OR Gate, TTL, CDFP14,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Raytheon Company |
| package instruction | DFP, FL14,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDFP-F14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | OR GATE |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL14,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5 V |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| 54LS32W | 54LS32J03 | 54LS32J | 74LS32J | 74LS32N | 74LS32NA+2 | 74LS32NA+1 | |
|---|---|---|---|---|---|---|---|
| Description | OR Gate, TTL, CDFP14, | OR Gate, TTL, CDIP14, | Gate, | OR Gate, TTL, CDIP14, | Gate, | OR Gate, TTL, PDIP14, | OR Gate, TTL, PDIP14, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Maker | Raytheon Company | - | - | Raytheon Company | Raytheon Company | Raytheon Company | Raytheon Company |
| package instruction | DFP, FL14,.3 | - | , | DIP, DIP14,.3 | , | DIP, DIP14,.3 | DIP, DIP14,.3 |
| JESD-30 code | R-XDFP-F14 | R-XDIP-T14 | - | R-XDIP-T14 | - | R-PDIP-T14 | R-PDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 | - | e0 | e0 |
| Logic integrated circuit type | OR GATE | OR GATE | - | OR GATE | - | OR GATE | OR GATE |
| Number of terminals | 14 | 14 | - | 14 | - | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | - | 70 °C | - | 70 °C | 70 °C |
| Package body material | CERAMIC | CERAMIC | - | CERAMIC | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DFP | DIP | - | DIP | - | DIP | DIP |
| Encapsulate equivalent code | FL14,.3 | DIP14,.3 | - | DIP14,.3 | - | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | - | IN-LINE | - | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | - | 5 V | - | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified | - | - | Not Qualified |
| Schmitt trigger | NO | NO | - | NO | - | NO | NO |
| Nominal supply voltage (Vsup) | 5 V | 5 V | - | 5 V | - | 5 V | 5 V |
| surface mount | YES | NO | - | NO | - | NO | NO |
| technology | TTL | TTL | - | TTL | - | TTL | TTL |
| Temperature level | MILITARY | MILITARY | - | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | - | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | - | 2.54 mm | - | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | - | DUAL | - | DUAL | DUAL |
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