54FCT373DMX datasheet, PDF - EEWORLD Datasheet

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54FCT373DMX: DescriptionIC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC; Categorylogic logic; File Size416KB，8 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54FCT373DMX Overview

IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC

54FCT373DMX Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
package instruction	DIP, DIP20,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T20
Load capacitance (CL)	50 pF
Logic integrated circuit type	D LATCH
MaximumI(ol)	0.032 A
Number of digits	8
Number of functions	1
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
method of packing	TAPE AND REEL
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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Description	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,FP,20PIN,CERAMIC	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC	54FCT373ADMQR	54FCT373AFMQR	74FCT373ADCQR	74FCT373DCQR	54FCT373ALMQR
package instruction	DIP, DIP20,.3	QCCN, LCC20,.35SQ	DFP, FL20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DFP, FL20,.3	DIP, DIP20,.3	DIP, DIP20,.3	QCCN, LCC20,.35SQ
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T20	S-XQCC-N20	R-XDFP-F20	R-XDIP-T20	R-XDIP-T20	R-XDFP-F20	R-XDIP-T20	R-XDIP-T20	S-XQCC-N20
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH
MaximumI(ol)	0.032 A	0.032 A	0.032 A	0.032 A	0.032 A	0.032 A	0.048 A	0.048 A	0.032 A
Number of digits	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	20	20	20	20	20	20	20	20	20
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	70 °C	70 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-	-	-55 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	QCCN	DFP	DIP	DIP	DFP	DIP	DIP	QCCN
Encapsulate equivalent code	DIP20,.3	LCC20,.35SQ	FL20,.3	DIP20,.3	DIP20,.3	FL20,.3	DIP20,.3	DIP20,.3	LCC20,.35SQ
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	IN-LINE	CHIP CARRIER	FLATPACK	IN-LINE	IN-LINE	FLATPACK	IN-LINE	IN-LINE	CHIP CARRIER
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO	NO	YES	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY
Terminal form	THROUGH-HOLE	NO LEAD	FLAT	THROUGH-HOLE	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE	NO LEAD
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD
Maker	Texas Instruments	-	-	Texas Instruments	Texas Instruments	Texas Instruments	-	-	Texas Instruments
Base Number Matches	1	1	1	1	1	1	1	1	-
Is it Rohs certified?	-	-	-	-	incompatible	incompatible	incompatible	incompatible	incompatible
JESD-609 code	-	-	-	-	e0	e0	e0	e0	e0
Terminal surface	-	-	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)

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