IC,MICROPROCESSOR,16-BIT,BIPOLAR,DIP,64PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | SOP, GWDIP64,.9,50 |
| Reach Compliance Code | unknown |
| bit size | 16 |
| JESD-30 code | R-XDSO-G64 |
| JESD-609 code | e0 |
| Number of terminals | 64 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC |
| encapsulated code | SOP |
| Encapsulate equivalent code | GWDIP64,.9,50 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B (Modified) |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
| Base Number Matches | 1 |
| F9450-F18BGC-MSP | F9450-15DMGB | F9450F15GC-MSP | F9450-15DC-MSP | F9450-15GC-MSP | F9450-F20DMQB | |
|---|---|---|---|---|---|---|
| Description | IC,MICROPROCESSOR,16-BIT,BIPOLAR,DIP,64PIN,CERAMIC | IC,MICROPROCESSOR,16-BIT,BIPOLAR,SDIP,64PIN,CERAMIC | IC,MICROPROCESSOR,16-BIT,BIPOLAR,DIP,64PIN,CERAMIC | IC,MICROPROCESSOR,16-BIT,BIPOLAR,SDIP,64PIN,CERAMIC | IC,MICROPROCESSOR,16-BIT,BIPOLAR,DIP,64PIN,CERAMIC | IC,MICROPROCESSOR,16-BIT,BIPOLAR,SDIP,64PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| technology | BIPOLAR | CMOS | BIPOLAR | CMOS | CMOS | BIPOLAR |
| Terminal surface | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |