SRAM, 16KX4, 45ns, CMOS, PDIP28, DIP-28
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, |
| Reach Compliance Code | unknown |
| Maximum access time | 45 ns |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| memory density | 65536 bit |
| memory width | 4 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 16384 words |
| character code | 16000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 16KX4 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |
| L7C162PC45 | L7C161KC85 | L7C161WC85 | L7C162CME85 | L7C162DC45 | L7C162DME45 | L7C162PC85 | L7C162WC85 | |
|---|---|---|---|---|---|---|---|---|
| Description | SRAM, 16KX4, 45ns, CMOS, PDIP28, DIP-28 | Memory IC | Memory IC | Standard SRAM, 16KX4, 85ns, CMOS, CDIP28 | Standard SRAM, 16KX4, 45ns, CMOS, CDIP28 | Standard SRAM, 16KX4, 45ns, CMOS, CDIP28 | Standard SRAM, 16KX4, 85ns, CMOS, PDIP28 | Memory IC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, | , | , | DIP, DIP28,.3 | DIP, DIP28,.3 | DIP, DIP28,.3 | DIP, DIP28,.3 | , |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Maximum access time | 45 ns | - | - | 85 ns | 45 ns | 45 ns | 85 ns | - |
| JESD-30 code | R-PDIP-T28 | - | - | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-PDIP-T28 | - |
| JESD-609 code | e0 | - | - | e0 | e0 | e0 | e0 | - |
| memory density | 65536 bit | - | - | 65536 bit | 65536 bit | 65536 bit | 65536 bit | - |
| memory width | 4 | - | - | 4 | 4 | 4 | 4 | - |
| Number of terminals | 28 | - | - | 28 | 28 | 28 | 28 | - |
| word count | 16384 words | - | - | 16384 words | 16384 words | 16384 words | 16384 words | - |
| character code | 16000 | - | - | 16000 | 16000 | 16000 | 16000 | - |
| Operating mode | ASYNCHRONOUS | - | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - |
| Maximum operating temperature | 70 °C | - | - | 125 °C | 70 °C | 125 °C | 70 °C | - |
| organize | 16KX4 | - | - | 16KX4 | 16KX4 | 16KX4 | 16KX4 | - |
| Package body material | PLASTIC/EPOXY | - | - | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | - |
| encapsulated code | DIP | - | - | DIP | DIP | DIP | DIP | - |
| Package shape | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| Package form | IN-LINE | - | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - |
| Parallel/Serial | PARALLEL | - | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - |
| Nominal supply voltage (Vsup) | 5 V | - | - | 5 V | 5 V | 5 V | 5 V | - |
| surface mount | NO | - | - | NO | NO | NO | NO | - |
| technology | CMOS | - | - | CMOS | CMOS | CMOS | CMOS | - |
| Temperature level | COMMERCIAL | - | - | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | - |
| Terminal surface | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal form | THROUGH-HOLE | - | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - |
| Terminal location | DUAL | - | - | DUAL | DUAL | DUAL | DUAL | - |