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MC74HC138ND

Description
IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,PLASTIC
Categorylogic    logic   
File Size404KB,6 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MC74HC138ND Overview

IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,PLASTIC

MC74HC138ND Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T16
JESD-609 codee0
Logic integrated circuit typeOTHER DECODER/DRIVER
Number of functions1
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply2/6 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

MC74HC138ND Related Products

MC74HC138ND MC54HC138AJD MC74HC138AND MC74HC138ANDS MC74HC138NS MC74HC138DDS MC74HC138DD MC74HC138NDS
Description IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,PLASTIC IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,CERAMIC IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,PLASTIC IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,PLASTIC IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,PLASTIC IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,SOP,16PIN,PLASTIC IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,SOP,16PIN,PLASTIC IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,PLASTIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 SOP, SOP16,.25 SOP, SOP16,.25 DIP, DIP16,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 code R-PDIP-T16 R-XDIP-T16 R-PDIP-T16 R-PDIP-T16 R-PDIP-T16 R-PDSO-G16 R-PDSO-G16 R-PDIP-T16
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
Logic integrated circuit type OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 16 16 16 16 16 16 16 16
Maximum operating temperature 85 °C 125 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -55 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP DIP SOP SOP DIP
Encapsulate equivalent code DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 SOP16,.25 SOP16,.25 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE
power supply 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V
surface mount NO NO NO NO NO YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 1 1 1 1 -
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