MASK ROM, 1MX8, 200ns, CMOS, PDSO32
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Reach Compliance Code | unknown |
| Maximum access time | 200 ns |
| JESD-30 code | R-PDSO-G32 |
| JESD-609 code | e0 |
| memory density | 8388608 bit |
| Memory IC Type | MASK ROM |
| memory width | 8 |
| Humidity sensitivity level | 3 |
| Number of terminals | 32 |
| word count | 1048576 words |
| character code | 1000000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1MX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP32,.56 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.00005 A |
| Maximum slew rate | 0.06 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| Base Number Matches | 1 |
| KM23C8000CG-20 | KM23C8000CG-15 | KM23C8000CG-12 | KM23C8000C-20 | KM23C8000C-12 | KM23C8000C-15 | |
|---|---|---|---|---|---|---|
| Description | MASK ROM, 1MX8, 200ns, CMOS, PDSO32 | MASK ROM, 1MX8, 150ns, CMOS, PDSO32 | MASK ROM, 1MX8, 120ns, CMOS, PDSO32 | MASK ROM, 1MX8, 200ns, CMOS, PDIP32 | MASK ROM, 1MX8, 120ns, CMOS, PDIP32 | MASK ROM, 1MX8, 150ns, CMOS, PDIP32 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 200 ns | 150 ns | 120 ns | 200 ns | 120 ns | 150 ns |
| JESD-30 code | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDIP-T32 | R-PDIP-T32 | R-PDIP-T32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| Memory IC Type | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 |
| word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| character code | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | SOP | DIP | DIP | DIP |
| Encapsulate equivalent code | SOP32,.56 | SOP32,.56 | SOP32,.56 | DIP32,.6 | DIP32,.6 | DIP32,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A |
| Maximum slew rate | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 40 | 40 | 40 | 40 | 40 | 40 |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| package instruction | - | SOP, SOP32,.56 | SOP, SOP32,.56 | DIP, DIP32,.6 | DIP, DIP32,.6 | DIP, DIP32,.6 |