NAND Gate, TTL/H/L Series, 3-Func, 3-Input, TTL, FP-14
| Parameter Name | Attribute value |
| Maker | Fairchild |
| Parts packaging code | DFP |
| package instruction | DFP, |
| Contacts | 14 |
| Reach Compliance Code | unknown |
| series | TTL/H/L |
| JESD-30 code | R-XDFP-F14 |
| Logic integrated circuit type | NAND GATE |
| Number of functions | 3 |
| Number of entries | 3 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | DFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| propagation delay (tpd) | 22 ns |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | FLAT |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| 5410FMQC | 5410DM | 74H10DC | 74H10PC | 74S10DC | 74S10FC | 74S10PC | |
|---|---|---|---|---|---|---|---|
| Description | NAND Gate, TTL/H/L Series, 3-Func, 3-Input, TTL, FP-14 | AND Gate, TTL, CDIP14, | NAND Gate, TTL, CDIP14, | NAND Gate, TTL/H/L Series, 3-Func, 3-Input, TTL, PDIP14, PLASTIC, DIP-14 | NAND Gate, TTL, CDIP14, | NAND Gate, TTL, CDFP14, | NAND Gate, TTL, PDIP14, |
| Reach Compliance Code | unknown | unknown | compliant | unknown | compliant | compliant | unknown |
| Maker | Fairchild | Fairchild | - | - | Fairchild | Fairchild | Fairchild |
| package instruction | DFP, | - | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 |
| series | TTL/H/L | - | - | TTL/H/L | S | - | S |
| JESD-30 code | R-XDFP-F14 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | - | R-PDIP-T14 |
| Logic integrated circuit type | NAND GATE | AND GATE | NAND GATE | NAND GATE | NAND GATE | - | NAND GATE |
| Number of functions | 3 | - | - | 3 | 3 | - | 3 |
| Number of entries | 3 | - | - | 3 | 3 | - | 3 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | - | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | - | 70 °C |
| Package body material | UNSPECIFIED | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | - | PLASTIC/EPOXY |
| encapsulated code | DFP | DIP | DIP | DIP | DIP | - | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | - | 5 V | 5 V | - | 5 V |
| surface mount | YES | NO | NO | NO | NO | - | NO |
| technology | TTL | TTL | TTL | TTL | TTL | - | TTL |
| Temperature level | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL |
| Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - | - |
| Is it lead-free? | - | Contains lead | Contains lead | - | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| JESD-609 code | - | e0 | e0 | e0 | e0 | - | e0 |
| Encapsulate equivalent code | - | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | - | DIP14,.3 |
| Peak Reflow Temperature (Celsius) | - | 250 | 250 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| Schmitt trigger | - | NO | NO | NO | NO | - | NO |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| Terminal pitch | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | 2.54 mm |
| Maximum time at peak reflow temperature | - | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
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