Analog Waveform Generation Function, MOS, CDIP48,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Thomson Electron Tubes & Devices Corp. |
| package instruction | DIP, DIP48,.6 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T48 |
| JESD-609 code | e0 |
| Number of terminals | 48 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP48,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | MOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| TS68230MC8 | TS68230VE8 | TS68230CE8 | TS68230ME8 | |
|---|---|---|---|---|
| Description | Analog Waveform Generation Function, MOS, CDIP48, | Analog Waveform Generation Function, MOS, CQCC52, | Analog Waveform Generation Function, MOS, CQCC52, | Analog Waveform Generation Function, MOS, CQCC52, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP48,.6 | QCCN, LCC52,.75SQ | QCCN, LCC52,.75SQ | QCCN, LCC52,.75SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T48 | S-XQCC-N52 | S-XQCC-N52 | S-XQCC-N52 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Number of terminals | 48 | 52 | 52 | 52 |
| Maximum operating temperature | 125 °C | 85 °C | 70 °C | 125 °C |
| Minimum operating temperature | -55 °C | -40 °C | - | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | QCCN | QCCN | QCCN |
| Encapsulate equivalent code | DIP48,.6 | LCC52,.75SQ | LCC52,.75SQ | LCC52,.75SQ |
| Package shape | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| Package form | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | YES |
| technology | MOS | MOS | MOS | MOS |
| Temperature level | MILITARY | INDUSTRIAL | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | QUAD | QUAD |
| Maker | Thomson Electron Tubes & Devices Corp. | - | Thomson Electron Tubes & Devices Corp. | Thomson Electron Tubes & Devices Corp. |
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