Comparator, 3000uV Offset-Max, BIPolar, CQCC20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | QFN |
| package instruction | QCCN, LCC20,.35SQ |
| Contacts | 20 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Amplifier type | COMPARATOR |
| Maximum bias current (IIB) at 25C | 10 µA |
| Maximum input offset voltage | 3000 µV |
| JESD-30 code | S-XQCC-N20 |
| JESD-609 code | e0 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC20,.35SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5,-5.2 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B (Modified) |
| Maximum slew rate | 76 mA |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| AM687/LMC | 5962-01-234-9305 | AM687AXM | 5962-01-116-6928 | AM687A/LMC | |
|---|---|---|---|---|---|
| Description | Comparator, 3000uV Offset-Max, BIPolar, CQCC20 | Comparator, 3000uV Offset-Max, BIPolar, CDIP16 | Comparator, 3000uV Offset-Max, BIPolar | Comparator, 3000uV Offset-Max, BIPolar, CDIP16 | Comparator, 3000uV Offset-Max, BIPolar, CQCC20 |
| package instruction | QCCN, LCC20,.35SQ | DIP, DIP16,.3 | , DIE OR CHIP | DIP, DIP16,.3 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | compliant | compliant | unknown | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Amplifier type | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR |
| Maximum bias current (IIB) at 25C | 10 µA | 10 µA | 10 µA | 10 µA | 10 µA |
| Maximum input offset voltage | 3000 µV | 3000 µV | 3000 µV | 3000 µV | 3000 µV |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Encapsulate equivalent code | LCC20,.35SQ | DIP16,.3 | DIE OR CHIP | DIP16,.3 | LCC20,.35SQ |
| power supply | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 76 mA | 76 mA | 76 mA | 76 mA | 76 mA |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Is it Rohs certified? | incompatible | incompatible | - | incompatible | incompatible |
| Parts packaging code | QFN | DIP | - | DIP | QFN |
| Contacts | 20 | 16 | - | 16 | 20 |
| JESD-30 code | S-XQCC-N20 | R-XDIP-T16 | - | R-XDIP-T16 | S-XQCC-N20 |
| Number of terminals | 20 | 16 | - | 16 | 20 |
| Package body material | CERAMIC | CERAMIC | - | CERAMIC | CERAMIC |
| encapsulated code | QCCN | DIP | - | DIP | QCCN |
| Package shape | SQUARE | RECTANGULAR | - | RECTANGULAR | SQUARE |
| Package form | CHIP CARRIER | IN-LINE | - | IN-LINE | CHIP CARRIER |
| Filter level | MIL-STD-883 Class B (Modified) | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B | MIL-STD-883 Class B (Modified) |
| surface mount | YES | NO | - | NO | YES |
| Terminal form | NO LEAD | THROUGH-HOLE | - | THROUGH-HOLE | NO LEAD |
| Terminal pitch | 1.27 mm | 2.54 mm | - | 2.54 mm | 1.27 mm |
| Terminal location | QUAD | DUAL | - | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 | - | - |
| Maker | - | AMD | - | AMD | AMD |
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