MC74HC138NDS datasheet, PDF - EEWORLD Datasheet

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MC74HC138NDS: DescriptionIC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,PLASTIC; Categorylogic logic; File Size404KB，6 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC74HC138NDS Overview

IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,PLASTIC

MC74HC138NDS Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
Logic integrated circuit type	OTHER DECODER/DRIVER
Number of functions	1
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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MC74HC138NDS Related Products

	MC74HC138NDS	MC54HC138AJD	MC74HC138AND	MC74HC138ANDS	MC74HC138NS	MC74HC138ND	MC74HC138DDS	MC74HC138DD
Description	IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,PLASTIC	IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,CERAMIC	IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,PLASTIC	IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,PLASTIC	IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,PLASTIC	IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,PLASTIC	IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,SOP,16PIN,PLASTIC	IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,SOP,16PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	SOP, SOP16,.25	SOP, SOP16,.25
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T16	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDSO-G16	R-PDSO-G16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Logic integrated circuit type	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	16	16	16	16	16	16	16	16
Maximum operating temperature	85 °C	125 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	SOP	SOP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	SOP16,.25	SOP16,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
power supply	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V
surface mount	NO	NO	NO	NO	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	-	1	1	1	1	1	1	1

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