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S8T14F/883B

Description
Line Driver/Receiver, BIPolar, CDIP16
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size140KB,3 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

S8T14F/883B Overview

Line Driver/Receiver, BIPolar, CDIP16

S8T14F/883B Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T16
JESD-609 codee0
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Maximum output low current0.016 A
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Maximum receive delay30 ns
Filter levelMIL-STD-883 Class B (Modified)
Maximum slew rate72 mA
Nominal supply voltage5 V
surface mountNO
technologyBIPOLAR
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

S8T14F/883B Related Products

S8T14F/883B S8T14W/883B S8T14F/883C S8T14F N8T14FB
Description Line Driver/Receiver, BIPolar, CDIP16 Line Driver/Receiver, BIPolar, CDFP16 Line Driver/Receiver, BIPolar, CDIP16 Line Driver/Receiver, BIPolar, CDIP16 Line Driver/Receiver, BIPolar, CDIP16
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP16,.3 DFP, FL16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown unknown unknown unknown
JESD-30 code R-XDIP-T16 R-XDFP-F16 R-XDIP-T16 R-XDIP-T16 R-XDIP-T16
JESD-609 code e0 e0 e0 e0 e0
Number of terminals 16 16 16 16 16
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 70 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -
Maximum output low current 0.016 A 0.016 A 0.016 A 0.016 A 0.016 A
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DFP DIP DIP DIP
Encapsulate equivalent code DIP16,.3 FL16,.3 DIP16,.3 DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE FLATPACK IN-LINE IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V
Maximum receive delay 30 ns 30 ns 30 ns 30 ns 30 ns
Maximum slew rate 72 mA 72 mA 72 mA 72 mA 72 mA
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V
surface mount NO YES NO NO NO
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Temperature level MILITARY MILITARY MILITARY MILITARY COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE FLAT THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 1 1
Certification status Not Qualified Not Qualified Not Qualified Not Qualified -
Filter level MIL-STD-883 Class B (Modified) MIL-STD-883 Class B (Modified) MIL-STD-883 Class C - -
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