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08053K100CATTR

Description
Film Capacitor, Silicon Dioxide And Nitride, 25V, 0.00001uF, Surface Mount, 0805, CHIP
CategoryPassive components    capacitor   
File Size257KB,19 Pages
ManufacturerAVX
Environmental Compliance  
Download Datasheet Parametric Compare View All

08053K100CATTR Overview

Film Capacitor, Silicon Dioxide And Nitride, 25V, 0.00001uF, Surface Mount, 0805, CHIP

08053K100CATTR Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instruction, 0805
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.00001 µF
Capacitor typeFILM CAPACITOR
dielectric materialsSILICON DIOXIDE AND NITRIDE
JESD-609 codee2
Manufacturer's serial numberACCU-F
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR
Rated (DC) voltage (URdc)25 V
size code0805
surface mountYES
Terminal surfaceTin/Silver (Sn96Ag4) - with Nickel (Ni) barrier
Terminal shapeFLAT
Base Number Matches1
Accu-F
®
/ Accu-P
®
Thin-Film Technology
THE IDEAL CAPACITOR
The non-ideal characteristics of a real capacitor can be
ignored at low frequencies. Physical size imparts inductance
to the capacitor and dielectric and metal electrodes result in
resistive losses, but these often are of negligible effect on the
circuit. At the very high frequencies of radio communication
(>100MHz) and satellite systems (>1GHz), these effects
become important. Recognizing that a real capacitor will
exhibit inductive and resistive impedances in addition to
capacitance, the ideal capacitor for these high frequencies is
an ultra low loss component which can be fully characterized
in all parameters with total repeatability from unit to unit.
Until recently, most high frequency/microwave capacitors
were based on fired-ceramic (porcelain) technology. Layers
of ceramic dielectric material and metal alloy electrode paste
are interleaved and then sintered in a high temperature oven.
This technology exhibits component variability in dielectric
quality (losses, dielectric constant and insulation resistance),
variability in electrode conductivity and variability in physical
size (affecting inductance). An alternate thin-film technology
has been developed which virtually eliminates these vari-
ances. It is this technology which has been fully incorporated
into Accu-F
®
and Accu-P
®
to provide high frequency capaci-
tors exhibiting truly ideal characteristics.
The main features of Accu-F
®
and Accu-P
®
may be summa-
rized as follows:
• High purity of electrodes for very low and repeatable
ESR.
• Highly pure, low-K dielectric for high breakdown field,
high insulation resistance and low losses to frequencies
above 40GHz.
• Very tight dimensional control for uniform inductance,
unit to unit.
• Very tight capacitance tolerances for high frequency
signal applications.
This accuracy sets apart these Thin-Film capacitors from
ceramic capacitors so that the term Accu has been
employed as the designation for this series of devices, an
abbreviation for “accurate.”
THIN-FILM TECHNOLOGY
Thin-film technology is commonly used in producing semi-
conductor devices. In the last two decades, this technology
has developed tremendously, both in performance and in
process control. Today’s techniques enable line definitions of
below 1µm, and the controlling of thickness of layers at 100Å
(10
-2
µm). Applying this technology to the manufacture of
capacitors has enabled the development of components
where both electrical and physical properties can be tightly
controlled.
The thin-film production facilities at AVX consist of:
• Class 1000 clean rooms, with working areas under
laminar-flow hoods of class 100, (below 100 particles
per cubic foot larger than 0.5µm).
• High vacuum metal deposition systems for high-purity
electrode construction.
• Photolithography equipment for line definition down to
2.0µm accuracy.
• Plasma-enhanced CVD for various dielectric deposi-
tions (CVD=Chemical Vapor Deposition).
• High accuracy, microprocessor-controlled dicing saws
for chip separation.
• High speed, high accuracy sorting to ensure strict
tolerance adherence.
TERMINATION
ALUMINA
ELECTRODE
SEAL
ELECTRODE
DIELECTRIC
ALUMINA
ACCU-P
®
CAPACITOR
6

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Description Film Capacitor, Silicon Dioxide And Nitride, 25V, 0.00001uF, Surface Mount, 0805, CHIP Film Capacitor, Silicon Dioxide And Nitride, 100V, 0.00001uF, Surface Mount, 0805, CHIP Film Capacitor, Silicon Dioxide And Nitride, 50V, 0.00001uF, Surface Mount, 0805, CHIP Film Capacitor, Silicon Dioxide And Nitride, 25V, 0.00001uF, Surface Mount, 0805, CHIP CAPACITOR, FILM/FOIL, SILICON DIOXIDE AND NITRIDE, 25V, 0.00001uF, SURFACE MOUNT, 0805, CHIP CAPACITOR, FILM/FOIL, SILICON DIOXIDE AND NITRIDE, 50V, 0.00001uF, SURFACE MOUNT, 0805, CHIP CAPACITOR, FILM/FOIL, SILICON DIOXIDE AND NITRIDE, 25V, 0.00001uF, SURFACE MOUNT, 0805, CHIP CAPACITOR, FILM/FOIL, SILICON DIOXIDE AND NITRIDE, 100V, 0.00001uF, SURFACE MOUNT, 0805, CHIP
Is it lead-free? Lead free Lead free Lead free Lead free Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? conform to conform to conform to conform to incompatible incompatible incompatible incompatible
package instruction , 0805 , 0805 , 0805 , 0805 , 0805 , 0805 , 0805 , 0805
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
capacitance 0.00001 µF 0.00001 µF 0.00001 µF 0.00001 µF 0.00001 µF 0.00001 µF 0.00001 µF 0.00001 µF
Capacitor type FILM CAPACITOR FILM CAPACITOR FILM CAPACITOR FILM CAPACITOR FILM CAPACITOR FILM CAPACITOR FILM CAPACITOR FILM CAPACITOR
dielectric materials SILICON DIOXIDE AND NITRIDE SILICON DIOXIDE AND NITRIDE SILICON DIOXIDE AND NITRIDE SILICON DIOXIDE AND NITRIDE SILICON DIOXIDE AND NITRIDE SILICON DIOXIDE AND NITRIDE SILICON DIOXIDE AND NITRIDE SILICON DIOXIDE AND NITRIDE
JESD-609 code e2 e2 e2 e2 e0 e0 e0 e0
Manufacturer's serial number ACCU-F ACCU-F ACCU-F ACCU-F ACCU-F ACCU-F ACCU-F ACCU-F
Installation features SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT
Number of terminals 2 2 2 2 2 2 2 2
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE
method of packing TR TR TR TR TR TR TR TR
Rated (DC) voltage (URdc) 25 V 100 V 50 V 25 V 25 V 50 V 25 V 100 V
size code 0805 0805 0805 0805 0805 0805 0805 0805
surface mount YES YES YES YES YES YES YES YES
Terminal surface Tin/Silver (Sn96Ag4) - with Nickel (Ni) barrier Tin/Silver (Sn96Ag4) - with Nickel (Ni) barrier Tin/Silver (Sn96Ag4) - with Nickel (Ni) barrier Tin/Silver (Sn96Ag4) - with Nickel (Ni) barrier Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal shape FLAT FLAT FLAT FLAT FLAT FLAT FLAT FLAT
Base Number Matches 1 1 1 1 1 1 1 1
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