4.2 Power Conversion Overview .............................................................................................................................................. 12
4.3 Power Management Overview............................................................................................................................................ 13
5.5 Soft Start Delay and Ramp Times ...................................................................................................................................... 18
5.6 Power Good ........................................................................................................................................................................ 19
5.7 Switching Frequency and PLL ........................................................................................................................................... 20
5.8 Power Train Component Selection ..................................................................................................................................... 21
5.9 Current Limit Threshold Selection ..................................................................................................................................... 25
5.15 Adaptive Frequency Control ............................................................................................................................................... 30
6. Power Management Functional Description .............................................................................................................................. 31
6.6 Voltage Tracking ................................................................................................................................................................ 33
6.7 Voltage Margining .............................................................................................................................................................. 34
6.10 Digital-DC Bus ................................................................................................................................................................... 36
6.14 Temperature Monitoring Using the XTEMP Pin ................................................................................................................ 38
6.15 Active Current Sharing ....................................................................................................................................................... 38
6.19 Non-Volatile Memory and Device Security Features ......................................................................................................... 41
8. Ordering Information ................................................................................................................................................................. 43
9. Related Tools and Documentation ............................................................................................................................................. 43
10. Revision History ........................................................................................................................................................................ 44
1.
2.
3.
4.
FN6850 Rev. 1.00
December 15, 2010
Page 3 of 45
ZL2006
1. Electrical Characteristics
Table 1. Absolute Maximum Ratings
Operating beyond these limits may cause permanent damage to the device. Functional operation beyond the
Recommended Operating Conditions is not implied. Voltage measured with respect to SGND.
Parameter
DC supply voltage
MOSFET drive reference
2.5 V logic reference
Pin
VDD
VR
V25
CFG, DLY(0,1), DDC, EN, FC(0,1),
ILIM(0,1), MGN, PG, SA(0,1),
SALRT, SCL, SDA, SS, SYNC,
UVLO, V(0,1)
ISENB, VSEN, VTRK, XTEMP
ISENA
BST
BST - SW
GH
GL
SW
SW
DGND – SGND, PGND - SGND
–
–
All
Value
- 0.3 to 17
- 0.3 to 6.5
120
- 0.3 to 3
120
- 0.3 to 6.5
- 0.3 to 6.5
- 1.5 to 30
- 0.3 to 30
- 0.3 to 8
(V
SW
-0.3) to (V
BST
+0.3)
(PGND-0.3) to (VR+0.3)
(PGND-0.3) to 30
(PGND-5) to 30
- 0.3 to 0.3
- 55 to 150
- 55 to 150
300
Unit
V
V
mA
V
mA
V
V
V
V
V
V
V
V
V
V
°C
°C
°C
Logic I/O voltage
Analog input voltages
High side supply voltage
Boost to switch voltage
High side drive voltage
Low side drive voltage
Switch node continuous
Switch node transient (<100ns)
Ground differential
Junction temperature
Storage temperature
Lead temperature
(Soldering, 10 s)
Table 2. Recommended Operating Conditions and Thermal Information
Parameter
Symbol
Min
Input supply voltage range, V
DD
(See Figure 9)
Output voltage range
1
Operating junction temperature range
Junction to ambient thermal impedance
2
Junction to case thermal impedance
3
Notes:
V
DD
tied to V
R
3.0
4.5
0.54
- 40
–
–
Typ
–
–
–
–
35
5
Max
5.5
14
5.5
125
–
–
Unit
V
V
V
°C
°C/W
°C/W
V
R
floating
V
OUT
T
J
Θ
JA
Θ
JC
1. Includes margin limits
2. Θ
JA
is measured in free air with the device mounted on a multi-layer FR4 test board and the exposed metal pad
soldered to a low impedance ground plane using multiple vias.
3. For Θ
JC
, the “case” temperature is measured at the center of the exposed metal pad
FN6850 Rev. 1.00
December 15, 2010
Page 4 of 45
ZL2006
Table 3. Electrical Specifications
V
DD
= 12 V, T
A
= -40C to 85C unless otherwise noted. Typical values are at T
A
= 25C.
Parameter
Input and Supply Characteristics
I
DD
supply current at f
SW
= 200 kHz
I
DD
supply current at f
SW
= 1.4 MHz
I
DDS
shutdown current
VR reference output voltage
V25 reference output voltage
Output Characteristics
Output voltage adjustment range
1
Output voltage set-point resolution
Output voltage accuracy
3
VSEN input bias current
Current sense differential input
voltage (ground referenced)
Current sense differential input
voltage (V
OUT
referenced)
(V
OUT
must be less than 4.0 V)
Current sense input bias current
Current sense input bias current
(V
OUT
referenced, V
OUT
< 4.0 V)
Soft start delay duration range
4
GH, GL no load;
MISC_CONFIG[7] = 1
EN = 0 V
2
No I C/SMBus activity
V
DD
> 6 V, I
VR
< 50 mA
V
R
> 3 V, I
V25
< 50 mA
V
IN
> V
OUT
Set using resistors
Set using I
2
C/SMBus
Includes line, load, temp
VSEN = 5.5 V
V
ISENA
- V
ISENB
V
ISENA
- V
ISENB
Ground referenced
ISENA
ISENB
Set using DLY pin or resistor
Set using I
2
C/SMBus
Turn-on delay (precise mode)
4,5
–
Turn-on delay (normal mode)
6
Turn-off delay
6
Set using SS pin or resistor
Set using I
2
C
–
–
–
4.5
2.25
0.6
–
–
-1
–
- 100
- 50
- 100
-1
- 100
2
0.002
16
25
6.5
5.2
2.5
–
10
±0.025
–
110
–
–
30
50
8
5.5
2.75
5.0
–
–
1
200
100
50
mA
mA
mA
V
V
V
mV
% FS
2
%
µA
mV
mV
µA
µA
µA
ms
s
ms
ms
ms
ms
ms
µs
Conditions
Min
Typ
(Note 10)
Max
(Note 10)
Unit
Soft start delay duration accuracy
–
0
0
–
Soft start ramp duration range
Soft start ramp duration accuracy
Notes:
100
–
1
–
100
–
–
200
–
500
±0.25
-
–
–
–
0.25/+4
–
-
0.25/+4
200
–
200
–
100
–
1. Does not include margin limits.
2. Percentage of Full Scale (FS) with temperature compensation applied.
3. V
OUT
measured at the termination of the VSEN+ and VSEN- sense points.
4. The device requires a delay period following an enable signal and prior to ramping its output. Precise timing mode limits this delay
period to approx 2 ms, where in normal mode it may vary up to 4 ms.
5. Precise ramp timing mode is only valid when using EN pin to enable the device rather than PMBus enable.
6. The devices may require up to a 4 ms delay following the assertion of the enable signal (normal mode) or following the de-assertion
Software platform : MounRiver Studio (MRS); Hardware platform : CH32V307 development board
First go to Code Cloud and clone the source code:
https://gitee.com/openharmony/kernel_liteos_m
Create a new ...
Introduction: The AD7877 touch screen controller is a 12-bit successive approximation ADC with a synchronous serial interface and low on-resistance switches for driving touch screens....
DSP cmd file stores code and data in external memory. When debugging and running, it will enter an illegal interrupt [b]interrupt void ILLEGAL_ISR(void)[/b] when calling time(NULL) or srand() or rand....
I am currently using a 6410+wince6 platform. I changed the content in the RTC. I used the CPU RTC before. Now we have added an external RTC, and I read and write it through iic. Question 1: If I use t...
In June 2014, the Ministry of Industry and Information Technology issued 4G FD-LTE licenses to China Unicom and China Telecom. Together with the 4G TD-LTE licenses issued to China Mobile, China Uni...[Details]
Magna's integrated in-cabin perception system fuses vision and millimeter-wave radar data to detect the presence of passengers, identify stranded children, monitor driver fatigue and vital signs, a...[Details]
MQTT Ethernet I/O modules primarily collect I/O port information and transmit data over the network. In addition to being a TCP server, Ethernet I/O modules can also function as TCP clients. Furthe...[Details]
The driving mode is not unfamiliar to vehicles. According to the driving mode of the vehicle, there are front-wheel drive, rear-wheel drive and even four-wheel drive. Four-wheel drive is a major se...[Details]
Analog Devices held a third-quarter fiscal 2025 earnings conference call. Vincent T. Roche, CEO and Chairman of the Board, and Richard C. Puccio, Executive Vice President and Chief Financial Office...[Details]
I believe everyone has heard of memory. If your computer is slow, your experts may recommend upgrading it to a larger capacity. But what exactly is computer memory used for? Why does memory capacit...[Details]
When we pick up an unfamiliar object, the first thing we want to know is what it actually does. A drive shaft, as the name suggests, is a shaft that transmits power. It's the transmission medium th...[Details]
With the global number of new energy vehicles expected to exceed 45 million by 2025, the performance boundaries of battery management systems are being reshaped.
Infineon Technologies
'
...[Details]
Relying on Zena CSS and Arm's complete partner ecosystem, we will accelerate the implementation of autonomous driving.
Close your eyes and imagine yourself getting into your car, rea...[Details]
Perhaps due to the stereotypes surrounding electronic products, many owners of pure electric vehicles have questions about charging. What's the correct way to charge? How can charging slow down bat...[Details]
introduction
With the continuous development of electronic technology and the continuous upgrading of medical equipment, the demand for medical liquid infusion precision is becoming increasing...[Details]
How do the maps used by self-driving cars differ from the maps we use daily, such as those from AutoNavi and Baidu? AutoNavi and Baidu create maps for humans, while high-precision map companies cre...[Details]
On August 18, Tencent Holdings released its second-quarter 2025 results last week, with revenue of 184.504 billion yuan, a year-on-year increase of 15% and a month-on-month increase of 2%; profit a...[Details]
Today, we'll discuss why contactors shouldn't be connected to the output terminals of VFDs. This is because if the contactor at the VFD output isn't engaged, it will only engage when the VFD starts...[Details]
/*This code has been verified on the 51 MCU. The 51 is an 8-bit MCU. char occupies 1 byte and long occupies 4 bytes*/
int main(void)
{
unsigned long iii;
...[Details]
MCU
京公网安备 11010802033920号
EEWORLD
