|
5962-9063401HXX |
5962-9063401HXA |
5962-9063401HXC |
ADH-030II-10-1-3B |
ADH-030II-12-3-B |
ADH-030II-10-3-B |
| Description |
D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24 |
D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24 |
D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24 |
D/A Converter, 1 Func, Parallel, Word Input Loading, 0.035us Settling Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 |
D/A Converter, 1 Func, Parallel, Word Input Loading, 0.035us Settling Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 |
D/A Converter, 1 Func, Parallel, Word Input Loading, 0.035us Settling Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 |
| Maker |
Data Device Corporation |
Data Device Corporation |
Data Device Corporation |
Data Device Corporation |
Data Device Corporation |
Data Device Corporation |
| Parts packaging code |
DIP |
DIP |
DIP |
DIP |
DIP |
DIP |
| package instruction |
CERAMIC, DIP-24 |
CERAMIC, DIP-24 |
CERAMIC, DIP-24 |
1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 |
1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 |
1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 |
| Contacts |
24 |
24 |
24 |
24 |
24 |
24 |
| Reach Compliance Code |
compliant |
compliant |
compliant |
unknown |
compliant |
compliant |
| Maximum analog output voltage |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| Converter type |
D/A CONVERTER |
D/A CONVERTER |
D/A CONVERTER |
D/A CONVERTER |
D/A CONVERTER |
D/A CONVERTER |
| Enter bit code |
COMPLEMENTARY BINARY, COMPLEMENTARY 2'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY |
COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY |
COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY |
COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY |
COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY |
COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY |
| Input format |
PARALLEL, WORD |
PARALLEL, WORD |
PARALLEL, WORD |
PARALLEL, WORD |
PARALLEL, WORD |
PARALLEL, WORD |
| JESD-30 code |
R-CDIP-P24 |
R-CDIP-P24 |
R-CDIP-P24 |
R-CDIP-P24 |
R-CDIP-P24 |
R-CDIP-P24 |
| Maximum linear error (EL) |
0.0125% |
0.0125% |
0.0125% |
0.05% |
0.0125% |
0.05% |
| Nominal negative supply voltage |
-15 V |
-15 V |
-15 V |
-10 V |
-10 V |
-10 V |
| Number of digits |
12 |
12 |
12 |
12 |
12 |
12 |
| Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
24 |
24 |
24 |
24 |
24 |
24 |
| Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
70 °C |
70 °C |
| Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
- |
- |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
| encapsulated code |
DIP |
DIP |
DIP |
DIP |
DIP |
DIP |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
IN-LINE |
IN-LINE |
IN-LINE |
IN-LINE |
IN-LINE |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
5.08 mm |
5.08 mm |
5.08 mm |
5.08 mm |
5.08 mm |
5.08 mm |
| Nominal supply voltage |
15 V |
15 V |
15 V |
10 V |
10 V |
10 V |
| surface mount |
NO |
NO |
NO |
NO |
NO |
NO |
| Temperature level |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
COMMERCIAL |
COMMERCIAL |
| Terminal form |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
| Terminal pitch |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
| width |
15.24 mm |
15.24 mm |
15.24 mm |
15.24 mm |
15.24 mm |
15.24 mm |
| ECCN code |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
- |
- |
| technology |
HYBRID |
HYBRID |
HYBRID |
- |
HYBRID |
HYBRID |
| JESD-609 code |
- |
e0 |
e4 |
- |
e0 |
e0 |
| Encapsulate equivalent code |
- |
DIP24,.6 |
DIP24,.6 |
- |
DIP24,.6 |
DIP24,.6 |
| power supply |
- |
-1.3,+-15 V |
-1.3,+-15 V |
- |
-1.3,+-15 V |
-1.3,+-15 V |
| Filter level |
- |
MIL-PRF-38534 |
MIL-PRF-38534 |
- |
MIL-STD-883 Class B (Modified) |
MIL-STD-883 Class B (Modified) |
| Maximum slew rate |
- |
97 mA |
97 mA |
60 mA |
60 mA |
60 mA |
| Terminal surface |
- |
TIN LEAD |
GOLD |
- |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |