MCP1711
150 mA Ultra-Low Quiescent Current, Capacitorless LDO Regulator
Features
• Low Quiescent Current: 600 nA
• Input Voltage Range: 1.4V to 6.0V
• Standard Output Voltages: 1.2V, 1.8V, 1.9V, 2.0V,
2.2V, 2.5V, 3.0V, 3.3V, 5.0V
• Output Accuracy: ±20 mV for 1.2V and 1.8V
Options and ±1% for V
R
2.0V
• Temperature Stability: ±50 ppm/°C
• Maximum Output Current: 150 mA
• Low ON Resistance: 3.3 @ V
R
= 3.0V
• Standby Current: 10 nA
• Protection Circuits: Current Limiter, Short Circuit,
Foldback
• SHDN Pin Function: ON/OFF Logic = Enable
High
• C
OUT
Discharge Circuit when SHDN Function is
Active
• Output Capacitor: Low Equivalent Series
Resistance (ESR) Ceramic, Capacitorless
Compatible
• Operating Temperature: -40°C to +85°C
(Industrial)
• Available Packages:
- 4-Lead 1 x 1 mm UQFN
- 5-Lead SOT-23
• Environmentally Friendly: EU RoHS Compliant,
Lead-Free
General Description
The MCP1711 is a highly accurate CMOS low dropout
(LDO) voltage regulator that can deliver up to 150 mA
of current while consuming only 0.6 µA of quiescent
current (typical). The input operating range is specified
from 1.4V to 6.0V, making it an ideal choice for mobile
applications and one-cell Li-Ion powered applications.
The MCP1711 is capable of delivering 150 mA output
current with only 0.32V (typical) for V
R
= 5.0V, and
1.41V (typical) for V
R
= 1.2V of input-to-output voltages
differential. The output voltage accuracy of the
MCP1711 is typically ± 0.02V for V
R
< 2.0V and ±1% for
V
R
2.0V at +25°C. The temperature stability is
approximately ±50 ppm/°C. Line regulation is
±0.01%/V typical at +25°C.
The output voltages available for the MCP1711 range
from 1.2V to 5.0V. The LDO output is stable even if an
output capacitor is not connected, due to an excellent
internal phase compensation. However, for better tran-
sient responses, the output capacitor should be added.
The MCP1711 is compatible with low ESR ceramic
output capacitors.
Overcurrent limit and short-circuit protection embed-
ded into the device provide a robust solution for any
application.
The MCP1711 has a true current foldback feature.
When the load decreases beyond the MCP1711 load
rating, the output current and output voltage will
foldback toward 80 mA (typical) at approximately 0V
output. When the load impedance increases and
returns to the rated load, the MCP1711 will follow the
same foldback curve as the device comes out of
current foldback.
If the device is in Shutdown mode, by inputting a
low-level signal to the SHDN pin, the current
consumption is reduced to less than 0.1 µA (typically
0.01 µA). In Shutdown mode, if the output capacitor is
used, it will be discharged via the internal dedicated
switch and, as a result, the output voltage quickly
returns to 0V.
The package options for the MCP1711 are the 4-lead
1 x 1 mm UQFN and the 5-lead SOT-23, which make
the device ideal for small and compact applications.
Applications
•
•
•
•
•
•
•
Energy Harvesting
Long-Life, Battery-Powered Applications
Portable Electronics
Ultra-Low Consumption “Green” Products
Mobile Devices/Terminals
Wireless LAN
Modules (Wireless, Cameras)
Related Literature
•
AN765,
Using Microchip’s Micropower LDOs
(DS00765), Microchip Technology Inc.
• AN766,
Pin-Compatible CMOS Upgrades to Bipolar
LDOs
(DS00766), Microchip Technology Inc.
• AN792,
A Method to Determine How Much Power
a SOT23 Can Dissipate in an Application
(DS00792), Microchip Technology Inc.
2015-2016 Microchip Technology Inc.
DS20005415D-page 1
MCP1711
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage, V
IN
.....................................................................................................................................................+6.5V
V
IN
, SHDN.................................................................................................................................................. -0.3V to +6.5V
Output Current, I
OUT
(1)
.........................................................................................................................................470 mA
Output Voltage, V
OUT
(2)
....................................................................................................... -0.3V to V
IN
+ 0.3V or +6.5V
Power Dissipation
5-Lead SOT-23 ..................................................... 600 mW (JEDEC 51-7 FR-4 board with thermal vias) or 250 mW
(3)
4-Lead 1 x 1 mm UQFN ........................................ 550 mW (JEDEC 51-7 FR-4 board with thermal vias) or 100 mW
(3)
Storage Temperature .............................................................................................................................. -55
°
C to +125
°
C
Operating Ambient Temperature ............................................................................................................... -40
°
C to +85
°
C
ESD Protection on all pins ...........................................................................................................±1 kV HBM, ±200V MM
† Notice:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
Note 1:
Provided that the device is used in the range of I
OUT
P
D
/(V
IN
- V
OUT
).
2:
The maximum rating corresponds to the lowest value between V
IN
+ 0.3V or +6.5V.
3:
The device is mounted on one layer PCB with minimal copper that does not provide any additional cooling.
DC CHARACTERISTICS
Electrical Characteristics:
Unless otherwise indicated, V
SHDN
= V
IN
, I
OUT
= 1 mA, C
IN
= C
OUT
= 0 µF, V
IN
= 3.5V for
V
R
< 2.5V and V
IN
= V
R
+ 1V for V
R
2.5V, T
A
= +25°C
Parameters
Input-Output Characteristics
Input Voltage
Output Voltage
V
IN
V
OUT
I
OUT
V
OUT
V
DROPOUT1
V
DROPOUT2
Input Quiescent Current
I
q
1.4
V
R
- 0.02
V
R
x 0.99
Maximum Output Current
Load Regulation
Dropout Voltage
(1)
150
-16
-50
—
—
—
—
—
Input Quiescent Current
for SHDN mode
Line Regulation
I
SHDN
V
OUT
/
(V
IN
x V
OUT
)
—
-0.13
-0.19
—
V
R
V
R
—
±3
±17
6.0
V
R
+ 0.02
V
R
x 1.01
—
+16
+50
V
mA
mV
1 µA
I
OUT
1 mA
1 mA
I
OUT
150 mA
I
OUT
= 50 mA
I
OUT
= 150 mA
µA
V
R
< 1.9V
1.9V
V
R
< 4.0V
V
R
4.0V
µA
%/V
V
IN
= 6.0V
V
SHDN
= V
IN
I
OUT
= 1 µA
V
R
+ 0.5V
V
IN
6.0V
I
OUT
= 1 mA
VR
1.2V,V
R
+ 0.5V
V
IN
6.0V
V
V
I
OUT
= 1 µA
V
R
< 2.0V
V
R
2.0V
Sym.
Min.
Typ.
Max.
Units
Conditions
V
DROP1
(2)
V
DROP2
(2)
0.60
0.65
0.80
0.01
±0.01
±0.01
1.27
1.50
1.80
0.10
+0.13
+0.19
Note 1:
2:
The dropout voltage is defined as the input to output differential at which the output voltage drops 2%
below the output voltage value that was measured with an applied input voltage of V
IN
= V
R
+ 1V.
V
DROP1
, V
DROP2
: Dropout Voltage (Refer to the
DC Characteristics Voltage Table).
2015-2016 Microchip Technology Inc.
DS20005415D-page 3
MCP1711
TEMPERATURE SPECIFICATIONS
(Note
1)
Parameters
Temperature Ranges
Operating Ambient Temperature Range
Junction Operating Temperature
Storage Temperature Range
Package Thermal Resistances
Thermal Resistance, 1 x 1 UQFN-4Ld
JA
JA
JC
Thermal Resistance, SOT-23-5Ld
JA
JA
JC
Note 1:
—
—
—
—
—
—
181.82
1000
15
166.67
400
81
—
—
—
—
—
—
°C/W JEDEC 51-7 FR4 board with
thermal vias
°C/W
Note 2
°C/W
°C/W JEDEC 51-7 FR4 board with
thermal vias
°C/W
Note 2
°C/W
T
A
T
J
T
A
-40
-40
-55
—
—
—
+85
+125
+125
°C
°C
°C
Sym.
Min.
Typ.
Max.
Units
Conditions
2:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature, and the thermal resistance from junction to air (i.e., T
A
, T
J
,
JA
). Exceeding the max-
imum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
The device is mounted on one layer PCB with minimal copper that does not provide any additional cooling.
2015-2016 Microchip Technology Inc.
DS20005415D-page 5
FPGA/CPLD
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