REVISION U
FIG 1
QSE-042-01-X-D-DP-EMX SHOWN
QSE-XXX-01-X-D-DP-EMX-XX
No OF PAIRS
-014, -028, -042
** -056, **-070
(PER ROW)
** SEE NOTE 11
LEAD STYLE
-01: .1380[3.505]
OPTION
-GP: GUIDE POST
*
(SEE FIG 3, SHEET 2)
ASO ONLY (APPLICATION SPECIFIC ORDER)
((No OF POSITIONS / 14) x .7875[20.003]) + .440[11.18] REF
C
*
EM3-GP=NOT TOOLED
((No OF POSITIONS / 14) x .7875[20.003]) + .0100[.254] REF
.793 20.130 REF
02
DO NOT
SCALE FROM
THIS PRINT
.2850 7.239
REF
01
.0225 0.571
REF
6 EQ SPACES
@ .0945 [2.400]
.6250 15.875
REF
C
.1180 2.997
.175 4.45
REF
QSE-20-01-D-EMX-03
SEE NOTE 12
U
"A"
U
PLATING SPECIFICATION
PLATING THICKNESSES ARE FOR
SIGNAL PINS ONLY. FOR GROUND
PLANE THICKNESSES, SEE PP-T-1G13-XX-X.
-F: 3µ" FLASH SELECTIVE GOLD IN CONTACT
AREA MATTE TIN ON TAIL (SEE NOTE 6)
(USE C-162-XX-F & T-1G13-01-F)
-L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT
AREA WITH MATTE TIN ON TAIL
'D'
(USE C-162-XX-L & T-1G13-01-L)
-H: 30µ" HEAVY GOLD IN CONTACT AREA,
3µ" FLASH GOLD ON TAIL
(USE C-162-XX-H & T-1G13-01-G)
-TL: TIN/LEAD (90/10 5%) CONTACT AND TAIL
U
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
(USE C-162-XX-S & T-1G13-01-L)
MATTE TIN ON TAIL
C-162-01-X
.120 3.05 REF
SEE NOTE 5
SEE TABLE 1
EDGE MOUNT THICKNESS
-EM2: .064[1.63] +/-.004 PCB
(USE QSE-20-01-D-EM2-XX & C-162-01-X)
-EM3: (USE QSE-20-01-D-EM3-XX
& C-162-02-X)
SEE NOTE 10
DIFFERENTIAL PAIR
ROW SPECIFICATION
-D: DOUBLE (USE QSE-20-01-D-EMX-XX)
No OF BANKS
QSE-20-01-D-EM2-XX
C-162-02-X
QSE-20-01-D-EM3-XX
.2380 6.045
REF
C
"A"
.7250 18.415
REF
.1545 3.924
.1200 3.048
REF
.0060 0.152
REF
.1370±.0030 3.480±0.08
C
.0920±.0030 2.338±0.076
C
.0890 2.261 REF
T-1G13-01-X
2 MAX SWAY
(TYP)
.0580 1.473 REF
.0660±.0030 1.676±0.076
SECTION "A"-"A"
EDGE MOUNT THICKNESS
-EM2: .064 [1.63] +/-.004 PCB
SECTION "A-A"
EDGE MOUNT THICKNESS
-EM3:
(DIFFERENT AS SHOWN, OTHERWISE
SAME AS -EM2 PCB THICKNESS)
(SEE NOTE 10)
NOTES:
.0400 1.016 REF
.0070 0.178 REF
.1000 2.540 REF
.1600 4.064 REF
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. CONTACT RETENTION: 6 OZ MIN.
3. GROUND PLANE RETENTION: 8 OZ MIN.
4. PARTS ARE MOLD TO POSITION.
5. MAX VARIANCE OF .002[.05].
6. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
7. NOTE DELETED.
8. BOARD THICKNESS TO BE MEASURED FROM SOLDER PAD TO SOLDER PAD.
9. SEE http://www.samtec.com/processing/edgemt_tectalk/index.htm
FOR INFORMATION ON PROCESSING EDGE MOUNT PARTS.
10. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY.
PLEASE CONTACT SAMTEC INTERCONNECT PROCESSING GROUP WITH ORDER INQUIRIES
11. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS, PLEASE CONTACT SAMTEC
INTERCONNECT PROCESSING GROUP.
U
12. SIDE WALLS ARE RIBBED AS NECESSARY TO CONTROL BOW.
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
ANGLES
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
TABLE 1
C
.XX: .01[.3]
.XXX: .005[.13]
.XXXX: .0020[.051]
MATERIAL:
2
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Ma il: info @SAMTEC.c o m
c o d e: 55322
DESCRIPTION:
DO NOT SCALE DRAWING
SHEET SCALE: 1.25:1
No OF PAIRS
-014 THRU -042
-056 THRU -070
GND PLANE
COPLANARITY
.004 [.10]
.005[1.27]
ASSEMBLY
BOW
.004 [.10]
.005[1.27]
U
INSULATOR: LCP, UL 94VO
COLOR: BLACK
CONTACT: PHOS BRONZE
GROUND PLANE: PHOS BRONZE
F:\DWG\MISC\MKTG\QSE-XXX-01-X-D-DP-EMX-XX-MKT.SLDDRW
.8mm EDGEMOUNT DIFF PAIR HS SOCKET ASSEMBLY
DWG. NO.
QSE-XXX-01-X-D-DP-EMX-XX
BY:
DEAN P
4/10/2001
SHEET
1
OF
2
REVISION U
.0075 0.191 MAX
LINE WHERE ROUNDED TOP OF CONTACT
TRANSITIONS TO A STRAIGHT BEAM.
DETAIL 'D'
SCALE 10 : 1
FIG 3
-GP OPTION
(SAME AS FIG 1, UNLESS OTHERWISE STATED)
(42 POSITION MAX)
(ONLY AVAILABLE WITH -EM2 OPTION)
C
CRITICAL DIMENSION INSPECTION INSTRUCTION TABLE
START-UP INSPECTION
IN-PROCESS INSPECTION
ASSEMBLY OPERATION
INSPECT CODE A
INSPECT CODE B
FILL C-162-XX-X
FILL T-1G13-01-X
"B"
C1, C4
C1, C2, C4
C2, C4
C4
{(NO OF POSITIONS / 14) x .7875[20.003]} + 1.044[26.52] REF
.2070 5.258 REF
"B"
{(NO OF POSITIONS / 14) x .7875[20.003]}
+ .255[5.715] REF
.1400 3.556 REF
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.0700 1.778
.4170 10.592
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Ma il: info @SAMTEC.c o m
c o d e: 55322
DESCRIPTION:
DO NOT SCALE DRAWING
SECTION "B"-"B"
SCALE 1 : 1
F:\DWG\MISC\MKTG\QSE-XXX-01-X-D-DP-EMX-XX-MKT.SLDDRW
.8mm EDGEMOUNT DIFF PAIR HS SOCKET ASSEMBLY
DWG. NO.
SHEET SCALE: 2:1
QSE-XXX-01-X-D-DP-EMX-XX
BY:
DEAN P
4/10/2001
SHEET
2
OF
2
DSP and ARM Processors
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