IC,MICROPROCESSOR,16-BIT,BIPOLAR,SDIP,64PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Reach Compliance Code | compliant |
| bit size | 16 |
| JESD-30 code | R-XDIP-T64 |
| JESD-609 code | e0 |
| Number of terminals | 64 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC |
| encapsulated code | SDIP |
| Encapsulate equivalent code | SDIP64,.6,50 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B (Modified) |
| speed | 15 MHz |
| Maximum slew rate | 350 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
| Base Number Matches | 1 |
| F9450-15DC-MSP | F9450-15DMGB | F9450F15GC-MSP | F9450-F18BGC-MSP | |
|---|---|---|---|---|
| Description | IC,MICROPROCESSOR,16-BIT,BIPOLAR,SDIP,64PIN,CERAMIC | IC,MICROPROCESSOR,16-BIT,BIPOLAR,SDIP,64PIN,CERAMIC | IC,MICROPROCESSOR,16-BIT,BIPOLAR,DIP,64PIN,CERAMIC | IC,MICROPROCESSOR,16-BIT,BIPOLAR,DIP,64PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | compliant | compliant | compliant | unknown |
| bit size | 16 | 16 | 16 | 16 |
| JESD-30 code | R-XDIP-T64 | R-XDIP-T64 | R-XDSO-G64 | R-XDSO-G64 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Number of terminals | 64 | 64 | 64 | 64 |
| Maximum operating temperature | 85 °C | 125 °C | 85 °C | 85 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | SDIP | SDIP | SOP | SOP |
| Encapsulate equivalent code | SDIP64,.6,50 | SDIP64,.6,50 | GWDIP64,.9,50 | GWDIP64,.9,50 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | OTHER | MILITARY | OTHER | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
| Base Number Matches | 1 | 1 | 1 | 1 |
| Filter level | MIL-STD-883 Class B (Modified) | - | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) |
| speed | 15 MHz | 15 MHz | 15 MHz | - |
| Maximum slew rate | 350 mA | 390 mA | 350 mA | - |
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