Memory IC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | , |
| Reach Compliance Code | unknown |
| Humidity sensitivity level | 3 |
| Base Number Matches | 1 |
| L7C162WC85 | L7C161KC85 | L7C161WC85 | L7C162CME85 | L7C162DC45 | L7C162DME45 | L7C162PC45 | L7C162PC85 | |
|---|---|---|---|---|---|---|---|---|
| Description | Memory IC | Memory IC | Memory IC | Standard SRAM, 16KX4, 85ns, CMOS, CDIP28 | Standard SRAM, 16KX4, 45ns, CMOS, CDIP28 | Standard SRAM, 16KX4, 45ns, CMOS, CDIP28 | SRAM, 16KX4, 45ns, CMOS, PDIP28, DIP-28 | Standard SRAM, 16KX4, 85ns, CMOS, PDIP28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | , | , | , | DIP, DIP28,.3 | DIP, DIP28,.3 | DIP, DIP28,.3 | DIP, | DIP, DIP28,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Maximum access time | - | - | - | 85 ns | 45 ns | 45 ns | 45 ns | 85 ns |
| JESD-30 code | - | - | - | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-PDIP-T28 | R-PDIP-T28 |
| JESD-609 code | - | - | - | e0 | e0 | e0 | e0 | e0 |
| memory density | - | - | - | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| memory width | - | - | - | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | - | - | - | 28 | 28 | 28 | 28 | 28 |
| word count | - | - | - | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
| character code | - | - | - | 16000 | 16000 | 16000 | 16000 | 16000 |
| Operating mode | - | - | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | - | - | - | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C |
| organize | - | - | - | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 |
| Package body material | - | - | - | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | - | - | DIP | DIP | DIP | DIP | DIP |
| Package shape | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | - | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | - | - | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Nominal supply voltage (Vsup) | - | - | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | - | - | - | NO | NO | NO | NO | NO |
| technology | - | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | - | - | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal surface | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | - | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | - | - | - | DUAL | DUAL | DUAL | DUAL | DUAL |