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MMD835-E28X

Description
SILICON, STEP RECOVERY DIODE, CERAMIC PACKAGE-2
CategoryDiscrete semiconductor    diode   
File Size609KB,8 Pages
ManufacturerMACOM
Websitehttp://www.macom.com
Download Datasheet Parametric View All

MMD835-E28X Overview

SILICON, STEP RECOVERY DIODE, CERAMIC PACKAGE-2

MMD835-E28X Parametric

Parameter NameAttribute value
MakerMACOM
package instructionCERAMIC PACKAGE-2
Reach Compliance Codecompliant
ECCN codeEAR99
Minimum breakdown voltage15 V
ConfigurationSINGLE
Maximum diode capacitance0.81 pF
Minimum diode capacitance0.58 pF
Diode component materialsSILICON
Diode typeSTEP RECOVERY DIODE
JESD-30 codeR-CDSO-G2
JESD-609 codee4
Number of components1
Number of terminals2
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
surface mountYES
Terminal surfaceGOLD
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
Silicon Step Recovery Diodes
Description
The diodes feature fully passivated, true mesa construction for
sharp transitions and improved stability. The beam lead SRDs
have the industry’s fastest transition times for millimeter wave
multiplication and picosecond pulse forming.
Features
Output combs to 40+ GHz
Transition times down to 35 ps
Screening per MIL-PRF-19500
and MIL-PRF-38534 available
Absolute Maximum Ratings
(Chip and Beam Lead)
Parameters
Reverse Voltage
Forward Current
Rated V
BR
50 mA (Beam Lead)
150 mA (Chip)
Power Dissipation
150
°C
/
JC
Rating
at T
HSK
= +25
°C
Derate linearly to zero at T
HSK
= +175
°C
Junction Temperature
Storage Temperature
Mounting / Bonding Temperature
-65
°C
to +175
°C
-65
°C
to +175
°C
+235
°C
for 10 seconds (Beam Lead)
+310
°C
for 30 seconds (Chip)
Chip and Beam Lead
V
BR
C
J
MIN
pF
C
J
MAX
pF
MIN
ns
TYP
ns
t
t
TYP
ps
t
t
MAX
ps
F
CO
TYP
GHz
JC
Model
MMDB30-B1
1
MMDB35-B1
1
MMDB45-B1
1
MMD805-C1
2
MMD810-C1
2
MMD820-C1
2
MMD830-C1
1
MMD832-C1
1
MMD835-C1
1
MMD837-C1
1
MMD840-C1
1
MIN
V
MAX
°C/W
Package
B1
1
B1
1
B1
1
C1
2
C1
2
C1
2
C1
1
C1
1
C1
1
C1
1
C1
1
1
4
16
25
60
50
40
25
20
1
5
20
1
5
I
R
=
10 A
0.1
5
0.1
3
0.1
1
2.5
1.5
1.0
0.5
0.4
0.3
0.2
0.2
0.25
0.20
0.20
3.5
2.5
1.7
1.0
0.8
0.7
0.4
0.4
1.0
1.0
3.0
80
40
30
1
5
10
10
5
7
4.0
4.0
8.0
100
70
60
30
1
5
20
10
1
5
30
35
45
250
200
80
60
60
60
60
60
I
F
= 3 mA
V
R
= 7 V
38
45
58
300
250
100
80
80
70
70
70
530
482
410
1
30
200
390
700
660
800
1,300
880
F
CO
=
1 / 2 R
S
600
600
600
1
5
22
25
45
50
60
60
60
I
F
= 10 mA
Test Conditions
V
R
= 6 V
F = 1 MHz
I
R
= 6 mA
Measured at
50% Recovery
I
F
= 10 mA
V
R
= 10 V
Revision Date: 09/23/05
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