The UT54ACS138 and the UT54ACTS138 3-line to 8-line de-
coders/demultiplexers are designed to be used in high-perfor-
mance memory-decoding or data-routing applications requiring
very short propagation delay times.
The conditions at the binary select inputs and the three enable
inputs select one of eight output lines. Two active-low and one
active-high enable inputs reduce the need for external gates of
inverters when expanding. A 24-line decoder can be implement-
ed without external inverters and a 32-line decoder requires only
one inverter. An enable input can be used as a data input for
demultiplexing applications.
The devices are characterized over full military temperature
range of -55°C to +125°C.
FUNCTION TABLE
ENABLE INPUTS
G1
X
L
X
H
H
H
H
H
H
H
H
G2A
X
X
H
L
L
L
L
L
L
L
L
G2B
H
X
X
L
L
L
L
L
L
L
L
C
X
X
X
L
L
L
L
H
H
H
H
SELECT INPUTS
B
X
X
X
L
L
H
H
L
L
H
H
A
X
X
X
L
H
L
H
L
H
L
H
Y0
H
H
H
L
H
H
H
H
H
H
H
PINOUTS
16-Pin DIP
Top View
A
B
C
G2A
G2B
G1
Y7
V
SS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
DD
Y0
Y1
Y2
Y3
Y4
Y5
Y6
16-Lead Flatpack
Top View
A
B
C
G2A
G2B
G1
Y7
V
SS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
DD
Y0
Y1
Y2
Y3
Y4
Y5
Y6
OUTPUT
Y1
H
H
H
H
L
H
H
H
H
Y2
H
H
H
H
H
L
H
H
H
H
H
Y3
H
H
H
H
H
H
L
H
H
H
H
Y4
H
H
H
H
H
H
H
L
H
H
H
Y5
H
H
H
H
H
H
H
H
L
H
H
Y6
H
H
H
H
H
H
H
H
H
L
H
Y7
H
H
H
H
H
H
H
H
H
H
L
1
H
H
LOGIC SYMBOL
(1)
BIN/OCT
1
2
4
0
1
2
3
4
G1
G2A
G2B
(6)
(4)
(5)
&
EN
5
6
7
(15)
(14)
(13)
(12)
(11)
(10)
(9)
(7)
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
G2B
G1
G2A
(6)
(4)
(5)
&
EN
A
B
C
(1)
(2)
(3)
DMUX
1
2
4
A
B (2)
(3)
C
0
G
---
7
0
1
2
3
4
5
6
7
(15)
(14)
(13)
(12)
(11)
(10)
(9)
(7)
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Note:
1. Logic symbols in accordance with ANSI/IEEE standard 91-1984 and IEC Publication 617-12.
LOGIC DIAGRAM
(15)
(14)
G1
ENABLE
(6)
Y0
Y1
G2A (4)
G2B (5)
(13) Y2
(12)
(11)
(10)
Y3
DATA
Y4
Y5
Y6
Y7
A
SELECT
B
(1)
(2)
(9)
(7)
C (3)
2
OPERATIONAL ENVIRONMENT
1
PARAMETER
Total Dose
SEU Threshold
2
SEL Threshold
Neutron Fluence
LIMIT
1.0E6
80
120
1.0E14
UNITS
rads(Si)
MeV-cm
2
/mg
MeV-cm
2
/mg
n/cm
2
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
DD
V
I/O
T
STG
T
J
T
LS
Θ
JC
I
I
P
D
PARAMETER
Supply voltage
Voltage any pin
Storage Temperature range
Maximum junction temperature
Lead temperature (soldering 5 seconds)
Thermal resistance junction to case
DC input current
Maximum power dissipation
LIMIT
-0.3 to 7.0
-.3 to V
DD
+.3
-65 to +150
+175
+300
20
±10
1
UNITS
V
V
°C
°C
°C
°C/W
mA
W
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at
these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
V
DD
V
IN
T
C
PARAMETER
Supply voltage
Input voltage any pin
Temperature range
LIMIT
4.5 to 5.5
0 to V
DD
-55 to + 125
UNITS
V
V
°C
3
DC ELECTRICAL CHARACTERISTICS
7
(V
DD
= 5.0V
±
10%; V
SS
= 0V
6
, -55°C < T
C
< +125°C); Unless otherwise noted, Tc is per the temperature range ordered.
SYMBOL
V
IL
PARAMETER
Low-level input voltage
1
ACTS
ACS
High-level input voltage
1
ACTS
ACS
Input leakage current
ACTS/ACS
Low-level output voltage
3
ACTS
ACS
High-level output voltage
3
ACTS
ACS
Short-circuit output current
2 ,4
ACTS/ACS
Output current
10
(Sink)
I
OH
Output current
10
(Source)
P
total
I
DDQ
ΔI
DDQ
Power dissipation
2, 8, 9
Quiescent Supply Current
Quiescent Supply Current Delta
ACTS
V
IN
= V
DD
or V
SS
I
OL
= 8.0mA
I
OL
= 100μA
I
OH
= -8.0mA
I
OH
= -100μA
V
O
= V
DD
and V
SS
V
IN
= V
DD
or V
SS
V
OL
= 0.4V
V
IN
= V
DD
or V
SS
V
OH
= V
DD
- 0.4V
C
L
= 50pF
V
DD
= 5.5V
For input under test
V
IN
= V
DD
- 2.1V
For all other inputs
V
IN
= V
DD
or V
SS
V
DD
= 5.5V
C
IN
C
OUT
Input capacitance
5
Output capacitance
5
ƒ
= 1MHz @ 0V
ƒ
= 1MHz @ 0V
15
15
pF
pF
1.9
10
1.6
mW/
MHz
μA
mA
-8
mA
.7V
DD
V
DD
- 0.25
-200
8
200
.5V
DD
.7V
DD
-1
1
CONDITION
MIN
MAX
0.8
.3V
DD
UNIT
V
V
IH
V
I
IN
V
OL
μA
0.40
0.25
V
V
OH
V
I
OS
I
OL
mA
mA
4
Notes:
1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: V
IH
= V
IH
(min) + 20%, - 0%; V
IL
= V
IL
(max) + 0%, -
50%, as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are
guaranteed to V
IH
(min) and V
IL
(max).
2. Supplied as a design limit but not guaranteed or tested.
3. Per MIL-PRF-38535, for current density
≤
5.0E5 amps/cm
2
, the maximum product of load capacitance (per output buffer) times frequency should not exceed 3,765
pF/MHz.
4. Not more than one output may be shorted at a time for maximum duration of one second.
5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and V
SS
at
frequency of 1MHz and a signal amplitude of 50mV rms maximum.
6. Maximum allowable relative shift equals 50mV.
7. All specifications valid for radiation dose
≤
1E6 rads(Si).
8. Power does not include power contribution of any TTL output sink current.
9. Power dissipation specified per switching output.
10. This value is guaranteed based on characterization data, but not tested.
I need to do some operations on PN codes recently. I am studying the introduction of PN module in the help provided by Matlab. There are few examples. Can anyone share some examples? Haha...
[color=#000000][font=Arial,] Designers facing pressure to deliver new features for a demanding mobile device market are taking advantage of new sub-chip-scale packaging (sub-CSP) technologies to build...
Generally, the order of a four-layer board is: signal layer - ground layer - power layer - signal layer;
In order to ensure the minimum loop path, the stratum needs to remain a complete piece;
So, doe...
404724[/attach][/url][/align] [font=微软雅黑][size=3][align=center][color=#0000ff][b]March 20-22, 2019[/b][/color][/align] [align=center][color=#0000ff][b]E5 Hall 5543 · Shanghai New International Expo Ce...
Around 2005, I was able to use VS2003 to connect to SQL Server 2000 directly. But now when I use VS2005, I can't connect anymore? I don't know what the reason is? //Open the connection public bool SQL...
Nios II is a configurable 16-/32-bit RISC processor. Combined with a rich set of peripheral-specific instructions and hardware acceleration units, it provides a highly flexible and powerful SOPC sy...[Details]
Definition of interactive projection system:
Interactive projection systems, also known as multimedia interactive projection, are available in floor, wall, and tabletop interactive projection....[Details]
On August 20th, Tiantai Robotics Co., Ltd., along with strategic partners including Shandong Future Robotics Technology Co., Ltd., Shandong Future Data Technology Co., Ltd., and Gangzai Robotics Gr...[Details]
introduction
Sonar imaging is of great significance in marine resource development and defense. Its long range, intuitive display of the observed area, and target identification make it widely...[Details]
Recently, Joyson Electronics has made positive progress in the core technology research and development of the robot's "brain and brain" and key components, and launched the industry's first integr...[Details]
Magna's integrated in-cabin perception system fuses vision and millimeter-wave radar data to detect the presence of passengers, identify stranded children, monitor driver fatigue and vital signs, a...[Details]
Common methods for troubleshooting roller press bearing wear include repair welding, thermal spraying, brush plating, and scrapping and replacement. However, these methods are often subject to asse...[Details]
Charging is an essential topic for electric vehicles. Batteries are a core component of new energy vehicles. So, what's the optimal charge level for electric vehicles? Based on current battery tech...[Details]
New version helps developers build secure and trustworthy embedded systems
Shanghai, China—August 21, 2025—
QNX, a division of BlackBerry Ltd., today announced the release of QNX...[Details]
introduction
As core electronic components used in vastly different fields, automotive-grade chips and mobile/consumer-grade chips exhibit significant differences in their...[Details]
Blackfin® 16-/32-bit embedded processors offer high performance, low power consumption, flexible software features, and scalability, making them suitable for converged applications such as multi-fo...[Details]
The motor is a very important component for new energy vehicles. In terms of vehicle power, pure electric vehicles use electric motors instead of traditional diesel/gasoline engines. For electric v...[Details]
The power transmission system between a car's engine and drive wheels is called its drivetrain. It ensures the necessary traction and speed under various driving conditions, and coordinates these t...[Details]
Today, the voltage of electronic products continues to rise to 400V, 600V and even 1000V, so there are few electronic load models that can handle such high voltages. Many people consider connecting...[Details]
With rapid economic development, the types of pollution sources are increasing, especially in chemical and industrial zones and their surroundings. The patterns of pollution and the types of ecolog...[Details]
RF/Wirelessly
京公网安备 11010802033920号
EEWORLD
