F9450-15DMGB datasheet, PDF - EEWORLD Datasheet

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F9450-15DMGB: DescriptionIC,MICROPROCESSOR,16-BIT,BIPOLAR,SDIP,64PIN,CERAMIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，56 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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F9450-15DMGB Overview

IC,MICROPROCESSOR,16-BIT,BIPOLAR,SDIP,64PIN,CERAMIC

F9450-15DMGB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Reach Compliance Code	compliant
bit size	16
JESD-30 code	R-XDIP-T64
JESD-609 code	e0
Number of terminals	64
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	SDIP
Encapsulate equivalent code	SDIP64,.6,50
Package shape	RECTANGULAR
Package form	IN-LINE, SHRINK PITCH
power supply	5 V
Certification status	Not Qualified
speed	15 MHz
Maximum slew rate	390 mA
Nominal supply voltage	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.27 mm
Terminal location	DUAL
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC
Base Number Matches	1

F9450-15DMGB Related Products

	F9450-15DMGB	F9450F15GC-MSP	F9450-15DC-MSP	F9450-F18BGC-MSP
Description	IC,MICROPROCESSOR,16-BIT,BIPOLAR,SDIP,64PIN,CERAMIC	IC,MICROPROCESSOR,16-BIT,BIPOLAR,DIP,64PIN,CERAMIC	IC,MICROPROCESSOR,16-BIT,BIPOLAR,SDIP,64PIN,CERAMIC	IC,MICROPROCESSOR,16-BIT,BIPOLAR,DIP,64PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	compliant	compliant	compliant	unknown
bit size	16	16	16	16
JESD-30 code	R-XDIP-T64	R-XDSO-G64	R-XDIP-T64	R-XDSO-G64
JESD-609 code	e0	e0	e0	e0
Number of terminals	64	64	64	64
Maximum operating temperature	125 °C	85 °C	85 °C	85 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	SDIP	SOP	SDIP	SOP
Encapsulate equivalent code	SDIP64,.6,50	GWDIP64,.9,50	SDIP64,.6,50	GWDIP64,.9,50
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE, SHRINK PITCH	SMALL OUTLINE	IN-LINE, SHRINK PITCH	SMALL OUTLINE
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	MILITARY	OTHER	OTHER	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	1	1	1	1
speed	15 MHz	15 MHz	15 MHz	-
Maximum slew rate	390 mA	350 mA	350 mA	-
Filter level	-	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class B (Modified)

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