TDA8024
Standard smart card interface
Rev. 4.0 — 3 June 2016
Product data sheet
1. General description
The TDA8024 is a complete and cost-efficient analog interface for asynchronous 3 V or
5 V smart cards. It can be placed between the card and the microcontroller to perform all
supply, protection and control functions. Very few external components are required. The
TDA8024AT is a direct replacement for the TDA8004AT.
More information can be obtained from the NXP internet site (www.nxp.com) and from
“Application note AN10141”.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the
ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A
or
equivalent standards.
2. Features and benefits
IC card interface
3 V or 5 V supply for the IC (V
DD
and GND)
Three specifically protected half-duplex bidirectional buffered I/O lines to card contacts
C4, C7 and C8
DC-to-DC converter for V
CC
generation separately powered from a 5 V
20% supply
(V
DDP
and PGND)
3 V or 5 V
5% regulated card supply voltage (V
CC
) with appropriate decoupling has
the following capabilities:
I
CC
< 80 mA at V
DDP
= 4 V to 6.5 V
Handles current spikes of 40 nAs up to 20 MHz
Controls rise and fall times
Filtered overload detection at approximately 120 mA
Thermal and short-circuit protection on all card contacts
Automatic activation and deactivation sequences; initiated by software or by hardware
in the event of a short-circuit, card take-off, overheating, V
DD
or V
DDP
drop-out
Enhanced ESD protection on card side (>6 kV)
26 MHz integrated crystal oscillator
Clock generation for cards up to 20 MHz (divided by 1, 2, 4 or 8 through CLKDIV1 and
CLKDIV2 signals) with synchronous frequency changes
Non-inverted control of RST via pin RSTIN
ISO 7816, GSM11.11 and EMV (payment systems) compatibility
NXP Semiconductors
TDA8024
Standard smart card interface
Supply supervisor for spike-killing during power-on and power-off and Power-on reset
(threshold fixed internally or externally by a resistor bridge); not for TDA8024AT
Built-in debounce on card presence contacts
One multiplexed status signal OFF
3. Applications
IC card readers for banking
Electronic payment
Identification
Pay TV
4. Quick reference data
Table 1.
Symbol
Power supplies
V
DD
V
DDP
I
DD
supply voltage
DC-to-DC converter
supply voltage
supply current
V
CC
= 5 V;
I
CC
< 80 mA
V
CC
= 5 V;
I
CC
< 20 mA
V
DD
= 3.3 V; f
XTAL
= 10 MHz
card inactive
card active; f
CLK
= f
XTAL
;
C
L
= 30 pF
I
DDP
DC-to-DC converter
supply current
V
DDP
= 5 V; f
XTAL
= 10 MHz
inactive mode
active mode; f
CLK
= f
XTAL
;
C
L
= 30 pF;
I
CC
= 0
Card supply
V
CC
card suppy voltage
(including ripple voltage)
5 V card:
card active;
I
CC
< 80 mA DC
card active; current pulses
I
p
= 40 nAs
3 V card:
card active;
I
CC
< 65 mA DC
card active; current pulses
I
p
= 40 nAs
V
CC(ripple)(p-p)
I
CC
ripple voltage on V
CC
(peak-to-peak value)
card supply current
f
ripple
= 20 kHz to 200 MHz
V
CC
= 0 to 5 V
V
CC
= 0 to 3 V
2.85
2.76
-
-
-
3.0
3.0
-
-
-
3.15
3.20
350
80
65
V
V
mV
mA
mA
4.75
4.65
5.0
5.0
5.25
5.25
V
V
-
-
-
-
0.1
10
mA
mA
-
-
-
-
1.2
1.5
mA
mA
2.7
4.0
3.0
-
5.0
-
6.5
6.5
6.5
V
V
V
Quick reference data
Parameter
Conditions
Min
Typ
Max
Unit
TDA8024
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 4.0 — 3 June 2016
2 of 33
NXP Semiconductors
TDA8024
Standard smart card interface
Table 1.
Symbol
General
Quick reference data
…continued
Parameter
Conditions
Min
50
continuous operation;
T
amb
=
25
to +85
C
-
25
Typ
80
-
-
Max
100
0.56
+85
Unit
s
W
C
t
de
P
tot
T
amb
deactivation time
total power dissipation
ambient temperature
5. Ordering information
Table 2.
Ordering information
Package
Name
TDA8024T/C1
TDA8024AT/C1
TDA8024TT/C1
SO28
SO28
TSSOP28
Description
plastic small outline package; 28 leads; body width 7.5 mm
plastic small outline package; 28 leads; body width 7.5 mm
plastic thin shrink small outline package; 28 leads; body width 4.4 mm,
gold wires
plastic thin shrink small outline package; 28 leads; body width 4.4 mm,
copper wire
Version
SOT136-1
SOT136-1
SOT361-1
SOT361-1
Type number
TDA8024TT/C1/S1 TSSOP28
TDA8024
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 4.0 — 3 June 2016
3 of 33
NXP Semiconductors
TDA8024
Standard smart card interface
6. Block diagram
100 nF
100 nF
100 nF
VDD
21
VDD
R1
(1)
VDDP
6
SUPPLY
INTERNAL
REFERENCE
S1
7
S2
5
4 PGND
100 nF
DC/DC CONVERTER
Vref
INTERNAL OSCILLATOR
2.5 MHz
PORADJ 18
R2
VOLTAGE SENSE
EN1 CLKUP
POWER_ON
ALARM
8 VUP
OFF
RSTIN
CMDVCC
5V/3V
23
20
19
3
SEQUENCER
VCC
PVCC GENERATOR
EN2
17 VCC
100 nF
100 nF
14 CGND
EN5
RST
BUFFER
16
RST
CLKDIV1
CLKDIV2
1
2
CLOCK
CIRCUITRY
HORSEQ
EN4
CLOCK
BUFFER
15
10
9
CLK
PRES
PRES
CLK
EN3
OSCILLATOR
THERMAL
PROTECTION
XTAL1
XTAL2
24
25
AUX1UC
27
I/O
TRANSCEIVER
13
AUX1
TDA8024
AUX2UC
28
I/O
TRANSCEIVER
12
AUX2
I/OUC
26
I/O
TRANSCEIVER
22
GND
11
I/O
aaa-023220
(1) Optional external resistor bridge. If this bridge is not required pin 18 should be connected to ground; see
Section 8.2.2.
Pin 18
is not connected in the TDA8024AT.
Fig 1.
Block diagram
TDA8024
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 4.0 — 3 June 2016
4 of 33
NXP Semiconductors
TDA8024
Standard smart card interface
7. Pinning information
7.1 Pinning
CLKDIV1
CLKDIV2
5V/3V
PGND
S2
V
DDP
S1
V
UP
PRES
1
2
3
4
5
6
7
8
9
28 AUX2UC
27 AUX1UC
26 I/OUC
25 XTAL2
24 XTAL1
23 OFF
22 GND
21 V
DD
20 RSTIN
19 CMDVCC
18 PORADJ
17 V
CC
16 RST
15 CLK
001aab430
CLKDIV1
CLKDIV2
5V/3V
PGND
S2
V
DDP
S1
V
UP
PRES
1
2
3
4
5
6
7
8
9
28 AUX2UC
27 AUX1UC
26 I/OUC
25 XTAL2
24 XTAL1
23 OFF
22 GND
21 V
DD
20 RSTIN
19 CMDVCC
18 PORADJ
17 V
CC
16 RST
15 CLK
001aab431
TDA8024T
TDA8024TT
PRES 10
I/O 11
AUX2 12
AUX1 13
CGND 14
PRES 10
I/O 11
AUX2 12
AUX1 13
CGND 14
Fig 2.
Pin configuration TDA8024T
Fig 3.
Pin configuration TDA8024TT
CLKDIV1
CLKDIV2
5V/3V
PGND
S2
V
DDP
S1
V
UP
PRES
1
2
3
4
5
6
7
8
9
28 AUX2UC
27 AUX1UC
26 I/OUC
25 XTAL2
24 XTAL1
23 OFF
22 GND
21 V
DD
20 RSTIN
19 CMDVCC
18 n.c.
17 V
CC
16 RST
15 CLK
001aab382
TDA8024AT
PRES 10
I/O 11
AUX2 12
AUX1 13
CGND 14
Fig 4.
Pin configuration TDA8024AT
TDA8024
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 4.0 — 3 June 2016
5 of 33
51mcu
京公网安备 11010802033920号
EEWORLD
