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IS62LV2568L-55TI

Description
256K X 8 55ns, PDSO32, 8 X 20 MM, TSOP1-32
Categorystorage    storage   
File Size455KB,10 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Download Datasheet Parametric View All

IS62LV2568L-55TI Overview

256K X 8 55ns, PDSO32, 8 X 20 MM, TSOP1-32

IS62LV2568L-55TI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instruction8 X 20 MM, TSOP1-32
Reach Compliance Codecompliant
Maximum access time55 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G32
JESD-609 codee0
memory density2097152 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP32,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
power supply3/3.3 V
Certification statusNot Qualified
Minimum standby current1.5 V
Maximum slew rate0.045 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Base Number Matches1
IS62LV2568L
IS62LV2568LL
IS62LV2568L
IS62LV2568LL
256K x 8 LOW POWER and LOW V
++
CMOS STATIC RAM
FEATURES
• Access times of 55, 70, 100 ns
• Low active power: 126 mW (max, L, LL)
•
Low standby power: 36 µW (max, L) and 7.2
µW (max, LL) CMOS standby
• Low data retention voltage: 1.5V (min.)
• Available in Low Power (-L) and Ultra-Low
Power (-LL)
• Output Enable (OE) and two Chip Enable
• TTL compatible inputs and outputs
• Single 2.7V-3.6V power supply
• Available in the 32-pin 8x20mm TSOP-1, 32-pin
8x13.4mm TSOP-1 and 48-pin 6*8mm TF-BGA
DESCRIPTION
The
1+51
IS62LV2568L and IS62LV2568LL are low power
and low V
CC
, 262,144-bit words by 8 bits CMOS static RAMs.
They are fabricated using
1+51
's high-performance CMOS
technology. This highly reliable process coupled with innova-
tive circuit design techniques, yields higher performance and
low power consumption devices.
When
CE1
is HIGH or CE2 is LOW (deselected), the device
assumes a standby mode at which the power dissipation can
be reduced by using CMOS input levels.
Easy memory expansion is provided by using two Chip Enable
inputs,
CE1
and CE2. The active LOW Write Enable (WE)
controls both writing and reading of the memory.
The IS62LV2568L and IS62LV2568LL are available in 32-pin
8*20mm TSOP-1, 8*13.4mm TSOP-1 and 48-pin 6*8mm TF-
BGA.
FUNCTIONAL BLOCK DIAGRAM
A0-A17
DECODER
2048 x 128 x 8
MEMORY ARRAY
VCC
GND
I/O
DATA
CIRCUIT
I/O0-I/O7
COLUMN I/O
CE1
CE2
OE
WE
CONTROL
CIRCUIT
ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors
which may appear in this publication. © Copyright 2000, Integrated Circuit Solution Inc.
Integrated Circuit Solution Inc.
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