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AM687AXM

Description
Comparator, 3000uV Offset-Max, BIPolar
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size387KB,8 Pages
ManufacturerAMD
Websitehttp://www.amd.com
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AM687AXM Overview

Comparator, 3000uV Offset-Max, BIPolar

AM687AXM Parametric

Parameter NameAttribute value
package instruction, DIE OR CHIP
Reach Compliance Codeunknown
ECCN codeEAR99
Amplifier typeCOMPARATOR
Maximum bias current (IIB) at 25C10 µA
Maximum input offset voltage3000 µV
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Encapsulate equivalent codeDIE OR CHIP
power supply5,-5.2 V
Certification statusNot Qualified
Maximum slew rate76 mA
technologyBIPOLAR
Temperature levelMILITARY
Base Number Matches1

AM687AXM Related Products

AM687AXM 5962-01-234-9305 AM687/LMC 5962-01-116-6928 AM687A/LMC
Description Comparator, 3000uV Offset-Max, BIPolar Comparator, 3000uV Offset-Max, BIPolar, CDIP16 Comparator, 3000uV Offset-Max, BIPolar, CQCC20 Comparator, 3000uV Offset-Max, BIPolar, CDIP16 Comparator, 3000uV Offset-Max, BIPolar, CQCC20
package instruction , DIE OR CHIP DIP, DIP16,.3 QCCN, LCC20,.35SQ DIP, DIP16,.3 QCCN, LCC20,.35SQ
Reach Compliance Code unknown compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Amplifier type COMPARATOR COMPARATOR COMPARATOR COMPARATOR COMPARATOR
Maximum bias current (IIB) at 25C 10 µA 10 µA 10 µA 10 µA 10 µA
Maximum input offset voltage 3000 µV 3000 µV 3000 µV 3000 µV 3000 µV
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C
Encapsulate equivalent code DIE OR CHIP DIP16,.3 LCC20,.35SQ DIP16,.3 LCC20,.35SQ
power supply 5,-5.2 V 5,-5.2 V 5,-5.2 V 5,-5.2 V 5,-5.2 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 76 mA 76 mA 76 mA 76 mA 76 mA
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY
Base Number Matches 1 1 1 - -
Is it Rohs certified? - incompatible incompatible incompatible incompatible
Maker - AMD - AMD AMD
Parts packaging code - DIP QFN DIP QFN
Contacts - 16 20 16 20
JESD-30 code - R-XDIP-T16 S-XQCC-N20 R-XDIP-T16 S-XQCC-N20
Number of terminals - 16 20 16 20
Package body material - CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code - DIP QCCN DIP QCCN
Package shape - RECTANGULAR SQUARE RECTANGULAR SQUARE
Package form - IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER
Filter level - 38535Q/M;38534H;883B MIL-STD-883 Class B (Modified) 38535Q/M;38534H;883B MIL-STD-883 Class B (Modified)
surface mount - NO YES NO YES
Terminal form - THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD
Terminal pitch - 2.54 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location - DUAL QUAD DUAL QUAD
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