TMS570LS20106BSZWTQR datasheet, PDF

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TMS570LS20106BSZWTQR: DescriptionIC 32-BIT, FLASH, 160 MHz, RISC MICROCONTROLLER, PBGA337, GERRN, PLASTIC, NFBGA-337, Microcontroller; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，102 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TMS570LS20106BSZWTQR Overview

IC 32-BIT, FLASH, 160 MHz, RISC MICROCONTROLLER, PBGA337, GERRN, PLASTIC, NFBGA-337, Microcontroller

TMS570LS20106BSZWTQR Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	BGA,
Contacts	337
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Has ADC	YES
Address bus width
bit size	32
maximum clock frequency	80 MHz
DAC channel	NO
DMA channel	YES
External data bus width
JESD-30 code	S-PBGA-B337
Number of I/O lines	115
Number of terminals	337
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
ROM programmability	FLASH
speed	160 MHz
Maximum supply voltage	1.65 V
Minimum supply voltage	1.35 V
Nominal supply voltage	1.5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal form	BALL
Terminal location	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC
Base Number Matches	1

TMS570LS20106BSZWTQR Related Products

	TMS570LS20106BSZWTQR	TMS570LS20116ASPGEQR	TMS570LS20116BSZWTQR	TMS570LS20106ASZWTQR	TMS570LS20116ASZWTQR	TMS570LS20116BSPGEQR	TMS570LS20116SPGEQR	TMS570LS20106SZWTQR	TMS570LS20116SZWTQR
Description	IC 32-BIT, FLASH, 160 MHz, RISC MICROCONTROLLER, PBGA337, GERRN, PLASTIC, NFBGA-337, Microcontroller	IC 32-BIT, FLASH, 160 MHz, RISC MICROCONTROLLER, PQFP144, GREEN, PLASTIC, QFP-144, Microcontroller	IC 32-BIT, FLASH, 160 MHz, RISC MICROCONTROLLER, PBGA337, GERRN, PLASTIC, NFBGA-337, Microcontroller	IC 32-BIT, FLASH, 160 MHz, RISC MICROCONTROLLER, PBGA337, GERRN, PLASTIC, NFBGA-337, Microcontroller	IC 32-BIT, FLASH, 160 MHz, RISC MICROCONTROLLER, PBGA337, GERRN, PLASTIC, NFBGA-337, Microcontroller	IC 32-BIT, FLASH, 160 MHz, RISC MICROCONTROLLER, PQFP144, GREEN, PLASTIC, QFP-144, Microcontroller	IC 32-BIT, FLASH, 160 MHz, RISC MICROCONTROLLER, PQFP144, GREEN, PLASTIC, QFP-144, Microcontroller	IC 32-BIT, FLASH, 160 MHz, RISC MICROCONTROLLER, PBGA337, GERRN, PLASTIC, NFBGA-337, Microcontroller	IC 32-BIT, FLASH, 160 MHz, RISC MICROCONTROLLER, PBGA337, GERRN, PLASTIC, NFBGA-337, Microcontroller
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	BGA	QFP	BGA	BGA	BGA	QFP	QFP	BGA	BGA
package instruction	BGA,	LFQFP,	BGA,	BGA,	BGA,	GREEN, PLASTIC, QFP-144	LFQFP,	BGA,	BGA,
Contacts	337	144	337	337	337	144	144	337	337
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
Has ADC	YES	YES	YES	YES	YES	YES	YES	YES	YES
bit size	32	32	32	32	32	32	32	32	32
maximum clock frequency	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO	NO	NO
DMA channel	YES	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	S-PBGA-B337	S-PQFP-G144	S-PBGA-B337	S-PBGA-B337	S-PBGA-B337	S-PQFP-G144	S-PQFP-G144	S-PBGA-B337	S-PBGA-B337
Number of I/O lines	115	68	115	115	115	68	68	115	115
Number of terminals	337	144	337	337	337	144	144	337	337
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	NO	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	LFQFP	BGA	BGA	BGA	LFQFP	LFQFP	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY	GRID ARRAY	GRID ARRAY	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY	GRID ARRAY
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
speed	160 MHz	160 MHz	160 MHz	160 MHz	160 MHz	160 MHz	160 MHz	160 MHz	160 MHz
Maximum supply voltage	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V
Minimum supply voltage	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V
Nominal supply voltage	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal form	BALL	GULL WING	BALL	BALL	BALL	GULL WING	GULL WING	BALL	BALL
Terminal location	BOTTOM	QUAD	BOTTOM	BOTTOM	BOTTOM	QUAD	QUAD	BOTTOM	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Base Number Matches	1	1	1	1	1	-	-	-	-

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