IC,MICROPROCESSOR,16-BIT,BIPOLAR,DIP,64PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| package instruction | , |
| Reach Compliance Code | unknown |
| JESD-609 code | e0 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| technology | CMOS |
| Terminal surface | TIN LEAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |
| F9450-15GC-MSP | F9450-15DMGB | F9450F15GC-MSP | F9450-15DC-MSP | F9450-F20DMQB | F9450-F18BGC-MSP | |
|---|---|---|---|---|---|---|
| Description | IC,MICROPROCESSOR,16-BIT,BIPOLAR,DIP,64PIN,CERAMIC | IC,MICROPROCESSOR,16-BIT,BIPOLAR,SDIP,64PIN,CERAMIC | IC,MICROPROCESSOR,16-BIT,BIPOLAR,DIP,64PIN,CERAMIC | IC,MICROPROCESSOR,16-BIT,BIPOLAR,SDIP,64PIN,CERAMIC | IC,MICROPROCESSOR,16-BIT,BIPOLAR,SDIP,64PIN,CERAMIC | IC,MICROPROCESSOR,16-BIT,BIPOLAR,DIP,64PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| technology | CMOS | CMOS | BIPOLAR | CMOS | BIPOLAR | BIPOLAR |
| Terminal surface | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |