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BR24C02-10TU-2.7E2

Description
EEPROM, 256X8, Serial, CMOS, PDSO8
Categorystorage    storage   
File Size294KB,6 Pages
ManufacturerROHM Semiconductor
Websitehttps://www.rohm.com/
Environmental Compliance
Download Datasheet Parametric Compare View All

BR24C02-10TU-2.7E2 Overview

EEPROM, 256X8, Serial, CMOS, PDSO8

BR24C02-10TU-2.7E2 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerROHM Semiconductor
package instructionTSSOP, TSSOP8,.25
Reach Compliance Codeunknown
Data retention time - minimum100
Durability1000000 Write/Erase Cycles
I2C control byte1010DDDR
JESD-30 codeR-PDSO-G8
memory density2048 bit
Memory IC TypeEEPROM
memory width8
Number of terminals8
word count256 words
character code256
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256X8
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialSERIAL
power supply3/5 V
Certification statusNot Qualified
Serial bus typeI2C
Maximum standby current0.000004 A
Maximum slew rate0.003 mA
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL
write protectHARDWARE
Base Number Matches1

BR24C02-10TU-2.7E2 Related Products

BR24C02-10TU-2.7E2 BR24C01A-10TU-2.7E1 BR24C01A-10TU-2.7E2 BR24C02-10TU-2.7E1
Description EEPROM, 256X8, Serial, CMOS, PDSO8 EEPROM, 128X8, Serial, CMOS, PDSO8 EEPROM, 128X8, Serial, CMOS, PDSO8 EEPROM, 256X8, Serial, CMOS, PDSO8
Is it Rohs certified? conform to conform to conform to conform to
Maker ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor
package instruction TSSOP, TSSOP8,.25 TSSOP, TSSOP8,.25 TSSOP, TSSOP8,.25 TSSOP, TSSOP8,.25
Reach Compliance Code unknown unknown unknown unknown
Data retention time - minimum 100 100 100 100
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C control byte 1010DDDR 1010DDDR 1010DDDR 1010DDDR
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
memory density 2048 bit 1024 bit 1024 bit 2048 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8
Number of terminals 8 8 8 8
word count 256 words 128 words 128 words 256 words
character code 256 128 128 256
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
organize 256X8 128X8 128X8 256X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP TSSOP TSSOP
Encapsulate equivalent code TSSOP8,.25 TSSOP8,.25 TSSOP8,.25 TSSOP8,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL SERIAL SERIAL
power supply 3/5 V 3/5 V 3/5 V 3/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Serial bus type I2C I2C I2C I2C
Maximum standby current 0.000004 A 0.000004 A 0.000004 A 0.000004 A
Maximum slew rate 0.003 mA 0.003 mA 0.003 mA 0.003 mA
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.635 mm 0.635 mm 0.635 mm 0.635 mm
Terminal location DUAL DUAL DUAL DUAL
write protect HARDWARE HARDWARE HARDWARE HARDWARE
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