MV66030-25B0/LC datasheet, PDF

MV66030-25B0/LC: DescriptionFIFO, 64X9, 22ns, Asynchronous, CMOS, CQCC28; Categorystorage storage; File Size374KB，7 Pages; ManufacturerDynex; Websitehttp://www.dynexsemi.com/

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MV66030-25B0/LC Overview

FIFO, 64X9, 22ns, Asynchronous, CMOS, CQCC28

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	QCCN, LCC28,.45SQ
Reach Compliance Code	unknown
Maximum access time	22 ns
Maximum clock frequency (fCLK)	25 MHz
JESD-30 code	S-XQCC-N28
JESD-609 code	e0
Memory IC Type	OTHER FIFO
memory width	9
Number of terminals	28
word count	64 words
character code	64
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64X9
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC28,.45SQ
Package shape	SQUARE
Package form	CHIP CARRIER
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.01 A
Maximum slew rate	0.03 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Base Number Matches	1

	MV66030-25B0/LC	MV66030-10B0/LC	MV66030-10B0DP
Description	FIFO, 64X9, 22ns, Asynchronous, CMOS, CQCC28	FIFO, 64X9, 40ns, Asynchronous, CMOS, CQCC28	FIFO, 64X9, 40ns, Asynchronous, CMOS, PDIP28,
Is it Rohs certified?	incompatible	incompatible	incompatible
package instruction	QCCN, LCC28,.45SQ	QCCN, LCC28,.45SQ	DIP, DIP28,.6
Reach Compliance Code	unknown	unknown	unknown
Maximum access time	22 ns	40 ns	40 ns
Maximum clock frequency (fCLK)	25 MHz	10 MHz	10 MHz
JESD-30 code	S-XQCC-N28	S-XQCC-N28	R-PDIP-T28
JESD-609 code	e0	e0	e0
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	9	9	9
Number of terminals	28	28	28
word count	64 words	64 words	64 words
character code	64	64	64
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
organize	64X9	64X9	64X9
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	QCCN	QCCN	DIP
Encapsulate equivalent code	LCC28,.45SQ	LCC28,.45SQ	DIP28,.6
Package shape	SQUARE	SQUARE	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	IN-LINE
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.01 A	0.01 A	0.01 A
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	YES	YES	NO
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	NO LEAD	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm
Terminal location	QUAD	QUAD	DUAL
Base Number Matches	1	1	1

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