IC,TEMPERATURE SENSOR,DIP,8PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Linear ( ADI ) |
| package instruction | DIP8,.3 |
| Reach Compliance Code | unknown |
| JESD-609 code | e0 |
| Installation features | THROUGH HOLE MOUNT |
| Number of terminals | 8 |
| Maximum working current | 0.2 mA |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| Encapsulate equivalent code | DIP8,.3 |
| Package Shape/Form | RECTANGULAR |
| power supply | 5 V |
| Filter level | 38535Q/M;38534H;883B |
| surface mount | NO |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Base Number Matches | 1 |
| LT1025MJ8/883 | LT1025AMJ8/883 | |
|---|---|---|
| Description | IC,TEMPERATURE SENSOR,DIP,8PIN,CERAMIC | IC,TEMPERATURE SENSOR,DIP,8PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Linear ( ADI ) | Linear ( ADI ) |
| package instruction | DIP8,.3 | DIP8,.3 |
| Reach Compliance Code | unknown | unknown |
| JESD-609 code | e0 | e0 |
| Installation features | THROUGH HOLE MOUNT | THROUGH HOLE MOUNT |
| Number of terminals | 8 | 8 |
| Maximum working current | 0.2 mA | 0.2 mA |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC |
| Encapsulate equivalent code | DIP8,.3 | DIP8,.3 |
| Package Shape/Form | RECTANGULAR | RECTANGULAR |
| power supply | 5 V | 5 V |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| surface mount | NO | NO |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |