Connector bottom: Create any thru-hole pattern wiring.
PRODUCT TYPES
Stacking height
No. of contacts
20
24
26
30
34
40
50
60
70
80
100
Part No.
Socket
AXK720145∗
AXK724145∗
AXK726145∗
AXK730145∗
AXK734145∗
AXK740145∗
AXK750145∗
AXK760145∗
AXK770145∗
AXK780145∗
AXK700145∗
Header
AXK820145∗
AXK824145∗
AXK826145∗
AXK830145∗
AXK834145∗
AXK840145∗
AXK850145∗
AXK860145∗
AXK870145∗
AXK880145∗
AXK800145∗
Inner carton (1-reel)
Packing
Outer carton
1.5 mm
Note 1)
“Asterisk” mark on end of part No.;
J: 3,000 pieces
V: 3,000 pieces
Note 1)
“Asterisk” mark on end of part No.;
J: 6,000 pieces
V: 15,000 pieces
Notes) 1. Regarding ordering units: During production, Please make orders in 1-reel units. Samples for mounting confirmation: Please consult us. (See “Regarding sample
orders to confirm proper mounting” on page 9.) Samples: Small lot orders are possible.
2. The standard type comes with no positioning bosses. Connectors with positioning bosses are available for on-demand production. For this type of connector, 8th
digit of the part no. changes from 4 to 3. e.g. Stacking height 1.5mm 20 contacts for sockets: AXK720135J
3. Connectors with holding metal are available for on-demand production.
13
AXK(7/8)
SPECIFICATIONS
1. Characteristics
Item
Rated current
Rated voltage
Breakdown voltage
Insulation resistance
Contact resistance
Composite insertion force
Mechanical
characteristics
Composite removal force
Post holding force
Ambient temperature
Soldering heat resistance
Specifications
0.3A/contact (Max. 5 A at total contacts)
60V AC/DC
150V AC for 1 minute
Min. 1,000MΩ (initial)
Max. 70mΩ
Max. 0.981N {100gf}/contacts
×
contacts (initial)
Min. 0.0588N {6gf}/contacts
×
contacts
Min. 0.981N {100gf}/contact
–55°C to +85°C
Max. peak temperature of 245°C
300°C within 5 seconds
Measures the maximum load in the post axial direction
until removal
No freezing at low temperatures
Infrared reflow soldering
Soldering iron
Sequence
1
2
3
4
Temperature (°C)
–55
+0
−3
25
+10
−5
85
+3
−0
25
+10
−5
Time (minutes)
30
Max. 5
30
Max. 5
Conditions
Electrical
characteristics
Detection current: 1mA
Using 250V DC megger (applied for 1 min.)
Measured based on the HP4338B measurement method
of JIS C 5402
Thermal shock resistance
(header and socket mated)
Environmental
characteristics
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H
2
S resistance
(header and socket mated)
Insertion and removal life
120 hours, insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
24 hours, insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
48 hours,
50 times
Stacking height 1.5mm, 20 contacts; Socket: 0.04g
Header: 0.02g
contact resistance max. 70mΩ
Bath temperature 40±2°C, humidity 90 to 95% R.H.
Bath temperature 35±2°C, saltwarter concentration 5±1%
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
hours
Unit weight
2. Material and surface treatment
Part name
Molded portion
Contact/Post
Material
Heat-resistant resin (UL94V-0), Black
Copper alloy
Surface treatment
—
Contact portion: Au plating over Ni
Terminal portion: Au plating over Ni (Except for thick of terminal)
DIMENSIONS
• Socket (stacking height: 1.5mm)
A
B
±0.1
(0.675)
0.40
±0.05
0.40
±0.05
0.15
±0.03
1.50
1.11
(Suction face)
4.10
0.08
mm General tolerance ±0.2
Dimension table (mm)
No. of
contacts
20
24
26
30
34
40
50
60
70
80
100
A
6.3
7.1
7.5
8.3
9.1
10.3
12.3
14.3
16.3
18.3
22.3
B
3.6
4.4
4.8
5.6
6.4
7.6
9.6
11.6
13.6
15.6
19.6
0.10±0.03
• Header (stacking height: 1.5mm)
A
B
±0.1
0.40
±0.05
0.40
±0.05
0.15
±0.03
1.20
(Suction face)
2.76
3.96
1.31
0.08
(0.29)
(0.675)
3.75
5.10
Dimension table (mm)
No. of
contacts
20
24
26
30
34
40
50
60
70
80
100
A
5.1
5.9
6.3
7.1
7.9
9.1
11.1
13.1
15.1
17.1
21.1
B
3.6
4.4
4.8
5.6
6.4
7.6
9.6
11.6
13.6
15.6
19.6
2.19
0.10±0.03
14
(0.29)
3.38
3.96
AXK(7/8)
• Socket and header are mated
Stacking height 1.5 mm
1.50
±0.15
EMBOSSED TAPE DIMENSIONS
Please refer to page 56.
NOTES
1. As shown below, excess force dur-
ing insertion may result in damage to
the connector or removal of the solder.
Please be careful. Also, to prevent
connector damage plese confirm the
correct position before mating con-
nectors.
• Socket
Recommended PC board pattern
(TOP VIEW)
0.40
±0.05
0.40
±0.05
0.23
±0.03
• Header
Recommended PC board pattern
(TOP VIEW)
0.40
±0.05
0.23
±0.03
0.40
±0.05
3.50
±0.05
5.70
±0.05
0.115
0.40
±0.05
±0.05
0.115
±0.05
0.40
±0.05
B
±0.05
2. Keep the PC board warp no more
than 0.03 mm in relation to the overall
length of the connector.
B
±0.05
Recommended metal mask pattern
Metal mask thickness: Here, 150 µm
(Opening area ratio: 40%)
0.40
±0.01
0.20
±0.01
(0.51)
0.35
±0.01
0.10
±0.01
Recommended metal mask pattern
Metal mask thickness: Here, 150 µm
(Opening area ratio: 32%)
0.40
±0.01
0.20
(0.30)
±0.01
Max. 0.03mm
Max. 0.03mm
3. PC Boards and Recommended
Metal Mask Patterns
Connectors are mounted with high den-
sity, with a pitch interval of 0.4 to 0.5 mm.
It is therefore necessary to make sure
that the right levels of solder are used, in
order to reduce solder bridge and other
issues. The figures to the right are recom-
mended metal mask patterns. Please use
them as a reference.
4.10
±0.01
5.50
±0.01
4.48
±0.01
3.50
±0.01
Recommended metal mask pattern
Metal mask thickness: Here, 120 µm
(Opening area ratio: 50%)
0.40
±0.01
0.20
±0.01
(0.63)
0.35
±0.01
0.10
±0.01
(0.51)
Recommended metal mask pattern
Metal mask thickness: Here, 120 µm
(Opening area ratio: 40%)
0.40
±0.01
0.20
(0.37)
±0.01
(0.30)
4.10
±0.01
5.50
±0.01
4.24
±0.01
3.36
±0.01
* See the dimension table on page 14 for more information on the B dimension of the socket and header.
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