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54FCT373AFMQR

Description
54FCT373AFMQR
Categorylogic    logic   
File Size416KB,8 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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54FCT373AFMQR Overview

54FCT373AFMQR

54FCT373AFMQR Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDFP, FL20,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDFP-F20
JESD-609 codee0
Load capacitance (CL)50 pF
Logic integrated circuit typeD LATCH
MaximumI(ol)0.032 A
Number of digits8
Number of functions1
Number of terminals20
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL20,.3
Package shapeRECTANGULAR
Package formFLATPACK
power supply5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Base Number Matches1

54FCT373AFMQR Related Products

54FCT373AFMQR 54FCT373LMQR 54FCT373FMQR 54FCT373DMQR 54FCT373DMX 54FCT373ADMQR 74FCT373ADCQR 74FCT373DCQR 54FCT373ALMQR
Description 54FCT373AFMQR IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,FP,20PIN,CERAMIC IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC 54FCT373ADMQR 74FCT373ADCQR 74FCT373DCQR 54FCT373ALMQR
package instruction DFP, FL20,.3 QCCN, LCC20,.35SQ DFP, FL20,.3 DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3 QCCN, LCC20,.35SQ
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 code R-XDFP-F20 S-XQCC-N20 R-XDFP-F20 R-XDIP-T20 R-XDIP-T20 R-XDIP-T20 R-XDIP-T20 R-XDIP-T20 S-XQCC-N20
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type D LATCH D LATCH D LATCH D LATCH D LATCH D LATCH D LATCH D LATCH D LATCH
MaximumI(ol) 0.032 A 0.032 A 0.032 A 0.032 A 0.032 A 0.032 A 0.048 A 0.048 A 0.032 A
Number of digits 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 20 20 20 20 20 20 20 20 20
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 70 °C 70 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C - - -55 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DFP QCCN DFP DIP DIP DIP DIP DIP QCCN
Encapsulate equivalent code FL20,.3 LCC20,.35SQ FL20,.3 DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3 LCC20,.35SQ
Package shape RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
Package form FLATPACK CHIP CARRIER FLATPACK IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE CHIP CARRIER
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES NO NO NO NO NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY COMMERCIAL COMMERCIAL MILITARY
Terminal form FLAT NO LEAD FLAT THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL QUAD DUAL DUAL DUAL DUAL DUAL DUAL QUAD
Is it Rohs certified? incompatible - - - - incompatible incompatible incompatible incompatible
Maker Texas Instruments - - Texas Instruments Texas Instruments Texas Instruments - - Texas Instruments
JESD-609 code e0 - - - - e0 e0 e0 e0
Terminal surface Tin/Lead (Sn/Pb) - - - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Base Number Matches 1 1 1 1 1 1 1 1 -
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