MULTILAYER
MHI
SPEER ELECTRONICS, INC.
CERAMIC INDUCTOR
MULTILAYER CERAMIC INDUCTOR
- Monolithic structure provides high reliability in
a wide temperature and humidity range
- FHigh quality ceramic material and unique
manufacturing process provides high Q at
high frequency
- Standard EIA packages: 0402, 0603, 0805
- Nickel barrier with solder overcoat for excel
lent solderability
CHIP
INDUCTORS
DIMENSIONS [In (mm)]
TYPE
0402
0603
0805
L
0.039±0.004
(1.00±0.10)
0.063±0.006
(1.60±0.15)
0.079±0.008
(2.000.20)
W
0.02±0.004
(0.50±0.10)
0.031±0.006
(0.80±0.15)
0.0490.008
(1.250.20)
H
0.02±0.004
(0.50±0.10)
0.031±0.006
(0.80±0.15)
0.035±0.008
(0.900.20)
P
0.01±0.004
(0.25±0.10)
0.0140.006
(0.36±0.15)
0.0200.010
(0.510.25)
ORDERING & SPECIFYING INFORMATION*
MHI
Type
0603
Size Code
C
Material
TE
Packaging
3N9
Nominal
Inductance
3N9 = 3.9
µ
H
R10 = 100
µ
H
S
Tolerance
0402
0603
0805
Permability
Code:
C
TE: 7” Embossed Plastic
TED: 13” Embossed
Plastic
Non: Bulk
S:±0.3%
T:±3%
J:±10%
K:±10%
M:±20%
*Please Note: KSE’s Part Numbers Do Not Contain any Spaces or Hyphens.
TELEPHONE:
814-362-5536
73
FAX:
814-362-8883
MULTILAYER FERRITE
MCB/MCP/MCI/MHI
SPEER ELECTRONICS, INC.
INDUCTOR
ENVIRONMENTAL & MECHANICAL CHARACTERISTICS
PARAMETER
Operating Temperature
Storage Temperature
-55
0
C+125
0
C
40
0
C @ 70% Humidity.
Sealed plastic bags withdesiccant
shall be used to reduce the potential
of oxidation on the terminations dur-
ing storage
Flux:
5-10 sec dip
After Flux:
Air dry for 15 sec
Preheat:
1 50
0
C
±1
0ºC
Preheat Time:
60 sec
Solder Temp:
260ºC
±5ºC
Dip Time:
10
±1
sec
Flux:
5-10 sec dip
After Flux:
Air dry for 15 sec
Solder Temp:
245ºC
±5
0
C
Dip Time:
5
±0.5
sec
The bead shall be subjected to
the following 5 steps for the period of
time shown below. The 5 steps
constitute one (1) rotation.
4 rotations shall be carried out.
1) Flux:
5-10 sec
2) After Flux:
Air dry for 15 sec
3) Solder Temp:
230ºC
±5ºC
4) Dip Time:
5
±0.5
sec
5 )Cool:
Air cool for 60 seconds
REQUIREMENT
TEST METHOD
Resistance to
Solder Heat
Change in Impedance:
Relative
to value before test
±20%.
Appearance: There shall be no cracking
Solder Coverage:
More than 75% of the terminal
electrode shall be covered with solder.
CHIP
INDUCTORS
Solderability
Solder Coverage:
More than 95% of the
termination shall be covered with solder.
Leach Resistance
Appearance:
There shall be no visible signs
of physical or mechanical damage (i.e. no cracks).
Terminations:
Termination must not be leached
away for more than 5%.
Insulation Resistance
Solvent Resistance
Insulation Resistance:
Mm 1G ohms
Change in Impedance:
Relative to value
before test
±10%.
Cleaning by:
Washer:
Ultrasonic washer
(100W)
Solvent:
Isopropyl alcohol
Time:
3 minutes
Type
0402
0603
0805
1206
Type
0402
0603
0805
1206
W(kgf)
0.5
1 .0
1.5
W(kgf)
1.4
1.8
2.3
Time
NA
30 sec
±2
sec
30 sec
±2
sec
30 sec
±2sec
Time
NA
60 sec
60 sec
60 sec
Terminal Strength
(hanging test)
Appearance:
The terminal electrode shall not
break off, nor shall there be damage to the body.
Terminal Strength
(push test)
Appearance:
There shall be no evidence of
mechanical degradations to terminals or body.
TELEPHONE:
814-362-5536
76
FAX:
814-362-8883
MULTILAYER FERRITE
MCB/MCP/MCI/MHI
SPEER ELECTRONICS, INC.
INDUCTOR
ENVIRONMENTAL & MECHANICAL CHARACTERISTICS
Item
Bending Strength
Requirement
Appearance:
There shall be no physical or
mechanical damage.
Impedance:
Relative to initial value before
test
±10%
Appearance:
There shall be no physical or
mechanical damage.
Impedance: Relative to initial value
before test
±10%
Impedance:
Relative to initial value
±10%.
Conditions
Board: 90x40x1 .6mm
Bend:
1mm
Time:
5 sec
Mechanical Shock
Vibration
`
Only endurance conditioning by
sweeping shall be made. The entire
frequency range from 10-2,000Hz
return to10Hz in 20 minutes (this
shall constitute one cycle).
Amplitude:1.5mm
The test shall have a 1 SC peak and
Shall be applied for a period of 4
hours (12 cycles) in each of 3 m
mutually perpendicular directions (a t
total of 36 cycles within a total of 12
hours).
Step
Temperature
1-start
-40ºC
±200
2-hold
-40ºC
±200
3-transfer
4-hold
+1050º
±200
5-transfer
Time
30 mm
±5
mm
0.5 mm max.
30 mm
±5
mm
0.5 mm max.
Thermal Shock
Appearance:
There shall be no physical or
mechanical damage.
Impedance:
Relative to initial value
±20%.
DCR: The DOR shall not exceed initial
specified value.
Testing of the parts will be made at 0 hours,
250 hours and 500 hours. Before testing, t
he parts shall be allowed to cool to room
temperature for 24 hours.
Steps 1 thru 5 constitute one complete
cycle and the test shall consist of a
total of 500 cycles.
Temperature:
85ºC
±200
Relative Humidity:
85%
Time:
1,000 hours total
Apply:
1 OO%rated current
Load Humidity
Appearance:
There shall be no physical or
mechanical damage.
Impedance:
Relative to initial value
±15%.
Measurements shall be taken at 0 hours,
250 hours, 500 hours and 1,000 hours and
shall meet the conditions stated above.
Life Test
Appearance:
There shall be no physical or
mechanical damage
Impedance:
Relative to initial value
±15%
Measurements shall be taken at 0 hours,
250 hours, 5OO hours and 1,000 hours and
shall meet the conditions stated above.
Temperature:
85ºC
±2ºC
Time:
1,000 hours total
Apply:
100% rated current
TELEPHONE:
814-362-5536
77
FAX:
814-362-8883
CHIP
INDUCTORS
Force:
5OC
Time:
11 msec
There shall be 3 shocks in each of -
6 directions (18 shocks total).me
MCU
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