5962-9063401HXA datasheet, PDF

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5962-9063401HXA: DescriptionD/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24; CategoryAnalog mixed-signal IC converter; File Size227KB，6 Pages; ManufacturerData Device Corporation

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D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24

5962-9063401HXA Parametric

Parameter Name	Attribute value
Maker	Data Device Corporation
Parts packaging code	DIP
package instruction	CERAMIC, DIP-24
Contacts	24
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum analog output voltage	5 V
Minimum analog output voltage
Converter type	D/A CONVERTER
Enter bit code	COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY
Input format	PARALLEL, WORD
JESD-30 code	R-CDIP-P24
JESD-609 code	e0
Maximum linear error (EL)	0.0125%
Nominal negative supply voltage	-15 V
Number of digits	12
Number of functions	1
Number of terminals	24
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	-1.3,+-15 V
Certification status	Not Qualified
Filter level	MIL-PRF-38534
Maximum seat height	5.08 mm
Maximum stabilization time	0.05 µs
Maximum slew rate	97 mA
Nominal supply voltage	15 V
surface mount	NO
technology	HYBRID
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

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5962-9063401HXA Related Products

	5962-9063401HXA	5962-9063401HXC	5962-9063401HXX	ADH-030II-10-1-3B	ADH-030II-12-3-B	ADH-030II-10-3-B
Description	D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24	D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24	D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24	D/A Converter, 1 Func, Parallel, Word Input Loading, 0.035us Settling Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24	D/A Converter, 1 Func, Parallel, Word Input Loading, 0.035us Settling Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24	D/A Converter, 1 Func, Parallel, Word Input Loading, 0.035us Settling Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24
Maker	Data Device Corporation	Data Device Corporation	Data Device Corporation	Data Device Corporation	Data Device Corporation	Data Device Corporation
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	CERAMIC, DIP-24	CERAMIC, DIP-24	CERAMIC, DIP-24	1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24	1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24	1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24
Contacts	24	24	24	24	24	24
Reach Compliance Code	compliant	compliant	compliant	unknown	compliant	compliant
Maximum analog output voltage	5 V	5 V	5 V	5 V	5 V	5 V
Converter type	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER
Enter bit code	COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY	COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY	COMPLEMENTARY BINARY, COMPLEMENTARY 2'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY	COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY	COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY	COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY
Input format	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD
JESD-30 code	R-CDIP-P24	R-CDIP-P24	R-CDIP-P24	R-CDIP-P24	R-CDIP-P24	R-CDIP-P24
Maximum linear error (EL)	0.0125%	0.0125%	0.0125%	0.05%	0.0125%	0.05%
Nominal negative supply voltage	-15 V	-15 V	-15 V	-10 V	-10 V	-10 V
Number of digits	12	12	12	12	12	12
Number of functions	1	1	1	1	1	1
Number of terminals	24	24	24	24	24	24
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	70 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-	-
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm
Nominal supply voltage	15 V	15 V	15 V	10 V	10 V	10 V
surface mount	NO	NO	NO	NO	NO	NO
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL
Terminal form	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	-	-
JESD-609 code	e0	e4	-	-	e0	e0
Encapsulate equivalent code	DIP24,.6	DIP24,.6	-	-	DIP24,.6	DIP24,.6
power supply	-1.3,+-15 V	-1.3,+-15 V	-	-	-1.3,+-15 V	-1.3,+-15 V
Filter level	MIL-PRF-38534	MIL-PRF-38534	-	-	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)
Maximum slew rate	97 mA	97 mA	-	60 mA	60 mA	60 mA
technology	HYBRID	HYBRID	HYBRID	-	HYBRID	HYBRID
Terminal surface	TIN LEAD	GOLD	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)

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