, air pollution, traffic congestion, and rising fossil fuel prices have forced societies and individuals to seek alternative means of transportati...[Details]
Motors, especially those with brushes, generate a lot of noise. This noise must be dealt with if the appliance is to meet the requirements of EMC standards. The means to solve EMC are nothing more ...[Details]
It is well known to automotive suppliers that automakers are demanding more from their supply base. For connector suppliers, this means stricter requirements for product performance, stability and ...[Details]
The era of mobile access to the Internet has arrived, and it will rapidly change the business and infrastructure needs of mobile operators under a whole new trend of requirements. We need 4G LTE to...[Details]
LED technology has made rapid progress, and improvements in chip design and materials have promoted the development of brighter and more durable light sources, and the scope of light source applica...[Details]
Corelink Semiconductor has launched the CL1100-based 5-7W E27 LED lighting driver system solution DB2. This driver module meets the requirements of small size (L×W×H=5.1cm×2.1cm×1.8cm), low standby...[Details]